Abstract:
Some embodiments of the present disclosure relate to a flash memory device. The flash memory device includes first and second individual source/drain (S/D) regions spaced apart within a semiconductor substrate. A common S/D region is arranged laterally between the first and second individual S/D regions, and is separated from the first individual S/D region by a first channel region and is separated from the second individual S/D region by a second channel region. An erase gate is arranged over the common S/D. A floating gate is disposed over the first channel region and is arranged to a first side of the erase gate. A control gate is disposed over the floating gate. A wordline is disposed over the first channel region and is spaced apart from the erase gate by the floating gate and the control gate. An upper surface of the wordline is a concave surface.
Abstract:
Some embodiments relate to a memory device with an asymmetric floating gate geometry. A control gate is arranged over a floating gate. An erase gate is arranged laterally adjacent the floating gate, and is separated from the floating gate by a tunneling dielectric layer. A sidewall spacer is arranged along a vertical sidewall of the control gate, and over an upper surface of the floating gate. A portion of the floating gate upper surface forms a “ledge,” or a sharp corner, which extends horizontally past the sidewall spacer. A sidewall of the floating gate forms a concave surface, which tapers down from the ledge towards a neck region within the floating gate. The ledge provides a faster path for tunneling of the electrons through the tunneling dielectric layer compared to a floating gate with a planar sidewall surface. The ledge consequently improves the erase speed of the memory device.
Abstract:
A semiconductor structure of a split gate flash memory cell is provided. The semiconductor structure includes a semiconductor substrate having a source region and a drain region. Further, the semiconductor structure includes a floating gate, a word line, and an erase gate spaced over the semiconductor substrate between the source and drain regions with the floating gate arranged between the word line and the erase gate. The semiconductor structure further includes a first dielectric sidewall region disposed between the word line and the floating gate, as well as a second dielectric sidewall region disposed between the erase and floating gates. A thickness of the first dielectric sidewall region is greater than a thickness of the second dielectric sidewall region. A method of manufacturing the semiconductor structure and an integrated circuit including the semiconductor structure are also provided.