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    MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDING SAME
    21.
    发明申请
    MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDING SAME 有权

    公开(公告)号：US20210075124A1

    公开(公告)日：2021-03-11

    申请号：US17063929

    申请日：2020-10-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwanghyun BAEK ,  Seungtae KO ,  Kijoon KIM ,  Juho SON ,  Sangho LEE ,  Youngju LEE ,  Jungyub LEE ,  Yonghun CHEON ,  Dohyuk HA

    IPC: H01Q21/06 ,  H05K1/18 ,  H04B7/0413 ,  H01Q1/42 ,  H01Q1/24

    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

    ELECTRONIC DEVICE INCLUDING INTERPOSING BOARD FOR ANTENNA
    25.
    发明公开
    ELECTRONIC DEVICE INCLUDING INTERPOSING BOARD FOR ANTENNA 审中-公开

    公开(公告)号：US20230216180A1

    公开(公告)日：2023-07-06

    申请号：US18185085

    申请日：2023-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Juneseok LEE ,  Kwanghyun BAEK ,  Dohyuk HA ,  Jungho PARK ,  Sangho LEE ,  Youngju LEE ,  Wuseong LEE

    IPC: H01Q1/24 ,  H01Q1/22

    CPC classification number: H01Q1/246 ,  H01Q1/2283

    Abstract: A 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE) is provided. The radio unit (RU) device includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed, a second PCB on which a radio frequency integrated circuit (RFIC) is disposed, and a third PCB configured to electrically connect each of the plurality of antenna elements and the RFIC between the first PCB and the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.

    PRINTED CIRCUIT BOARD INCLUDING COAXIAL PLATED THROUGH HOLE AND ELECTRONIC APPARATUS INCLUDING SAME IN WIRELESS COMMUNICATION SYSTEM
    26.
    发明申请
    PRINTED CIRCUIT BOARD INCLUDING COAXIAL PLATED THROUGH HOLE AND ELECTRONIC APPARATUS INCLUDING SAME IN WIRELESS COMMUNICATION SYSTEM 有权

    公开(公告)号：US20230022995A1

    公开(公告)日：2023-01-26

    申请号：US17957316

    申请日：2022-09-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwanghyun BAEK ,  Juneseok LEE ,  Dohyuk HA ,  Youngju LEE ,  Jinsu HEO

    IPC: H05K1/11 ,  H04M1/02 ,  H05K1/02

    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.

    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
    27.
    发明申请
    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20220109249A1

    公开(公告)日：2022-04-07

    申请号：US17496326

    申请日：2021-10-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Juneseok LEE ,  Jinsu HEO ,  Youngsub KIM ,  Jungho PARK ,  Kwanghyun BAEK ,  Youngju LEE ,  Kyoungho JEONG ,  Dohyuk HA

    IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q1/24

    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.

    ANTENNA MODULE INCLUDING INSULATOR, AND BASE STATION INCLUDING SAME ANTENNA MODULE
    28.
    发明申请
    ANTENNA MODULE INCLUDING INSULATOR, AND BASE STATION INCLUDING SAME ANTENNA MODULE 有权

    公开(公告)号：US20210098863A1

    公开(公告)日：2021-04-01

    申请号：US15733363

    申请日：2019-01-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwanghyun BAEK ,  Junsig KUM ,  Youngju LEE ,  Jungyub LEE ,  Yonghun CHEON

    IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q1/42 ,  H01Q21/00

    Abstract: The present invention relates to: a communication technique for converging an IoT technology with a 5G communication system for supporting a higher data transfer rate beyond the 4G system; and a system therefor. The present invention provides an antenna module including at least one antenna array, wherein the antenna array comprises: a first insulator having a shape of a plate and having a conductive pattern formed thereon to allow the flow of an electrical signal; a first radiator disposed such that the lower end surface thereof is spaced a predetermined first length apart from the upper end surface of the first insulator; a second radiator spaced a predetermined second length apart from the first radiator on a horizontal plane on which the first radiator is disposed; at least one feeder unit electrically connected to the conductive pattern to supply an electrical signal to the first radiator and the second radiator; and a second insulator disposed on the upper end surface of the first insulator to fix the at least one feeder unit such that the at least one feeder unit is spaced a predetermined third length apart from the lower end surface of the horizontal plane on which the first radiator and the second radiator are arranged.

    MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDING SAME
    29.
    发明申请
    MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDING SAME 有权

    公开(公告)号：US20210075123A1

    公开(公告)日：2021-03-11

    申请号：US17063918

    申请日：2020-10-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwanghyun BAEK ,  Seungtae KO ,  Kijoon KIM ,  Juho SON ,  Sangho LEE ,  Youngju LEE ,  Jungyub LEE ,  Yonghun CHEON ,  Dohyuk HA

    IPC: H01Q21/06 ,  H05K1/18 ,  H04B7/0413 ,  H01Q1/42 ,  H01Q1/24

    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

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