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    ENCAPSULATING PACKAGE FOR AN INTEGRATED CIRCUIT
    1.
    发明申请
    ENCAPSULATING PACKAGE FOR AN INTEGRATED CIRCUIT 审中-公开
    封装集成电路的封装

    公开(公告)号：US20140103508A1

    公开(公告)日：2014-04-17

    申请号：US13649896

    申请日：2012-10-11

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Juan A. Herbsommer

    IPC: H01L23/495

    CPC classification number: H01L23/495 ,  H01L23/3135 ,  H01L23/49531 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An apparatus is provided. An integrated circuit or IC is secured to a package housing. The IC has an IC substrate and an epitaxial layer formed over the substrate and having an active region and an upper surface. The upper surface is substantially exposed, and bond pads are formed over the epitaxial layer. Bond fixtures are each secured to and in electrical contact with at least one of the bond pads and with the package housing. A fill formed over at least a portion of the epitaxial layer so as to substantially encapsulate the active region, where the fill has a dielectric constant that is substantially equivalent to the dielectric constant of air. Additionally, the fill has a thickness, where the thickness is sufficiently large enough to confine parasitics of the active region at the upper surface of the epitaxial layer.

    Abstract translation: 提供了一种装置。 集成电路或IC被固定到封装外壳。 IC具有形成在衬底上并具有有源区和上表面的IC衬底和外延层。 上表面基本上暴露，并且在外延层上形成接合焊盘。 粘合固定件各自固定到至少一个接合垫和与包装壳体电接触。 填充物形成在外延层的至少一部分上，以便基本上封装有源区，其中填充物的介电常数基本上等于空气的介电常数。 此外，填充物具有厚度，其中厚度足够大以限制有源区的寄生在外延层的上表面。

    FABRICATING A POWER SUPPLY CONVERTER WITH LOAD INDUCTOR STRUCTURED AS HEAT SINK
    3.
    发明申请
    FABRICATING A POWER SUPPLY CONVERTER WITH LOAD INDUCTOR STRUCTURED AS HEAT SINK 有权
    制造具有负载电感器的电源转换器结构化为散热

    公开(公告)号：US20140245598A1

    公开(公告)日：2014-09-04

    申请号：US14275009

    申请日：2014-05-12

    Applicant: Texas Instruments Incorporated

    Inventor： Juan A. Herbsommer ,  Osvaldo J. Lopez ,  Jonathan A. Noquil ,  David Jauregui ,  Lucian Hriscu

    IPC: H02M3/00

    CPC classification number: H02M3/00 ,  H01R43/26 ,  H02B1/48 ,  H05K7/2039 ,  H05K7/2089 ,  H05K7/209 ,  Y10T29/49002 ,  Y10T29/49073 ,  Y10T29/49117

    Abstract: A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

    Abstract translation: 一种用于制造电源转换器的方法包括由金属套管包围的负载感应器，所述金属套管构造成将电感器转换成散热器，该散热器定位成在套筒表面上和电感器引线上沉积焊膏层。 具有第一厚度的一部分和更大的第二厚度的部分的金属载体被放置在电感器的焊料层上。 第一厚度的载体部分与电感器套筒对准。 第二厚度的载体部分与电感器引线对准。 同步和控制FET并排放置在沉积在与电感器套筒相对的第一厚度的载体部分上的焊料层上。 进行回流，并使焊料层固化。 FET，载体和电感器变得集成，并且FET的未焊接表面和第二厚度的载体部分变得共面。

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