Abstract:
A sensing device for sensing a condition of a plasma processing system component. The sensing device includes a main body configured to contain a material, an emitter contained in the main body and configured to emit light when exposed to a plasma, and a mating feature connected to the main body and configured to be mated with a receiving feature of an object in the plasma processing system such that the emitter material is exposed to a processing environment of the plasma processing system. When the emitter material is exposed to a plasma, the light emitted from the emitter can be monitored to determine at least one of material accumulation on the system component and erosion of the system component.
Abstract:
A probe cartridge assembly and a multi-probe assembly (10) including a mounting plate having a plurality of the probe cartridge assemblies mounted on the mounting plate. The probe cartridge assembly generally includes a mounting member, a probe insulator (30), a probe (40), a ferrule (50), a lead insulator (60), a retaining member (70), and a wire having an electrical lead. The electrical lead is positioned within a cavity in the ferrule, and an inclined surface of the ferrule is contacted to an inclined surface of the probe within an area defined by the probe insulator and the lead insulator. The probe insulator and the lead insulator are held within an area defined by the mounting member and the retaining member. The retaining member and the mounting member are adjustably mated to each other in order to provide a clamping force to ensure proper electrical interconnection between the electric lead, the ferrule, and the probe.
Abstract:
An asymmetrical focus ring varies the flow-field, which aids in normalizing pressure gradients across the wafer being processed, thereby improving the process. Embodiments of the present invention utilize a focus ring that either (1) contains a pattern of through holes that enhances pumping, or (2) does not contain any such pattern.
Abstract:
An apparatus for processing semiconductors includes a processing chamber including a plurality of chamber walls, a substrate holder, positioned within the processing chamber and configured to support the substrate, and a linear displacement device, coupled between a base wall of the plurality of walls and the substrate holder and configured to move the substrate holder relative to the base wall. A shielding part extending from the substrate holder to be in close parallel relation with at least one of the plurality of walls such that a first area of the processing chamber is substantially shielded from a processing environment to which the substrate is exposed.
Abstract:
An apparatus related to plasma chambers used for processing semiconductor substrates and specifically to improvements in pumping baffle plates used in plasma sources. An apparatus and method for making a baffle plate assembly formed from a modified baffle plate blank wherein a variety of pumping features are formed in the baffle plate blank and opened in a planar material removal operation.
Abstract:
This invention relates to a plasma processing system. A common problem in the manufacture of semiconductors is the maintenance of a constant fluid flow throughout the chamber in which the semiconductors are being etched. The focus ring described herein helps control fluid flow such that all (or substantially all) of a substrate (e.g., semiconductor) surface is exposed to a constant flow of plasma throughout the etching process. An even fluid flow is maintained by adjusting the configuration of a focus ring, a pumping baffle, or a focus ring working with an auxiliary focus ring with respect to the semiconductor surface. By manipulating the position of the focus ring, pumping baffle, and auxiliary focus ring, fluid flow over the surface of the semiconductor can be increased, decreased, or kept stagnant.
Abstract:
The present invention uses hybrid ball-lock devices as an alternate for threaded fasteners. Parts of the fastener exposed directly to the plasma act as a shield for the remaining pieces of the fastener or are used as a material to actually enhance plasma characteristics. The present invention also provides consistent electrical and mechanical contact between parts, without the use of any tools.
Abstract:
An optical window deposition shield including a backing plate having a through hole, and a honeycomb structure having a plurality of adjacent cells configured to allow optical viewing through the honeycomb structure. Each cell of the honeycomb structure has an aspect ratio of length to diameter sufficient to impede a processing plasma from traveling through the full length of the cell. A coupling device configured to couple the honeycomb core structure to the backing plate such that the honeycomb structure is aligned with at least a portion of the through hole in the backing plate. The optical window deposition shield shields the optical viewing window of a plasma processing apparatus from contact with the plasma.
Abstract:
A multi-stop mechanism for providing multiple stop positions between first and second objects that are movable into and out of contact with one another. The multi-stop mechanism of the present invention includes a housing which secures the multi stop mechanism to the first object and/or the second object, a rotatble shaft rotatably mounted to the housing, and plurality of stops located on the rotatable shaft. When the shaft is rotated within the housing, the stops are rotated to different positions relative to the housing. As such, the rotatable shaft positions one of the stops to contact the first or second object that the multi-stop mechanism is not attached to.