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公开(公告)号：US20230132490A1
公开(公告)日：2023-05-04
申请号：US18147270
申请日：2022-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok LEE , Junsig KUM , Kwanghyun BAEK , Dohyuk HA , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号：US20200328500A1
公开(公告)日：2020-10-15
申请号：US16844706
申请日：2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Dohyuk HA , Youngju LEE , Jungyub LEE , Juneseok LEE , Jinsu HEO
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.
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公开(公告)号：US20230387598A1
公开(公告)日：2023-11-30
申请号：US18446906
申请日：2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
CPC classification number: H01Q9/0457 , H01Q9/0414 , H01Q21/065
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
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公开(公告)号：US20230275361A1
公开(公告)日：2023-08-31
申请号：US18313727
申请日：2023-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H01Q1/24 , H01Q1/42 , H04B7/0413 , H05K1/18
CPC classification number: H01Q21/065 , H01Q1/246 , H01Q1/42 , H04B7/0413 , H05K1/181 , H05K9/0049
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20230187833A1
公开(公告)日：2023-06-15
申请号：US18164184
申请日：2023-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Youngsub KIM , Jinhoon KIM , Chunmyung PARK , Youngju LEE , Juneseok LEE , Wangi CHA , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
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Patent Agency Ranking
公开(公告)号：US20230163488A1
公开(公告)日：2023-05-25
申请号：US18152311
申请日：2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号：US20230099560A1
公开(公告)日：2023-03-30
申请号：US17754893
申请日：2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dohyuk HA , Kwanghyun BAEK , Juneseok LEE , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
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公开(公告)号：US20170249541A1
公开(公告)日：2017-08-31
申请号：US15438168
申请日：2017-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Nikolay OLYUNIN , Junsig KUM , Youngju LEE , Jung Yub LEE , Dohyuk HA
CPC classification number: G06K19/06206 , G06K7/084 , G06K19/06196
Abstract: A magnetic stripe transmission (MST) apparatus that improves a recognition rate and operates at a low current is provided. The apparatus includes a first coil disposed between a first power supply source and a second power supply source, and wound in a first direction, a second coil connected in parallel to the first coil, disposed between the first power supply source and the second power supply source, and wound in a second direction, a first driver disposed between the first coil and the second power supply source, and configured to control a first current of the first coil according to a first voltage pulse supplied by a first pulse supply source, and a second driver disposed between the second coil and the second power supply source, and configured to control a second current of the second coil according to a second voltage pulse supplied by a second pulse supply source.
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公开(公告)号：US20240266716A1
公开(公告)日：2024-08-08
申请号：US18384156
申请日：2023-10-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Juneseok LEE , Kwanghyun BAEK , Jungyub LEE , Dohyuk HA
CPC classification number: H01Q1/246 , H01Q1/2283 , H01Q9/16 , H01Q21/062
Abstract: A radio unit (RU) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (RFIC); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. The RFIC may be coupled to the first surface of the first substrate. The second substrate may be coupled to the second surface of the first substrate. The plurality of antenna elements may be disposed on the at least one first layer of the second substrate. The plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
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公开(公告)号：US20240056520A1
公开(公告)日：2024-02-15
申请号：US18313722
申请日：2023-05-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Jungho PARK , Kwanghyun BAEK , Jungyub LEE , Juneseok LEE , Dohyuk HA
CPC classification number: H04M1/0277 , H05K1/144 , H05K1/028 , H05K2201/041 , H05K2201/10734 , H05K2201/10098
Abstract: In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.
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