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    ANISOTROPIC PIEZOELECTRIC DEVICE, SYSTEM, AND METHOD
    21.
    发明申请
    ANISOTROPIC PIEZOELECTRIC DEVICE, SYSTEM, AND METHOD 审中-公开

    公开(公告)号：US20180090669A1

    公开(公告)日：2018-03-29

    申请号：US15280096

    申请日：2016-09-29

    Applicant: THE BOEING COMPANY

    Inventor： Keith D. Humfeld ,  Morteza Safai

    IPC: H01L41/193 ,  H01L41/316

    CPC classification number: H01L41/193 ,  H01L41/314 ,  H01L41/316

    Abstract: A micro electromechanical (mem) device includes a first electrode, a second electrode, and a shaped carbon nanotube with a first end and a second end. The first end of the shaped carbon nanotube is conductively connected to the first electrode and the second end is conductively connected to the second electrode. A system for making the device includes a plurality of electrodes placed outside the growth region of a furnace to produce a controlled, time-varying electric field. A controller for the system is connected to a power supply to deliver controlled voltages to the electrodes to produce the electric field. A mixture of gases is passed through the furnace with the temperature raised to cause chemical vapor deposition (CVD) of carbon on a catalyst. The sequentially time-varying electric field parameterizes a growing nanotube into a predetermined shape.

    System and method for a heating operation process control
    23.
    发明授权
    System and method for a heating operation process control 有权

    公开(公告)号：US12138867B2

    公开(公告)日：2024-11-12

    申请号：US17505875

    申请日：2021-10-20

    Applicant: THE BOEING COMPANY

    Inventor： Keith D. Humfeld ,  Geoffrey A. Butler ,  Karl M. Nelson

    IPC: G05B13/02 ,  B29C70/44 ,  B29C70/54 ,  G06N3/08

    Abstract: Heating operation control includes obtaining sensor data indicating measured temperatures within a heating vessel during a heating operation; determining sets of thermal stack parameters. Each set of candidate thermal stack parameters is descriptive of a respective configuration of a thermal stack modeled by a first machine learning model to generate one or more estimated tool temperature values. The thermal stack includes the tool and a part coupled to the tool. Heating operation control also includes determining a temperature profile for the heating operation. The temperature profile is determined, via a second machine learning model, based on the plurality of sets of thermal stack parameters and one or more process specifications of the thermal stack.

    ESTABLISHING ELECTRONICS IN COMPOSITE PARTS BY LOCATING ELECTRONICS ON LAY-UP MANDRELS
    24.
    发明公开
    ESTABLISHING ELECTRONICS IN COMPOSITE PARTS BY LOCATING ELECTRONICS ON LAY-UP MANDRELS 审中-公开

    公开(公告)号：US20240359411A1

    公开(公告)日：2024-10-31

    申请号：US18768167

    申请日：2024-07-10

    Applicant: The Boeing Company

    Inventor： Matthew K. Fay ,  Keith D. Humfeld

    IPC: B29C70/30 ,  B29C70/54 ,  B29L31/30

    CPC classification number: B29C70/305 ,  B29C70/541 ,  B29L2031/3082 ,  B29L2031/3085

    Abstract: A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the method includes causing a flow of the resin between the lay-up surface and the fibers. Yet further, the method includes curing the resin to form a cured resin, where the electronic component and the fibers are located in the cured resin. The composite material includes a resin having a shape based on a surface of a lay-up system. Additionally, the composite material includes fibers contained within the resin. Further, the composite materials includes at least one electronic component. The electronic component of the composite material is located in the resin based on a flow of the resin around the electronic component on the surface of the lay-up.

    Establishing electronics in composite parts by locating electronics on lay-up mandrels
    25.
    发明授权
    Establishing electronics in composite parts by locating electronics on lay-up mandrels 有权

    公开(公告)号：US12064927B2

    公开(公告)日：2024-08-20

    申请号：US16184146

    申请日：2018-11-08

    Applicant: The Boeing Company

    Inventor： Matthew K. Fay ,  Keith D. Humfeld

    IPC: B29C70/30 ,  B29C70/54 ,  B29L31/30

    CPC classification number: B29C70/305 ,  B29C70/541 ,  B29L2031/3082 ,  B29L2031/3085

    Abstract: A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the method includes causing a flow of the resin between the lay-up surface and the fibers. Yet further, the method includes curing the resin to form a cured resin, where the electronic component and the fibers are located in the cured resin. The composite material includes a resin having a shape based on a surface of a lay-up system. Additionally, the composite material includes fibers contained within the resin. Further, the composite materials includes at least one electronic component. The electronic component of the composite material is located in the resin based on a flow of the resin around the electronic component on the surface of the lay-up.

    Systems and methods for accelerated conditioning of composite core sandwich coupons
    26.
    发明授权
    Systems and methods for accelerated conditioning of composite core sandwich coupons 有权

    公开(公告)号：US11703472B2

    公开(公告)日：2023-07-18

    申请号：US16712303

    申请日：2019-12-12

    Applicant: The Boeing Company

    Inventor： Keith D. Humfeld ,  Joseph A. Bolton

    IPC: G01N25/58 ,  G01N17/00 ,  G01N25/56 ,  G01N33/00

    CPC classification number: G01N25/58 ,  G01N17/002 ,  G01N25/56 ,  G01N2033/0083

    Abstract: In an example, a method for accelerated conditioning of a composite core sandwich coupon is described. The method includes setting a first temperature and a first relative humidity level of the conditioning apparatus, wherein a combination of the first temperature and the first relative humidity level correspond to a desired relative humidity level of the plurality of cells of the core layer at room temperature. The method includes maintaining the first temperature and the first relative humidity for a first period, wherein during the first period a core humidity of the plurality of cells in the core layer approaches the first relative humidity level. The method includes determining that the core humidity has reached the first relative humidity level. The method includes, based on determining that the core humidity has reached the first relative humidity level, adjusting the first temperature to a second temperature.

    Multi-wavelength Laser Inspection
    27.
    发明申请
    Multi-wavelength Laser Inspection 有权

    公开(公告)号：US20220178823A1

    公开(公告)日：2022-06-09

    申请号：US17681650

    申请日：2022-02-25

    Applicant: The Boeing Company

    Inventor： Keith D. Humfeld ,  Morteza Safai

    IPC: G01N21/64 ,  G01J3/02 ,  G01J3/44

    Abstract: An example system for inspecting a surface includes a laser, an optical system, a gated camera, and a control system. The laser is configured to emit pulses of light, with respective wavelengths of the pulses of light varying over time. The optical system includes at least one optical element, and is configured to direct light emitted by the laser to points along a scan line one point at a time. The gated camera is configured to record a fluorescent response of the surface from light having each wavelength of a plurality of wavelengths at each point along the scan line. The control system is configured to control the gated camera such that an aperture of the gated camera is open during fluorescence of the surface but closed during exposure of the surface to light emitted by the laser.

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