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公开(公告)号：US20190051812A1
公开(公告)日：2019-02-14
申请号：US15671252
申请日：2017-08-08
Applicant: Texas Instruments Incorporated
Inventor： Wei-Yan Shih , Sudhanshu Khanna , Michael Zwerg , Juergen Luebbe , Gregory Allen North , Steven C. Bartling , Leah Trautmann , Scott Robert Summerfelt
IPC: H01L41/107 , B06B1/06 , H01L41/04 , H01L41/047
Abstract: A piezoelectric sensor with: (i) a capacitive element, comprising piezoelectric material; (ii) a pre-conditioning circuit, comprising circuitry for establishing a polarization of the capacitive element in a polarizing mode; and (iii) signal amplification circuitry for providing a piezoelectric-responsive output signal, in response to charge across the capacitive element in a sensing mode.
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公开(公告)号：US09679864B2
公开(公告)日：2017-06-13
申请号：US15293075
申请日：2016-10-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Benjamin Stassen Cook , Juan Alejandro Herbsommer , Matthew David Romig , Steven Alfred Kummerl , Wei-Yan Shih
IPC: H01L21/44 , H01L23/00 , H01L21/768 , H01L23/528 , H01L21/48 , H01L23/552 , H01L23/538 , H01L23/66
CPC classification number: H01L24/27 , H01L21/4867 , H01L21/76838 , H01L23/528 , H01L23/5389 , H01L23/552 , H01L23/66 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/82 , H01L2223/6627 , H01L2224/24998 , H01L2224/2732 , H01L2224/27848 , H01L2224/29026 , H01L2224/29076 , H01L2224/32227 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.
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公开(公告)号：US09630835B2
公开(公告)日：2017-04-25
申请号：US14467616
申请日：2014-08-25
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Stuart M. Jacobsen , Wei-Yan Shih
CPC classification number: B81B7/0051 , B81B2207/07 , B81B2207/097 , B81C1/00333 , B81C1/00349 , B81C1/00396 , B81C1/00523 , B81C1/00666
Abstract: A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.
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Patent Agency Ranking
公开(公告)号：US20170033072A1
公开(公告)日：2017-02-02
申请号：US15293075
申请日：2016-10-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Benjamin Stassen Cook , Juan Alejandro Herbsommer , Matthew David Romig , Steven Alfred Kummerl , Wei-Yan Shih
CPC classification number: H01L24/27 , H01L21/4867 , H01L21/76838 , H01L23/528 , H01L23/5389 , H01L23/552 , H01L23/66 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/82 , H01L2223/6627 , H01L2224/24998 , H01L2224/2732 , H01L2224/27848 , H01L2224/29026 , H01L2224/29076 , H01L2224/32227 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.
Abstract translation: 一种形成封装半导体器件的方法包括提供一种第一半导体管芯（第一管芯），其上具有接合焊盘，其面朝上安装在封装衬底上或引线框架（衬底）的管芯焊盘上，其中衬底包括端子或接触焊盘 （基板焊盘）。 形成第一电介质层，包括印刷第一电介质前体层，该第一电介质前体层包括具有从衬底焊盘延伸到接合焊盘的第一液体载体溶剂的第一油墨。 印刷第一互连前体层，其包括在从衬底焊盘延伸到接合焊盘的第一介电层上方具有第二液体载体的第二油墨。 烧结或固化第一互连前体层至少去除第二液体载体以形成包括将各个衬底焊盘连接到各个焊盘的墨残余物的导电互连。
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公开(公告)号：US20170028439A1
公开(公告)日：2017-02-02
申请号：US14814542
申请日：2015-07-31
Applicant: Texas Instruments Incorporated
Inventor： Wei-Yan Shih , Xiaochen Xu
CPC classification number: B06B1/0629 , B06B1/0292 , B06B1/0622
Abstract: An ultrasonic transducer. The ultrasonic transducer has an interposer having electrical connectivity contacts. The ultrasonic transducer also has an ultrasonic receiver, comprising an array of receiving elements, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer. The ultrasonic transducer also has at least one ultrasonic transmitter, separate from the ultrasonic receiver, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer.
Abstract translation: 超声波换能器。 超声波换能器具有具有电连接触点的插入器。 超声波换能器还具有超声波接收器，该超声波接收器包括接收元件的阵列，其相对于插入器物理地固定并耦合以与插入器的电连接性接触件电连通。 超声波换能器还具有与超声波接收器分离的至少一个超声波发射器，其相对于插入器物理地固定并且耦合以与插入器的电连接触点电连通。
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公开(公告)号：US20150205098A1
公开(公告)日：2015-07-23
申请号：US14672929
申请日：2015-03-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Wei-Yan Shih , Bradley M. Haskett
CPC classification number: G02B27/0006 , B29D11/0074 , B81B7/0077 , C03C17/22 , C03C17/23 , C03C27/02 , G02B26/0833 , Y10T29/49789 , Y10T29/49792
Abstract: Disclosed embodiments demonstrate batch processing methods for producing optical windows for microdevices. The windows protect the active elements of the microdevice from contaminants, while allowing light to pass into and out of the hermetically sealed microdevice package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale.
Abstract translation: 公开的实施例示出了用于生产微型设备的光学窗口的批处理方法。 窗户保护微型设备的有源元件免受污染物的影响，同时允许光线进入和离开密封的微型设备包装。 Windows可以批量生产，通过将多个金属框架融合到单张玻璃板来降低生产成本。 为了允许将窗口焊接在封装的顶部，所公开的实施例在金属框架熔合到玻璃板之后保持没有任何玻璃的金属的唇缘。 几种技术可以实现这一目标，包括在玻璃中的研磨槽以提供间隙，以防止玻璃与外部边缘的金属框架熔合以形成唇缘。 公开的批量处理技术可以利用规模经济的优势来允许更有效的窗口生产。
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公开(公告)号：US08536666B2
公开(公告)日：2013-09-17
申请号：US13670134
申请日：2012-11-06
Applicant: Texas Instruments Incorporated
Inventor： Wei-Yan Shih
IPC: H01L29/84
CPC classification number: H04R19/005 , H01L27/0805 , H04R1/04 , H04R31/00
Abstract: An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.
Abstract translation: 一种集成电路，其包含具有位于集成电路的衬底内的背侧空腔的电容式麦克风。 可以通过介质支撑层在基板的表面上形成通孔，以提供对基板的蚀刻剂的接近以形成背侧空腔。 可以在固定板之后蚀刻背侧空腔，并且通过提供通过可渗透膜的蚀刻剂并通过到基板的通孔形成电容式麦克风的可渗透膜。
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公开(公告)号：US20130064400A1
公开(公告)日：2013-03-14
申请号：US13670134
申请日：2012-11-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Wei-Yan Shih
IPC: H04R1/00
CPC classification number: H04R19/005 , H01L27/0805 , H04R1/04 , H04R31/00
Abstract: An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.
Abstract translation: 一种集成电路，其包含具有位于集成电路的衬底内的背侧空腔的电容式麦克风。 可以通过介质支撑层在基板的表面上形成通孔，以提供对基板的蚀刻剂的接近以形成背侧空腔。 可以在固定板之后蚀刻背侧空腔，并且通过提供通过可渗透膜的蚀刻剂并通过到基板的通孔形成电容式麦克风的可渗透膜。
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