SUBSTRATE PROCESSING APPARATUS
    21.
    发明申请

    公开(公告)号:US20180012781A1

    公开(公告)日:2018-01-11

    申请号:US15713800

    申请日:2017-09-25

    Abstract: A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20170186601A1

    公开(公告)日:2017-06-29

    申请号:US15375295

    申请日:2016-12-12

    Abstract: Disclosed is a substrate processing apparatus including: a holding unit that holds a substrate; a processing liquid supply unit that supplies a processing liquid to the substrate; a cup that includes a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving portion provided above the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, and a groove portion formed in a circumferential direction on an upper surface of the peripheral wall portion, and surrounds the holding unit; and a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the peripheral wall portion.

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