公开(公告)号：US11280021B2

公开(公告)日：2022-03-22

申请号：US16277945

申请日：2019-02-15

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  You-Fu Chen ,  Yu-Chi Tsai ,  Chu-Ting Chang

IPC: C25D21/18 ,  H01L21/288 ,  H01L21/66 ,  H01L21/02 ,  H01L21/67 ,  C25D3/38 ,  C25D17/02 ,  C25D21/04 ,  C25D7/12 ,  C25D21/08 ,  C25D17/00 ,  F16K31/50 ,  F16K3/02 ,  F16K31/04

Abstract: A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

公开(公告)号：US11187602B2

公开(公告)日：2021-11-30

申请号：US16399430

申请日：2019-04-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  Tsun-En Kuo

IPC: H01L21/768 ,  G01L5/00 ,  C25D7/12 ,  G01L5/22 ,  C25D17/06 ,  H01L21/68 ,  C25D17/00 ,  H01L21/683

Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. A pressure force applied by the cone against the wafer is detected. Stopping clamping the wafer when the pressure force is higher than a predetermined value.

公开(公告)号：US10692754B2

公开(公告)日：2020-06-23

申请号：US16151184

申请日：2018-10-03

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  Tsun-En Kuo

IPC: H01L21/768 ,  H01L21/321 ,  C25D7/12 ,  C25D3/38 ,  H01L21/66 ,  H01L21/67

Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.

公开(公告)号：US10345254B2

公开(公告)日：2019-07-09

申请号：US15689195

申请日：2017-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Chang Huang ,  Jui-Mu Cho ,  Chien-Hsun Pan ,  Chun-Chih Lin

IPC: G01N27/26 ,  C25D13/18 ,  C25D13/02 ,  G01N27/416 ,  C25D21/14 ,  C25D21/18 ,  H01L21/66 ,  C25B11/04 ,  C25D3/38

Abstract: Detection methods for an electroplating process are provided. A detection method includes immersing a substrate into an electrolyte solution to perform an electroplating process. The electrolyte solution includes an additive agent. The detection method also includes immersing a detection device into the electrolyte solution. The detection method further includes applying a first alternating current (AC) voltage or direct current (DC) voltage to the detection device to detect the concentration of the additive agent. In addition, the detection method includes applying a combination of a second AC voltage and a second DC voltage to the detection device to inspect the electrolyte solution. An impurity is detected in the electrolyte solution. The detection method also includes replacing the electrolyte solution containing the impurity with another electrolyte solution.

公开(公告)号：US12266553B2

公开(公告)日：2025-04-01

申请号：US18171224

申请日：2023-02-17

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  Yu-Chi Tsai

IPC: H01L21/67 ,  B25J9/16 ,  B25J11/00 ,  H01L21/324 ,  H01L21/687

Abstract: A method for annealing a wafer includes loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork; rotating the fork between a heating plate and a cooling plate of the annealing apparatus; outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and providing, by a circuitry of the annealing apparatus, a response in response to the first signal.

公开(公告)号：US11587807B2

公开(公告)日：2023-02-21

申请号：US16297058

申请日：2019-03-08

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  Yu-Chi Tsai

IPC: H01L21/67 ,  B25J9/16 ,  H01L21/324 ,  B25J11/00 ,  H01L21/687

Abstract: An annealing apparatus includes a heater plate and a cooler plate disposed in a chamber, a delivering robot, a sensor and circuitry. The delivering robot is configured to deliver a wafer between the heater plate and the cooler plate in the chamber. The sensor is located on the delivering robot and configured to output a first signal in response to a motion of the delivering robot. The circuitry is coupled to the sensor and configured to detect whether an abnormality of the delivering robot occurs according to the first signal.

公开(公告)号：US12157952B2

公开(公告)日：2024-12-03

申请号：US18309317

申请日：2023-04-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  You-Fu Chen ,  Yu-Chi Tsai ,  Chu-Ting Chang

IPC: C25D21/18 ,  C25D3/38 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D21/04 ,  C25D21/08 ,  C25D21/14 ,  F16K3/02 ,  F16K31/04 ,  F16K31/50 ,  H01L21/02 ,  H01L21/288 ,  H01L21/66 ,  H01L21/67

Abstract: A method of controlling chemical concentration in electrolyte includes measuring the chemical concentration in the electrolyte in a tank, wherein an end of an exhaust pipe is connected to a top of the tank; determining, by a valve moved along a top surface of the tank, a vapor flux through the exhaust pipe based on the measured chemical concentration; rotating, by using a motor connected to a ball screw connected to the valve, the ball screw to move a gate of the valve based on the determined vapor flux; electroplating, using the electrolyte provided by the tank, wafers respectively in a plurality of electroplating cells that are connected to the tank; and recycling the electrolyte to the tank.

公开(公告)号：US11668019B2

公开(公告)日：2023-06-06

申请号：US17700402

申请日：2022-03-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yung-Chang Huang ,  You-Fu Chen ,  Yu-Chi Tsai ,  Chu-Ting Chang

IPC: C25D21/14 ,  H01L21/288 ,  C25D3/38 ,  C25D7/12 ,  C25D21/08 ,  C25D21/18

CPC classification number: C25D21/14 ,  C25D3/38 ,  C25D7/12 ,  C25D21/08 ,  C25D21/18 ,  H01L21/2885

Abstract: A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.