公开(公告)号：US20210144485A1

公开(公告)日：2021-05-13

申请号：US16677622

申请日：2019-11-07

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Li-Chi Tsao ,  Chien-Hsing Lee

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R7/04 ,  H04R7/18 ,  H04R19/00

Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.

公开(公告)号：US20210136483A1

公开(公告)日：2021-05-06

申请号：US16673962

申请日：2019-11-05

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Cheng-Wei Tsai ,  Chien-Hsing Lee

IPC: H04R1/24 ,  B81B3/00 ,  H04R3/00

Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.

公开(公告)号：US10390145B1

公开(公告)日：2019-08-20

申请号：US15943637

申请日：2018-04-02

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Cheng-Wei Tsai ,  Chien-Hsing Lee

IPC: H04R19/04 ,  H04R1/08 ,  B81C1/00

Abstract: A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.

公开(公告)号：US20180115836A1

公开(公告)日：2018-04-26

申请号：US15335420

申请日：2016-10-26

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B2201/0257 ,  B81C1/00984 ,  H04R31/003 ,  H04R2201/003

Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.

公开(公告)号：US09955268B2

公开(公告)日：2018-04-24

申请号：US14328727

申请日：2014-07-11

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai ,  Jhyy-Cheng Liou

IPC: B81B7/00 ,  H04R23/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0006 ,  B81B7/0058 ,  B81B2201/0257 ,  H04R23/006 ,  H04R2201/003 ,  H04R2460/11

Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.

公开(公告)号：US20150147841A1

公开(公告)日：2015-05-28

申请号：US14092929

申请日：2013-11-28

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: B81C1/00

CPC classification number: B81C1/00928 ,  B81C1/00476

Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.

Abstract translation: 一种在半成品阶段释放微电子机械系统（MEMS）装置的隔膜的方法。 该方法包括将预先润湿溶液中的MEMS器件预润湿至少预先润湿MEMS器件的空腔的侧壁表面。 然后，执行在预先润湿MEMS器件的步骤之后的润湿过程，以蚀刻用于保持隔膜的电介质层的电介质材料，其中隔膜的感测部分从电介质层释放。

公开(公告)号：US20150132880A1

公开(公告)日：2015-05-14

申请号：US14603371

申请日：2015-01-23

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/00 ,  B81B3/0013 ,  B81B7/00 ,  B81B2201/0257 ,  B81C1/00 ,  B81C1/00952 ,  H04R19/005 ,  H04R2201/003

Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.

Abstract translation: 制造MEMS器件的方法包括提供硅衬底。 在硅衬底的第一侧上形成结构介电层。 结构元件嵌入在结构介电层中。 结构元件包括设置在硅衬底上的导电背板，在导电背板的顶部上具有通气孔和突出结构; 和隔膜位于导电背板上方一段距离。 在隔膜和导电背板之间形成一个室。 在第二侧的硅衬底中形成腔体。 空腔对应于结构元件。 对结构介电层的电介质材料进行各向同性蚀刻以释放结构元件。 隔膜的第一侧被室暴露，并面向导电背板的突出结构。 隔膜的第二面暴露于环境空间。