METHOD FOR PROCESSING MESSAGE AND ELECTRONIC DEVICE IMPLEMENTING THE SAME

    公开(公告)号:US20200051432A1

    公开(公告)日:2020-02-13

    申请号:US16655269

    申请日:2019-10-17

    Abstract: In an example embodiment, an electronic device includes a communication module comprising communication circuitry, a display, a sound output device comprising sound output circuitry, a processor, and a memory. Instructions stored in the memory, when executed by the processor, causes the electronic device to control the communication module to transmit and/or receive a plurality of pieces of wireless access in vehicular environment (WAVE) information. In addition, the electronic device identifies a plurality of events, based on the plurality of pieces of WAVE information, and generates a plurality of messages related to the plurality of events. The electronic device further determines priorities of the plurality of messages, based on status information of the electronic device, and outputs the plurality of messages based on the determined priorities through at least one of the display and the sound output device.

    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    22.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20150270221A1

    公开(公告)日:2015-09-24

    申请号:US14729264

    申请日:2015-06-03

    Abstract: Semiconductor devices, and methods of fabricating a semiconductor device, include forming a via hole through a first surface of a substrate, the via hole being spaced apart from a second surface facing the first surface, forming a first conductive pattern in the via hole, forming an insulating pad layer on the first surface of the substrate, the insulating pad having an opening exposing the first conductive pattern, performing a thermal treatment on the first conductive pattern to form a protrusion protruding from a top surface of the first conductive pattern toward the opening, and then, forming a second conductive pattern in the opening.

    Abstract translation: 半导体器件以及制造半导体器件的方法包括:通过基板的第一表面形成通孔,所述通孔与面向第一表面的第二表面间隔开,在通孔中形成第一导电图案,形成 在所述基板的第一表面上的绝缘垫层,所述绝缘垫具有暴露所述第一导电图案的开口,对所述第一导电图案进行热处理,以形成从所述第一导电图案的顶表面朝向所述开口突出的突起 ,然后在开口中形成第二导电图案。

    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    24.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20140162449A1

    公开(公告)日:2014-06-12

    申请号:US14094963

    申请日:2013-12-03

    Abstract: Semiconductor devices, and methods of fabricating a semiconductor device, include forming a via hole through a first surface of a substrate, the via hole being spaced apart from a second surface facing the first surface, forming a first conductive pattern in the via hole, forming an insulating pad layer on the first surface of the substrate, the insulating pad having an opening exposing the first conductive pattern, performing a thermal treatment on the first conductive pattern to form a protrusion protruding from a top surface of the first conductive pattern toward the opening, and then, forming a second conductive pattern in the opening.

    Abstract translation: 半导体器件以及制造半导体器件的方法包括:通过基板的第一表面形成通孔,所述通孔与面向第一表面的第二表面间隔开,在通孔中形成第一导电图案,形成 在所述基板的第一表面上的绝缘垫层,所述绝缘垫具有暴露所述第一导电图案的开口,对所述第一导电图案进行热处理,以形成从所述第一导电图案的顶表面朝向所述开口突出的突起 ,然后在开口中形成第二导电图案。

    APPARATUS AND METHOD FOR CHANGING SIZE OF IMAGE

    公开(公告)号:US20240338790A1

    公开(公告)日:2024-10-10

    申请号:US18748867

    申请日:2024-06-20

    CPC classification number: G06T3/40

    Abstract: An electronic device may include: a display module capable of changing the size of a display screen; a memory in which computer-executable instructions are stored; and a processor which accesses the memory and executes the instructions, wherein, when the size of the display screen is changed while displaying an image and a first navigation bar, the processor terminates output of the first navigation bar and initiates output of a second navigation bar; and changes the size of the image while maintaining an image ratio on the display screen.

    ELECTRONIC DEVICE INCLUDING ANTENNA MODULE
    30.
    发明公开

    公开(公告)号:US20240047858A1

    公开(公告)日:2024-02-08

    申请号:US18363273

    申请日:2023-08-01

    CPC classification number: H01Q1/243 H01Q1/36 H04M1/0214

    Abstract: An electronic device is provided. The electronic device includes a first housing including a first plate, a second housing including a second plate, a display disposed on the first plate of the first housing and the second plate of the second housing, a hinge member that is disposed between the first housing and the second housing and that rotatably connects the first housing and the second housing, and an antenna module disposed in the first housing. The first plate includes an antenna seating portion on which the antenna module is seated. The antenna seating portion is formed between a first sidewall part and a second sidewall part that vertically extend from one surface of the first plate and face each other. The antenna module is disposed such that at least a portion faces the first sidewall part and the second sidewall part. The first sidewall part includes a bumpy structure.

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