公开(公告)号：US10345254B2

公开(公告)日：2019-07-09

申请号：US15689195

申请日：2017-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Chang Huang ,  Jui-Mu Cho ,  Chien-Hsun Pan ,  Chun-Chih Lin

IPC: G01N27/26 ,  C25D13/18 ,  C25D13/02 ,  G01N27/416 ,  C25D21/14 ,  C25D21/18 ,  H01L21/66 ,  C25B11/04 ,  C25D3/38

Abstract: Detection methods for an electroplating process are provided. A detection method includes immersing a substrate into an electrolyte solution to perform an electroplating process. The electrolyte solution includes an additive agent. The detection method also includes immersing a detection device into the electrolyte solution. The detection method further includes applying a first alternating current (AC) voltage or direct current (DC) voltage to the detection device to detect the concentration of the additive agent. In addition, the detection method includes applying a combination of a second AC voltage and a second DC voltage to the detection device to inspect the electrolyte solution. An impurity is detected in the electrolyte solution. The detection method also includes replacing the electrolyte solution containing the impurity with another electrolyte solution.

公开(公告)号：US20190136369A1

公开(公告)日：2019-05-09

申请号：US15806729

申请日：2017-11-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Chun-Chih Lin

IPC: C23C14/54 ,  H01L21/285 ,  H01L21/67 ,  C23C14/34 ,  C23C14/35

Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.