公开(公告)号：US20160293226A1

公开(公告)日：2016-10-06

申请号：US15089801

申请日：2016-04-04

Applicant: TDK CORPORATION

Inventor： Susumu TANIGUCHI ,  Hisayuki ABE

IPC: G11B33/14

CPC classification number: G11B33/1426 ,  G11B17/00 ,  G11B25/043 ,  G11B33/1446 ,  G11B33/148

Abstract: A spoiler (40) that is a rectifying component for a magnetic disk device including a flat plate-like plate portion (41) arranged to face a magnetic disk (10), and a support portion (42) that supports the plate portion (41) includes a body portion (401) made of a resin, and a metal plating layer (402) that covers an entire surface of the body portion (401).

Abstract translation: 作为用于磁盘装置的整流部件的扰流器（40），包括布置成面对磁盘（10）的平板状板部分（41）和支撑板部分（41）的支撑部分（42） ）包括由树脂制成的主体部分（401）和覆盖主体部分（401）的整个表面的金属镀层（402）。

公开(公告)号：US20150255401A1

公开(公告)日：2015-09-10

申请号：US14591427

申请日：2015-01-07

Applicant: TDK CORPORATION

Inventor： Miyuki YANAGIDA ,  Makoto ORIKASA ,  Susumu TANIGUCHI ,  Hisayuki ABE

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06537 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Abstract translation: 根据本发明的电子部件模块设置有电子部件，密封电子部件的密封树脂和覆盖密封树脂的表面的金属膜。 密封树脂含有氧化物颗粒的填料。 密封树脂中的填料的一部分暴露于密封树脂的表面。 暴露于密封树脂表面的填料的至少一部分包括从填料的暴露表面延伸到内部的裂纹。 该裂纹填充有构成金属膜的至少一种金属。

公开(公告)号：US20140054768A1

公开(公告)日：2014-02-27

申请号：US13960228

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Makoto ORIKASA ,  Hideyuki SEIKE ,  Yuhei HORIKAWA ,  Hisayuki ABE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/05552

Abstract: The present invention relates to a terminal structure comprising: a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, a height Hbm at which the bump has a maximum diameter (Lbm) is lower than a maximum height Hu of the under-bump metal layer.

Abstract translation: 本发明涉及一种端子结构，包括：基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中在沿着层叠方向的截面中，所述凸块具有最大直径（Lbm）的高度Hbm低于所述凸块下凸块的最大高度Hu， 凸块金属层。

公开(公告)号：US20140041930A1

公开(公告)日：2014-02-13

申请号：US13958966

申请日：2013-08-05

Applicant: TDK CORPORATION

Inventor： Miyuki YANAGIDA ,  Hisayuki ABE

IPC: H05K7/00

CPC classification number: H05K7/00 ,  H01G4/232

Abstract: One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, a metal film disposed on a surface of a mounting part of the first and second terminal electrodes formed on the mounting surface, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces.

Abstract translation: 电子部件的一个方面是电子部件，其包括具有安装面和多个侧面的元件主体，所述电子部件还包括形成在所述安装面上的第一端子电极和所述多个侧面中的一个， 形成在所述安装面上的端子电极和所述多个侧面中的另一个侧面，设置在形成在所述安装面上的所述第一和第二端子电极的安装部的表面上的金属膜，以及至少覆盖 形成在侧面上的第一和第二端子电极的侧面部分的表面的一部分。