公开(公告)号：US20220122953A1

公开(公告)日：2022-04-21

申请号：US17315596

申请日：2021-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

公开(公告)号：US20210091257A1

公开(公告)日：2021-03-25

申请号：US16822673

申请日：2020-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Sungjin KANG ,  Junsik HWANG ,  Junhee CHOI

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/50 ,  H01L25/075

Abstract: Provided is a display device including a substrate, a transfer guiding mold provided on the substrate and including a plurality of openings, and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guiding mold is less than twice a height of each of the plurality of micro LEDs.

公开(公告)号：US20250133890A1

公开(公告)日：2025-04-24

申请号：US19005626

申请日：2024-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H10H29/14 ,  B82Y20/00 ,  H10H20/01 ,  H10H20/851 ,  H10H20/855

Abstract: A display apparatus includes a driving substrate including a plurality of grooves, micro light-emitting devices provided in the plurality of grooves and configured to emit light of a first color, and a color conversion layer provided on the micro light-emitting devices and configured to convert the light of the first color into light of at least one second color, wherein the color conversion layer includes light blocking patterns spaced apart from the micro light-emitting devices and spaced apart from each other on a same plane, a nano-porous layer provided between adjacent ones of the light blocking patterns, spaced apart from the micro light-emitting devices, and including a plurality of nano-pores, and quantum dots impregnated in the nano-porous layer and configured to convert the light of the first color into the light of the at least one second color.

公开(公告)号：US20250125179A1

公开(公告)日：2025-04-17

申请号：US19002471

申请日：2024-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H10H20/01

Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.

公开(公告)号：US20250006542A1

公开(公告)日：2025-01-02

申请号：US18442908

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Kyungwook HWANG ,  Dongho KIM ,  Joonyong PARK ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68

Abstract: A semiconductor chip wet transfer method includes: preparing a transfer substrate that includes a plurality of recesses; supplying a liquid that includes semiconductor chips onto the plurality of recesses of the transfer substrate; aligning the semiconductor chips in the plurality of recesses by sweeping, with an align bar, an upper surface of the transfer substrate supplied with the liquid; and performing cleaning by removing semiconductor chips that are not aligned in the plurality of recesses by using a first magnetic force generating device disposed facing a lower surface of the transfer substrate.

公开(公告)号：US20230400604A1

公开(公告)日：2023-12-14

申请号：US18196583

申请日：2023-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Dongho KIM ,  Junsik HWANG ,  Sanghoon SONG

IPC: G02B1/00 ,  G02F1/015 ,  H01L33/10 ,  G02B5/20 ,  G02B1/14 ,  G02B3/00

CPC classification number: G02B1/005 ,  G02F1/0151 ,  H01L33/10 ,  G02B2207/107 ,  G02B1/14 ,  G02B3/0037 ,  G02B5/206

Abstract: Disclosed are a color conversion structure, a display apparatus, and a method for manufacturing the color conversion structure. The color conversion structure includes a base, a photonic crystal structure provided on the base, and quantum dots included in the photonic crystal structure. The color conversion structure has a transferable structure.

公开(公告)号：US20230377509A1

公开(公告)日：2023-11-23

申请号：US18085162

申请日：2022-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION

Inventor： Junsik HWANG ,  Geonwook YOO ,  Hojin LEE ,  Yongchan KIM ,  Kyungwook HWANG

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/0426 ,  G09G2310/0275

Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.

公开(公告)号：US20230261163A1

公开(公告)日：2023-08-17

申请号：US18138339

申请日：2023-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/00 ,  H01L33/46

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/46 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A display apparatus and a method of manufacturing the display method are provided. The display apparatus includes a transfer substrate, and micro display elements spaced apart from each other in units of sub-pixels on the transfer substrate, wherein each of the micro display elements includes a micro light emitting unit and a drive unit, wherein the drive unit includes drive electrodes and drives the micro light emitting unit.

公开(公告)号：US20220384676A1

公开(公告)日：2022-12-01

申请号：US17883160

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoyoung AHN ,  Junhee CHOI ,  Kyungwook HWANG ,  Jinjoo PARK

IPC: H01L33/10 ,  H01L33/38 ,  H01L33/50

Abstract: A display device includes a substrate, an emission layer provided on the substrate and a reflective layer provided on the emission layer. The emission layer has an emission region that emits light, the reflective layer has a first opening, the emission region overlaps the first opening in a direction perpendicular to an upper surface of the substrate and a first width of the emission region is smaller than a second width of the first opening.

公开(公告)号：US20220285581A1

公开(公告)日：2022-09-08

申请号：US17526556

申请日：2021-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo HONG ,  Kyungwook HWANG ,  Hyunjoon KIM ,  Junsik HWANG

IPC: H01L33/10 ,  H01L27/15 ,  H01L33/38

Abstract: Provided is a display device including a driving substrate, a barrier layer disposed on an upper surface of the driving substrate and including a plurality of recesses, a micro-semiconductor light emitting device disposed in each of the plurality of recesses, and a side reflective structure disposed in the barrier layer and provided adjacent to a sidewall of each of the plurality of recesses.