-
公开(公告)号:US11782392B2
公开(公告)日:2023-10-10
申请号:US17491284
申请日:2021-09-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Juan Alejandro Herbsommer , Baher S. Haroun
Abstract: A physics cell includes a sealed glass vial that contains a high-purity dipolar gas (e.g., OCS) at a low pressure (e.g., between about 0.01 millibar and 0.2 millibar). The vial can be sealed using a laser cutting process that involves only local heating of the vial that does not denature the bulk of the contained gas. One or more electromagnetically translucent windows or vial-end access points provide access to electromagnetic waves launched or received by one or more electromagnetic antennas at a frequency that is adjusted to match the quantum transition frequency of the gas based on a detected maximum absorption frequency. The glass-vial physics cell can be fabricated at lower cost than physics cells fabricated from bonded wafers. Multiple vials can be joined by a waveguide in an enclosure so that launch and receive antennas can be provided at a single end of the vials.
-
公开(公告)号:US20220317182A1
公开(公告)日:2022-10-06
申请号:US17848383
申请日:2022-06-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun
IPC: G01R31/3177 , G01R31/26 , G01R31/3185 , G01R31/317
Abstract: This disclosure describes a novel method and apparatus for testing TSVs within a semiconductor device. According to embodiments illustrated and described in the disclosure, a TSV may be tested by stimulating and measuring a response from a first end of a TSV while the second end of the TSV held at ground potential. Multiple TSVs within the semiconductor device may be tested in parallel to reduce the TSV testing time according to the disclosure.
-
公开(公告)号:US20220107609A1
公开(公告)日:2022-04-07
申请号:US17491284
申请日:2021-09-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Juan Alejandro Herbsommer , Baher S. Haroun
Abstract: A physics cell includes a sealed glass vial that contains a high-purity dipolar gas (e.g., OCS) at a low pressure (e.g., between about 0.01 millibar and 0.2 millibar). The vial can be sealed using a laser cutting process that involves only local heating of the vial that does not denature the bulk of the contained gas. One or more electromagnetically translucent windows or vial-end access points provide access to electromagnetic waves launched or received by one or more electromagnetic antennas at a frequency that is adjusted to match the quantum transition frequency of the gas based on a detected maximum absorption frequency. The glass-vial physics cell can be fabricated at lower cost than physics cells fabricated from bonded wafers. Multiple vials can be joined by a waveguide in an enclosure so that launch and receive antennas can be provided at a single end of the vials.
-
公开(公告)号:US11221411B2
公开(公告)日:2022-01-11
申请号:US15638255
申请日:2017-06-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Nirmal C. Warke , David P. Magee , Baher S. Haroun
Abstract: Described examples include an integrated circuit having an analog-to-digital converter operable to receive an input signal derived from a light signal and convert the input signal to a digital received signal, the analog-to-digital converter operable to receive the input signal during at least one window. The integrated circuit further has a receiver operable to receive the digital received signal, the receiver operable to determine a distance estimate of an object from which the light signal is reflected based on the digital received signal. In an example, the window locations are chosen to correspond to the locations of maximum slope in the signal.
-
公开(公告)号:US20210102996A1
公开(公告)日:2021-04-08
申请号:US17124062
申请日:2020-12-16
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun
IPC: G01R31/3177 , G01R31/26 , G01R31/3185 , G01R31/317
Abstract: This disclosure describes a novel method and apparatus for testing TSVs within a semiconductor device. According to embodiments illustrated and described in the disclosure, a TSV may be tested by stimulating and measuring a response from a first end of a TSV while the second end of the TSV held at ground potential. Multiple TSVs within the semiconductor device may be tested in parallel to reduce the TSV testing time according to the disclosure.
-
公开(公告)号:US10712387B2
公开(公告)日:2020-07-14
申请号:US16294408
申请日:2019-03-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun , Brian J. Lasher , Anjali Vij
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
Abstract: IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations.
-
27.
公开(公告)号:US10521041B2
公开(公告)日:2019-12-31
申请号:US14825942
申请日:2015-08-13
Applicant: Texas Instruments Incorporated
Inventor: Vadim V. Ivanov , William R. Krenik , Rajarshi Mukhopadhyay , Baher S. Haroun
Abstract: A resonant line driver for driving capacitive-loads includes a driver series-coupled to an energy transfer inductor L1, driving signal energy at a signal frequency through L1. A switch array is controlled to switch L1 between multiple electrodes according to a switching sequence, each electrode characterized by a load capacitance CL. L1 and CL form a resonator circuit in which signal energy cycles between L1 and CL at the signal frequency. The switch array switches L1 between a current electrode and a next electrode at a zero_crossing when signal energy in the energy transfer inductor is at a maximum and signal energy in the load capacitance of the current electrode is at a minimum. An amplitude control loop controls signal energy delivered to the L1CL resonator circuit, and a frequency control loop controls signal frequency/phase. In an example application, the resonant driver provides line drive for a mutual capacitance touch screen.
-
公开(公告)号:US20190195945A1
公开(公告)日:2019-06-27
申请号:US16293896
申请日:2019-03-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun
IPC: G01R31/3177 , G01R31/317 , G01R31/26 , G01R31/3185
CPC classification number: G01R31/3177 , G01R31/26 , G01R31/31723 , G01R31/318505 , G01R31/318577
Abstract: This disclosure describes a novel method and apparatus for testing TSVs within a semiconductor device. According to embodiments illustrated and described in the disclosure, a TSV may be tested by stimulating and measuring a response from a first end of a TSV while the second end of the TSV held at ground potential. Multiple TSVs within the semiconductor device may be tested in parallel to reduce the TSV testing time according to the disclosure.
-
公开(公告)号:US10267855B2
公开(公告)日:2019-04-23
申请号:US15783365
申请日:2017-10-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun , Brian J. Lasher , Anjali Vij
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
Abstract: IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations.
-
公开(公告)号:US10251258B2
公开(公告)日:2019-04-02
申请号:US15195415
申请日:2016-06-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Juan A. Herbsommer , Robert F. Payne , Marco Corsi , Baher S. Haroun , Hassan Ali
Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
-
-
-
-
-
-
-
-
-