摘要:
Disclosed is a method for dislodging a mold from a casting formed within the mold. The mold may be removed from the casting by scoring the mold and applying a force sufficient to cause the mold to fracture and break into pieces. Additionally, the mold may be fractured by either explosive charges placed in the mold pack or by high energy pulsations directed at the mold. Once the mold is fractured and broken into various pieces it may then be dislodged from the casting.
摘要:
A method of manufacturing an electronic device comprising a thin film transistor (42), comprises forming a hydrogen-containing layer (22) over a semiconductor layer (10; 20), irradiating the hydrogen-containing layer so as to hydrogenate the semiconductor layer, and then forming electrodes (24; 26, 28) over the semiconductor layer. A short diffusion length and direct path is provided for the hydrogen thus allowing rapid hydrogenation of the semiconductor layer using relatively few, high-fluence laser pulses. The supporting substrate (12) is not heated significantly making the method particularly useful for TFFs on polymer substrates. Crystallisation and hydrogenation of the semiconductor layer can be executed in the same irradiation step.
摘要:
A photodiode (200), for instance a PN or a PIN photodiode, is disclosed. The photodiode receives incident radiation having first and second spectral distributions, where the first spectral distribution is spectrally shifted from the second spectral distribution. The photodiode has a first semiconductor layer (211) capable of absorbing incident radiation (231) having a first spectral distribution without generating a photocurrent, while simultaneously transmitting incident radiation having a second spectral distribution to the intrinsic layer (212) for generating a photocurrent (213). The photodiode may be used in connection with detecting the presence of target molecules that has been labeled with labeling agents, such as fluorophores or quantum dots. The labeling agents are characterized by the Stokes shift and, therefore, they emit fluorescent radiation having the second spectral distribution that is spectrally shifted from the illumination radiation having the first spectral distribution.
摘要:
A system and method for heat treating castings and removing sand cores therefrom. The castings are initially located in indexed positions with their x, y, and z coordinates known. The castings are passed through a heat treatment station typically having a series of nozzles mounted in preset positions corresponding to the known indexed positions of the castings passing through the heat treatment station. The nozzles apply heat to the castings for heat treating the castings and dislodging the sand cores for removal from the castings.
摘要:
An active plate for a liquid crystal display has an insulating layer (76) arranged as a plurality of columns, each insulating layer column overlapping the pixel electrodes (12) of two adjacent columns of pixels. An opaque conductor layer is formed over the substrate and patterned to define column conductors (34) on top of the insulating layer, and source and drain electrodes for the transistor on top of thin film transistor layers (66). Thus, an insulating layer (76) is defined beneath the column conductors (34), so that it lies between the crossing row and column conductors. In addition, the columns of insulating layer (76) overlap adjacent pairs of pixel electrodes (12), so that the column conductors can overlap the pixel electrodes, thereby increasing the pixel aperture. The transparent pixel electrodes (12) are, however, the first layer to be deposited. This gives advantages in process simplification and corresponding cost reduction for manufacture of high quality active matrix LCD (AMLCD) displays.
摘要:
A system and method for heat treating castings and removing sand cores therefrom. The castings are initially located in indexed positions with their x, y, and z coordinates known. The castings are passed through a heat treatment station typically having a series of nozzles mounted in preset positions corresponding to the known indexed positions of the castings passing through the heat treatment station. The nozzles apply heat to the castings for heat treating the castings and dislodging the sand cores for removal from the castings.
摘要:
A method of manufacturing a thin film electronic device comprises applying a first plastic coating (PI-1) directly to a rigid carrier substrate (40) and forming thin film electronic elements (44) over the first plastic coating. A second plastic coating (46) is applied over the thin film electronic elements with electrodes (47) on top, with a portion lying directly over the associated electronic element, spaced by the second plastic coating. The rigid carrier substrate (40) is released from the first plastic coating, by a laser release process. This method enables traditional materials to be used as the base for the electronic element manufacture, for example thin film transistors. The second plastic coating can form part of the known field shielded pixel (FSP) technology.
摘要:
A method of manufacturing a thin film electronic device comprises applying a first plastic coating (PI-1) directly to a rigid carrier substrate (40) and forming thin film electronic elements (44) over the first plastic coating. A second plastic coating (46) is applied over the thin film electronic elements with electrodes (47) on top, with a portion lying directly over the associated electronic element, spaced by the second plastic coating. The rigid carrier substrate (40) is released from the first plastic coating, by a laser release process. This method enables traditional materials to be used as the base for the electronic element manufacture, for example thin film transistors. The second plastic coating can form part of the known field shielded pixel (FSP) technology.