摘要:
A box for accommodating an electric connection box is provided. The box includes a lower cover which has a plurality of walls for surrounding a space to accommodate the electric connection box toward a predetermined insertion direction, and an upper cover. The plurality of walls includes: a first wall which extends along the insertion direction; second and third walls which extend from the first wall in a direction intersecting the insertion direction and faces each other; a fourth wall which extends from the first, second and third walls at a deep side of the insertion direction so as to support the electric connection box; and a fifth wall which extends from the second and third walls along the insertion direction, and is substantially parallel to the first wall so as to press-sandwich the electric connection box by the first and fifth walls.
摘要:
The optical pickup device according to the present invention includes: a light source which emits a first light at a first wavelength, a second light at a second wavelength and a third light at a third wavelength; an optical path combining unit which combines vectors of the first, second and third light emitted by the light source, and matches optical axes of the first light and the third light; a light collection unit which condenses the light from the optical path combining unit into the optical information storage medium; a diffraction element which diffracts reflected light from the optical information storage medium; a first photo detector, a second photo detector and a third photo detector which receives the diffracted light from the first diffraction element; and a prevention unit formed between the first diffraction element and the first photo detector, the second photo detector and the third photo detector, and which prevents irradiation of + first-order diffracted light diffracted by the first diffraction element into the first photo detector, the second photo detector, and the third photo detector.
摘要:
An electrophotographic image forming apparatus, comprises an electrophotographic photoreceptor; an image forming section for forming a toner image on a surface of the electrophotographic photoreceptor; an intermediate transfer member; a first transferring section for transferring the toner image formed on the surface of the electrophotographic photoreceptor to a surface of the intermediate transfer member; and a second transferring section for transferring the toner image transferred on the surface the intermediate transfer member to a recording medium; wherein the electrophotographic photoreceptor comprises a surface layer forming the surface thereof and containing particles having a number average primary particle diameter of 1 to 300 nm and the surface of the electrophotographic photoreceptor has a hardness of 200 to 350 N/mm2 in universal hardness which is lower than the hardness in universal hardness of the surface of the intermediate transfer member.
摘要翻译:电子照相图像形成装置,包括电子照相感光体; 图像形成部分,用于在电子照相感光体的表面上形成调色剂图像; 中间转印部件; 用于将形成在电子照相感光体的表面上的调色剂图像转印到中间转印部件的表面的第一转印部分; 以及第二转印部分,用于将在中间转印部件的表面上转印的调色剂图像转印到记录介质上; 其中电子照相感光体包括形成其表面的表面层,并含有数均一次粒径为1〜300nm的粒子,电子照相感光体的表面的硬度为200〜350N / mm 2,通用硬度较低 比中间转印部件表面的通用硬度硬度高。
摘要:
An optical path coupling member aligns an optical axis directed to a light condensing member of the first wavelength light having a shortest wavelength with that of the third wavelength light having a longest wavelength. A diffraction element condenses +2nd order diffracted light of the first wavelength light and +1st order diffracted light of the second wavelength light and third wavelength light into a first photodetector, the −2nd order diffracted light of the first wavelength light and −1st order diffracted light of the third wavelength light into a second photodetector, and −1st order diffracted light of the remaining second wavelength light into a photodetector, using ±2nd order diffracted light of the first wavelength light and ±1st order diffracted light of the second wavelength light and third wavelength light as signal light from an optical information recording medium. Consequently, the overall size of the optical pickup apparatus is reduced.
摘要:
An optical path coupling member aligns an optical axis directed to a light condensing member of the first wavelength light having a shortest wavelength with that of the third wavelength light having a longest wavelength. A diffraction element condenses +2nd order diffracted light of the first wavelength light and +1st order diffracted light of the second wavelength light and third wavelength light into a first photodetector, the −2nd order diffracted light of the first wavelength light and −1st order diffracted light of the third wavelength light into a second photodetector, and −1st order diffracted light of the remaining second wavelength light into a photodetector, using ±2nd order diffracted light of the first wavelength light and ±1st order diffracted light of the second wavelength light and third wavelength light as signal light from an optical information recording medium. Consequently, the overall size of the optical pickup apparatus is reduced.
摘要:
There is provided an optical pickup compliant with a three-beam method, a phase difference method, a push-pull method and a three-beam push-pull method, comprising: an emission light source (105) for emitting two or more light components of different wavelengths; a diffraction element (107); a light collector (103); a hologram element (108); a plurality of photodetectors (206); and operation means for performing an operation on outputs of the plurality of photodetectors (206). The plurality of photodetectors (206) are at least eight photodetectors (P1 to P8) which are necessary for the execution of the three-beam method, the phase difference method, and the push-pull method. The operation means includes a switch (212) for switching between a terminal for obtaining a sub signal of the three-beam push-pull method and a terminal for obtaining a tracking signal of the three-beam method.
摘要:
An electrophotographic photoreceptor having an interlayer between an electroconductive support and a photoreceptive layer, wherein the interlayer contains an N-type semiconductive particle and a binder and a Benard cell is formed in the interlayer.
摘要:
A semiconductor device manufacturing system for manufacturing a semiconductor device on a wafer, comprising: a first exposure apparatus for exposing the wafer using a light source while moving the wafer with a predetermined interval; and a second exposure apparatus for exposing the wafer by irradiating a plurality of electron beams on the wafer, the plurality of electron beams having an interval of substantially N times or 1/N times, where N is a natural number, of the predetermined interval.
摘要:
A box includes a first cover and a second cover have engaging mechanisms which engage the one end of the first cover to the one end of the second cover, and have retaining mechanisms which retain the other end of the first cover to the other end of the second cover. The first cover and the second cover are fit to each other in a normal state when the engaging mechanisms are engaged with each other and the retaining mechanisms are retained normally. When an engagement between the engaging mechanisms is in an abnormal state, a projection abuts against at least the other of the one end of the first cover and the one end of the second cover so that a gap is formed and the interior component housed in the internal space can be seen through the gap.
摘要:
A manufacturing method of manufacturing a wafer unit for testing includes forming a plurality of test circuits on a circuit wafer, forming a plurality of circuit pads on a predetermined surface of a connecting wafer, forming a plurality of wafer pads on a rear surface of the connection wafer opposing the predetermined surface, forming a plurality of long via holes to electrically connect the plurality of circuit pads and the plurality of wafer pads, and forming the wafer unit for testing, by overlapping the circuit wafer and the connection wafer to electrically connect the plurality of test circuits and the plurality of circuit pads.