Substrate support member
    21.
    发明授权
    Substrate support member 失效
    基材支撑件

    公开(公告)号:US06464790B1

    公开(公告)日:2002-10-15

    申请号:US09527341

    申请日:2000-03-17

    IPC分类号: C23C1600

    摘要: The present invention generally provides a support member adapted to provide vacuum chucking. In one aspect, a support member having an upper surface having an outer, raised portion defining an inner, recessed portion is provided. The inner recessed portion is in fluid communication with a vacuum supply. The support member may include a plurality of raised support portions having one or more recessed portions adjacent thereto, the raised support portions having equal heights above the recessed portions. The transition between the raised portions and the recessed portions is gradual and the orifices formed by the holes extending through the upper surface of the substrate support are rounded to eliminate sharp edges and rapid changes in height at the upper surface.

    摘要翻译: 本发明通常提供适于提供真空夹紧的支撑构件。 一方面,提供具有上表面的支撑构件,其具有限定内凹部的外凸起部。 内凹部与真空源流体连通。 支撑构件可以包括多个凸起的支撑部分,其具有与其相邻的一个或多个凹部,所述凸起支撑部分在凹部上方具有相同的高度。 凸起部分和凹陷部分之间的过渡是渐进的,并且由延伸穿过衬底支撑件的上表面的孔形成的孔是圆形的,以消除上边缘处的尖锐边缘和高度的快速变化。

    Proximity Head Having a Fluid Resistor
    22.
    发明申请
    Proximity Head Having a Fluid Resistor 有权
    具有流体电阻的接近头

    公开(公告)号:US20130048765A1

    公开(公告)日:2013-02-28

    申请号:US13661969

    申请日:2012-10-26

    IPC分类号: B05B1/00

    摘要: A proximity head defined by a body having a length. The body includes a main bore defined therein and extending along the length. A resistor bore is defined in the body and extends along the length. The resistor bore defined below the main bore. A first plurality of bores defined between the main bore and the resistor bore and a second plurality of bores defined between the resistor bore and an exterior surface of the body. The exterior surface of the body defining a proximity surface of the proximity head.

    摘要翻译: 由具有长度的主体限定的邻近头。 主体包括限定在其中并沿着长度延伸的主孔。 电阻孔定义在主体中并沿着长度延伸。 电阻孔位于主孔下方。 限定在主孔和电阻器孔之间的第一多个孔和限定在电阻器孔和主体的外表面之间的第二多个孔。 主体的外表面限定了邻近头部的接近表面。

    System, method and apparatus for maintaining separation of liquids in a controlled meniscus
    23.
    发明授权
    System, method and apparatus for maintaining separation of liquids in a controlled meniscus 有权
    用于在受控弯液面中保持液体分离的系统,方法和装置

    公开(公告)号:US08313582B2

    公开(公告)日:2012-11-20

    申请号:US13370119

    申请日:2012-02-09

    IPC分类号: B08B3/00

    摘要: A system and method of forming and using a proximity head. The proximity head includes a head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and multiple first discrete holes connected to a corresponding first conduit and arranged in a first row. The second zone including a second flat region and multiple second discrete holes connected to a corresponding second conduit. The inner return zone being disposed between and adjacent to the first zone and the second zone and including multiple inner return discrete holes connected to a corresponding inner return conduit and arranged in an inner return row. The first row and the inner return row are parallel. A portion of an edge of each of the inner return discrete holes is recessed into the head surface.

    摘要翻译: 形成和使用邻近头的系统和方法。 邻近头包括头表面,其包括第一区域,第二区域和内部返回区域。 所述第一区域包括第一平面区域和连接到对应的第一导管并且布置在第一排中的多个第一离散孔。 所述第二区域包括连接到相应的第二导管的第二平坦区域和多个第二离散孔。 所述内部返回区域设置在所述第一区域和所述第二区域之间并且邻近所述第二区域并且包括连接到相应的内部返回管道并布置在内部返回行中的多个内部返回离散孔。 第一行和内部返回行是平行的。 每个内部返回离散孔的边缘的一部分凹入头部表面。

    Hybrid composite wafer carrier for wet clean equipment
    24.
    发明授权
    Hybrid composite wafer carrier for wet clean equipment 失效
    用于湿式清洁设备的混合复合晶片载体

    公开(公告)号:US08146902B2

    公开(公告)日:2012-04-03

    申请号:US11743516

    申请日:2007-05-02

    IPC分类号: B23Q3/00

    摘要: A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.

    摘要翻译: 描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。 载体包括具有开口尺寸的接收基板的框架和用于在开口内支撑基板的多个支撑销,该开口略大于基板,使得基板和开口之间存在间隙。 框架包括复合芯,顶片,底片,顶片和芯之间的芳族聚酰胺织物层,以及在底片和芯之间的第二层芳族聚酰胺织物。 顶片和底片由聚合物材料形成。 还描述了一种制造方法。

    System, method and apparatus for maintaining separation of liquids in a controlled meniscus
    25.
    发明授权
    System, method and apparatus for maintaining separation of liquids in a controlled meniscus 有权
    用于在受控弯液面中保持液体分离的系统,方法和装置

    公开(公告)号:US08141566B2

    公开(公告)日:2012-03-27

    申请号:US11820590

    申请日:2007-06-19

    IPC分类号: B08B3/04

    摘要: A system and method of forming and using a proximity head. The proximity head includes a head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and multiple first discrete holes connected to a corresponding first conduit and arranged in a first row. The second zone including a second flat region and multiple second discrete holes connected to a corresponding second conduit. The inner return zone being disposed between and adjacent to the first zone and the second zone and including multiple inner return discrete hole connected to a corresponding inner return conduit and arranged in an inner return row. The first row and the inner return row are parallel. A portion of an edge of each of the inner return discrete holes is recessed into the head surface.

    摘要翻译: 形成和使用邻近头的系统和方法。 邻近头包括头表面,其包括第一区域,第二区域和内部返回区域。 所述第一区域包括第一平面区域和连接到对应的第一导管并且布置在第一排中的多个第一离散孔。 所述第二区域包括连接到相应的第二导管的第二平坦区域和多个第二离散孔。 内部返回区域设置在第一区域和第二区域之间并且邻近第一区域并且包括连接到相应的内部返回导管并且​​布置在内部返回行中的多个内部返回离散孔。 第一行和内部返回行是平行的。 每个内部返回离散孔的边缘的一部分凹入头部表面。

    Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber
    26.
    发明授权
    Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber 失效
    用于调节半导体晶片处理室中的处理套件的温度的装置

    公开(公告)号:US06795292B2

    公开(公告)日:2004-09-21

    申请号:US09861984

    申请日:2001-05-15

    IPC分类号: H01G2300

    CPC分类号: H01L21/67109 H01L21/67103

    摘要: An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein. The waste ring is disposed over the peripheral flange defining a gap therebetween, and circumscribes the chuck. The collar is chucked to the waste ring, and the waste ring is chucked to a pedestal support. Moreover, the waste ring and pedestal each have a gas delivery system therein for regulating the temperature of the collar.

    摘要翻译: 一种用于减少半导体晶片处理室中副产物形成的装置。 在第一实施例中,该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘。 套环设置在周边凸缘之上,限定了它们之间的第一间隙,并限制卡盘。 加热器元件嵌入在轴环内并且适于连接到电源。 在第二实施例中,该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘以及嵌入其中的加热器元件的套环。 套环设置在周边凸缘上方以在其间形成间隙并限制卡盘。 此外,其中具有气体输送系统的基座设置在卡盘和轴环的下方。 在第三实施例中,该装置包括具有夹紧电极和径向延伸的周边凸缘,套环和具有嵌入其中的加热器元件的废料环的卡盘。 废环设置在周边凸缘之上,限定了它们之间的间隙,并且围绕卡盘。 将衣领卡在废物环上,将废物环卡在基座支架上。 此外,废环和底座各自具有用于调节套环温度的气体输送系统。

    Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
    27.
    发明授权
    Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas 失效
    制造具有用于分配传热气体的小直径气体分配端口的半导体晶片支撑卡盘装置的方法

    公开(公告)号:US06572814B2

    公开(公告)日:2003-06-03

    申请号:US09866353

    申请日:2001-05-24

    IPC分类号: B22F704

    CPC分类号: H02N13/00 Y10T29/49149

    摘要: A method of fabricating a semiconductor wafer support chuck apparatus having a first sintered layer and a second sintered layer. The method comprising the steps of providing the first sintered layer having a plurality of gas distribution ports and providing the second sintered layer having a plurality of grooves. The first sintered layer is stacked on top of the second sintered layer, where a diffusion bonding layer is disposed between the first sintered layer and the second sintered layer. Thereafter, the stacked first and second sintered layers are resintered such that the diffusion bonding layer joins the first and second sintered layers together to form a semiconductor wafer support apparatus.

    摘要翻译: 一种制造具有第一烧结层和第二烧结层的半导体晶片支撑卡盘装置的方法。 该方法包括以下步骤:提供具有多个气体分配端口的第一烧结层,并提供具有多个凹槽的第二烧结层。 第一烧结层堆叠在第二烧结层的顶部,在第一烧结层和第二烧结层之间设置扩散接合层。 然后,堆叠的第一和第二烧结层重新烧结,使得扩散接合层将第一和第二烧结层与第二烧结层结合在一起形成半导体晶片支撑装置。

    Resilient rotary seal with projecting edge
    28.
    发明授权
    Resilient rotary seal with projecting edge 失效
    具有突出边缘的弹性旋转密封

    公开(公告)号:US5356158A

    公开(公告)日:1994-10-18

    申请号:US985082

    申请日:1992-12-02

    IPC分类号: F16J15/34

    摘要: A seal for preventing leakage around a rotary shaft extending through a structural casing comprising an annular stationary rigid seal secured to the structural casing for surrounding the rotary shaft. The stationary rigid seal has a smooth sealing surface for establishing a seal, and a resilient rotary seal adapted to be secured to the rotary shaft and having an annular projecting edge for contacting the smooth sealing surface under a biased pressure to form a seal in conjunction therewith. The projecting edge is formed by the convergence of inner and outer forward surfaces. A radial surface extends to the inner concentric forward surface from a torque point at its forward cylindrical base. An outer rearward surface extends to the outer concentric forward surface from a pivot point at its rearward cylindrical base. The outer forward surface forms an angle with the central axis of the seal in a plane through the central axis of the seal of from 40.degree. to 60.degree.. The inner concentric forward surface and the outer rearward surface forms angles with the central axis of the seal in a plane through the central axis of the seal which are individually within the range of from 45.degree. to 60.degree.. A line extending in a plane through the central axis of the seal from the pivot point to the projecting edge is within the range of from 16.degree. to 21.degree..

    摘要翻译: 一种用于防止在延伸穿过结构外壳的旋转轴周围泄漏的密封件,该密封件包括固定到结构外壳上用于包围旋转轴的环形静止刚性密封件。 固定的刚性密封件具有用于建立密封件的光滑的密封表面,以及适于固定到旋转轴上且具有环形突出边缘的弹性旋转密封件,用于在偏压下与平滑的密封表面接触以形成与其结合的密封件 。 突出的边缘由内外前方的会聚形成。 径向表面从其前圆柱形基座处的扭矩点延伸到内同心向前表面。 外后表面从其后圆柱形基座处的枢转点延伸到外同心向前表面。 外部前表面在密封件的中心轴线在40°至60°的平面内与密封件的中心轴线形成一个角度。 内同心向前表面和外后表面在密封件的中心轴线的平面内与密封件的中心轴线形成角度,该中心轴线分别在45°至60°的范围内。 从平面穿过密封件的中心轴线从枢轴点延伸到突出边缘的线在16°至21°的范围内。

    Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus
    29.
    发明授权
    Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus 有权
    用于在通过弯液面处理晶片表面时相对于邻近头部基本上均匀的流体流速的装置

    公开(公告)号:US08317966B2

    公开(公告)日:2012-11-27

    申请号:US12367515

    申请日:2009-02-07

    IPC分类号: B29C65/00 B08B3/00

    摘要: Conditioning fluid flow into a proximity head is provided for fluid delivery to a wafer surface. An upper plenum connected to a plurality of down flow bores is supplied by a main bore. The down flow bores provide fluid into the upper plenum, and a resistor bore is connected to the upper plenum. The resistor bore receives a resistor having a shape so as to limit flow of the fluid through the resistor bore. A lower plenum connected to the resistor bore is configured to receive fluid from the resistor bore as limited by the resistor for flow to a plurality of outlet ports extending between the lower plenum and surfaces of the head surface. Fluid flowing through the upper plenum, the resistor bore with the resistor and the lower plenum is substantially conditioned to define a substantially uniform fluid outflow from the plurality of outlet ports, across the width of the proximity head.

    摘要翻译: 提供流体流入邻近头部的调节流体输送到晶片表面。 连接到多个向下流动孔的上部气室由主孔提供。 向下流动孔将流体提供到上部通风室中,并且电阻器孔连接到上部增压室。 电阻器孔接收具有形状以阻止流体流过电阻器孔的电阻器。 连接到电阻器孔的下部增压室被配置为从电阻器孔接收流体,由电阻器限制,以流向在下部增压室和头部表面的表面之间延伸的多个出口端口。 流过上部通风室的流体,具有电阻器和下部增压室的电阻器孔基本上被调节以限定跨过接近头部宽度的多个出口端口的基本均匀的流体流出。

    In situ morphological characterization of foam for a proximity head
    30.
    发明授权
    In situ morphological characterization of foam for a proximity head 有权
    用于邻近头部的泡沫的原位形态学表征

    公开(公告)号:US08246755B2

    公开(公告)日:2012-08-21

    申请号:US12613453

    申请日:2009-11-05

    IPC分类号: B08B7/00 B08B7/04

    CPC分类号: H01L21/67051 H01L21/67057

    摘要: In an example embodiment, a wet system delivers a flow of cleaning foam through a channel in a proximity head to a meniscus interfacing with a semiconductor wafer. The wet system diverts a sample of the flow from the channel through a transparent cell that is connected to the channel by an input passage that leads from the channel to the transparent cell and by an output passage that leads from the transparent cell back to the channel. The wet system illuminates the sample in the transparent cell with an LED from the top or the back and captures an image of the illuminated sample with a CCD camera. The image shows a morphological attribute of the cleaning foam such as bubble diameter or spacing. The wet system generates a statistical characterization from the morphological attribute and adjusts other attributes of the cleaning foam based on the statistical characterization.

    摘要翻译: 在示例性实施例中,湿系统将清洁泡沫流通过邻近头部中的通道传送到与半导体晶片接合的弯液面。 湿式系统将来自通道的流的样本通过透明单元转移,该透明单元通过从通道引导到透明单元的输入通道连接到通道,并且通过从透明单元引导回通道的输出通道 。 湿系统使用顶部或背面的LED照亮透明单元中的样品,并用CCD相机捕获照明样品的图像。 图像显示清洁泡沫的形态属性,例如气泡直径或间距。 湿系统从形态属性生成统计特征,并根据统计特征调整清洗泡沫的其他属性。