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公开(公告)号：US20220285852A1
公开(公告)日：2022-09-08
申请号：US17361356
申请日：2021-06-29
Inventor： Kerui XI , Xuhui PENG , Feng QIN , Tingting CUI , Baiquan LIN
Abstract: Provided are an antenna, a phase shifter, and a communication device. The antenna includes a first metal electrode, a second metal electrode, and a photo-sensitive layer. The first metal electrode and the second metal electrode are respectively located on two opposite sides of the photo-sensitive layer. The first metal electrode includes multiple transmission electrodes. The multiple transmission electrodes are configured to transmit electrical signals. The photo-sensitive layer includes at least one photo-sensitive unit and the at least one photo-sensitive unit overlaps the transmission electrodes. The antenna provides more possibilities for large-scale commercialization.
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公开(公告)号：US20220285807A1
公开(公告)日：2022-09-08
申请号：US17375310
申请日：2021-07-14
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu JIA , Kerui XI , Zhen LIU , Baiquan LIN , Dengming LEI , Feng QIN , Jing WANG , Liping ZHANG
Abstract: Provided are a phase shifter, a preparation method thereof, and an antenna. The phase shifter includes at least one phase shifting unit, and the phase shifting unit includes a microstrip line, a photo-dielectric layer, a ground electrode, and at least one light guiding structure; the microstrip line is located on a side of the photo-dielectric layer, and the ground electrode is located on a side of the photo-dielectric layer facing away from the microstrip line; the light-guiding structure at least partially overlaps the photo-dielectric layer, and the light-guiding structure is configured to guide light into the photo-dielectric layer.
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公开(公告)号：US20220084923A1
公开(公告)日：2022-03-17
申请号：US17532248
申请日：2021-11-22
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Mingyu WANG , Kerui XI , Xuhui PENG , Feng QIN , Jie ZHANG
Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.
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公开(公告)号：US20200333674A1
公开(公告)日：2020-10-22
申请号：US16916169
申请日：2020-06-30
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Jian ZHAO , Ling SHEN , Yongli QIAN , Feng QIN
IPC: G02F1/1362 , G02F1/1368 , G02F1/1343 , G02F1/1339 , H01L27/12
Abstract: Provided are a display panel and a display device. Along a column direction of the matrix, adjacent N rows of sub-pixels form a pixel unit group, N scanning lines of a same pixel unit group are electrically connected, and sub-pixels of the same pixel unit group are electrically connected to different data lines; a length of a first edge of the sub-pixel along the column direction of the matrix is smaller than a length of a second edge along a row direction; along the column direction of the matrix, adjacent N sub-pixels form a pixel unit; among N switch transistors of a same pixel unit, orthographic projections of at least two switch transistors on a preset plane at least partially overlap; among N data lines of the same pixel unit, an orthographic projection of at least one data line overlaps an orthographic projection of at least one pixel electrode.
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公开(公告)号：US20190332219A1
公开(公告)日：2019-10-31
申请号：US16166447
申请日：2018-10-22
Applicant: Shanghai Tianma Micro-electronics Co., Ltd.
Inventor： Xiangjian KONG , Feng QIN , Jine LIU , Lei WANG , Chunmei GAO , Qiongqin MAO
Abstract: A touch-control display panel, driving method, and a touch-control display device are provided. The touch-control display panel includes: a display area including a plurality of pixels; a non-display area; a first substrate; and a second substrate opposing the first substrate. A portion of the first substrate in the first region includes a pixel electrode layer and a first electrode layer. The first electrode layer is located on a side of the pixel electrode layer away from the second substrate and includes a plurality of first electrodes. The pixel electrode layer includes a plurality of pixel electrodes. A touch-control electrode layer is located on a side of the second substrate toward the first substrate and includes a plurality of touch-control electrodes. Along a direction perpendicular to the touch-control display panel, each touch-control electrode of the plurality of the touch-control electrode overlaps with and connects with one or more first electrode of the plurality of the first electrodes.
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Patent Agency Ranking
公开(公告)号：US20190227397A1
公开(公告)日：2019-07-25
申请号：US15950532
申请日：2018-04-11
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Lei WANG , Mingwei ZHANG , Xiangjian KONG , Jine LIU , Feng QIN
IPC: G02F1/1362 , G02F1/1368 , G02F1/1343 , G02F1/1335
CPC classification number: G02F1/136213 , G02F1/133514 , G02F1/133553 , G02F1/134309 , G02F1/13439 , G02F1/136209 , G02F1/136227 , G02F1/136286 , G02F1/1368 , G02F2001/134345 , G02F2201/123 , G02F2202/10 , H01L27/1225 , H01L29/7869
Abstract: A liquid display panel, and a display device are provided. The liquid display panel includes an array substrate. The array substrate includes a base substrate, a plurality of data lines, a plurality of scanning lines, and an auxiliary electrode. The data lines and the scanning lines intersect to form a plurality of pixels arranged in an array. Each pixel includes a first sub-pixel and a second sub-pixel adjacent to each other. Each first sub-pixel includes a first pixel electrode and a first electrode, while each second sub-pixel includes a second pixel electrode. The second sub-pixel has an area larger than the first pixel; and the second pixel electrode has an area larger than the first pixel electrode. At least a portion of the auxiliary electrode and the first electrode overlap with each other to form a first auxiliary capacitance for the first sub-pixel, and an overlap region between the auxiliary electrode and the first electrode extends into the second sub-pixel of a same pixel.
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27.发明公开公开(公告)号：US20230271397A1
公开(公告)日：2023-08-31
申请号：US17826823
申请日：2022-05-27
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhen LIU , Qingsan ZHU , Kerui XI , Xiaobing ZHAO , Huan LI , Fan XU , Danping WANG , Feng QIN
IPC: B32B3/08
Abstract: A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a second film layer as a flexible film layer. The second film layer at least partially wraps the first film layer. The first film layer includes a first surface and a second surface. The second film layer at least includes a first portion located on a side of the first surface away from the second surface, and a second portion and a third portion located on a side of the second surface away from the first surface. The second portion and the third portion are attached on the second surface through a first adhesive layer and a second adhesive layer, respectively. The second portion and the third portion are spaced apart by a gap.
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公开(公告)号：US20230163481A1
公开(公告)日：2023-05-25
申请号：US17668179
申请日：2022-02-09
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu JIA , Kerui XI , Baiquan LIN , Xiaonan HAN , Zuocai YANG , Donghua WANG , Yukun HUANG , Feng QIN
CPC classification number: H01Q21/0075 , H01Q1/48 , H01Q21/0087 , H01Q3/36
Abstract: A liquid crystal antenna and a method for forming a liquid crystal antenna are provided. The liquid crystal antenna includes a first substrate; a second substrate opposite to the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate. A first conductive layer is disposed on a side of the first substrate facing toward the second substrate; a second conductive layer is disposed on a side of the second substrate facing toward the first substrate; the second conductive layer at least includes a plurality of radiation electrodes; an external metal layer is disposed on a side of the first substrate facing away from the liquid crystal layer; and the external metal layer is connected to a fixed potential.
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公开(公告)号：US20230063019A1
公开(公告)日：2023-03-02
申请号：US17455148
申请日：2021-11-16
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Kaidi ZHANG , Baiquan LIN , Wei LI , Yunfei BAI , Kerui XI , Feng QIN
Abstract: A driving circuit, a driving method and a microfluidic substrate are provided. The driving circuit includes a first switching unit, a second switching unit, a reset unit, a first capacitor, and a second capacitor. In a first stage of a driving process of the driving circuit, the first switching unit is turned on, a first voltage signal is transmitted to a first node, the second switching unit is turned on, a second voltage signal is input to an output terminal of the driving circuit, and the driving circuit outputs an AC signal. In a second stage of the driving process, the first switching unit is turned off, the valid signal output by the second scan signal terminal controls the reset unit to be turned on, a third voltage signal is input to the output terminal of the driving circuit for reset, and the driving circuit outputs a DC signal.
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公开(公告)号：US20210351042A1
公开(公告)日：2021-11-11
申请号：US16913020
申请日：2020-06-26
Inventor： Xuhui PENG , Kerui XI , Tingting CUI , Feng QIN , Jie ZHANG
IPC: H01L21/48 , H01L23/498 , H01L23/00 , H01L21/56
Abstract: A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.
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