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公开(公告)号:US20210129166A1
公开(公告)日:2021-05-06
申请号:US17037142
申请日:2020-09-29
Applicant: Tokyo Electron Limited
Inventor: Michael Carcasi , Joshua Hooge , Mark Somervell , Hiroyuki Iwaki , Masahide Tadokoro , Masashi Enomoto , Joel Estrella , Yuichiro Kunugimoto
Abstract: In a liquid dispense system, camera images may be utilized to identify puddle edges of a liquid dispensed on a substrate. The camera image may be used to determine the percentage of puddle coverage and puddling non-idealities. The camera within a fluid dispense system may also be utilized to monitor the intensity of wavelengths reflected from a substrate during a spin coating step. The reflected intensity as a function of time as a substrate is spin coated may be used to monitor and characterize a spin coating process. The reflected intensity as a function of time may be compared to other substrates to identify substrate to substrate film thickness variations. The analysis may be based upon peaks and/or troughs of the reflected intensity as a function of time.
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公开(公告)号:US10809620B1
公开(公告)日:2020-10-20
申请号:US16543032
申请日:2019-08-16
Applicant: Tokyo Electron Limited
Inventor: Michael Carcasi , Mark Somervell , Joshua Hooge
IPC: G03F7/16
Abstract: Various embodiments of systems and methods for drain line monitoring are disclosed herein. More specifically, a liquid dispense unit for a coating/developing processing system is provided herein for applying one or more liquid solutions to a substrate disposed within the liquid dispense unit. In the disclosed embodiments, a pH sensor and/or a line particle counter (LPC) is coupled to a drain line of the liquid dispense unit to monitor various parameters of the liquid waste, which is ejected from the substrate and disposed of through the drain line. In some embodiments, measurements obtained from the pH sensor may be used to optimize a develop process by detecting an endpoint of the develop process, avoiding pH shock and/or detecting excursions in the develop process. In some embodiments, measurements obtained from the LPC may additionally or alternatively be used to optimize the develop process.
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公开(公告)号:US10048594B2
公开(公告)日:2018-08-14
申请号:US15048619
申请日:2016-02-19
Applicant: Tokyo Electron Limited
Inventor: Michael Carcasi , Mark Somervell , Carlos Fonseca
IPC: G03F7/20
Abstract: Methods and systems for PS-CAR photoresist simulation are described. In an embodiment, a method includes calibrating initial conditions for a simulation of at least one process parameter of a lithography process using a radiation-sensitive material. In such an embodiment, the radiation-sensitive material includes a first light wavelength activation threshold that controls the generation of acid to a first acid concentration in the radiation-sensitive material and controls generation of photosensitizer molecules in the radiation-sensitive material, and a second light wavelength activation threshold that can excite the photosensitizer molecules in the radiation-sensitive material that results in the acid comprising a second acid concentration that is greater than the first acid concentration, the second light wavelength being different from the first light wavelength. Further, the method may include performing a lithography process using the previously-determined at least one process parameter.
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公开(公告)号:US09978618B2
公开(公告)日:2018-05-22
申请号:US15287877
申请日:2016-10-07
Applicant: Tokyo Electron Limited
Inventor: Mark Somervell , Josh Hooge , Michael Carcasi
IPC: H01L21/00 , H01L21/67 , H01L21/68 , H01L21/687 , H01L21/027
CPC classification number: H01L21/67115 , H01L21/027 , H01L21/67248 , H01L21/67253 , H01L21/67259 , H01L21/68 , H01L21/68742 , H01L21/68764
Abstract: Embodiments of systems and methods for substrate thermal processing using a hot plate with a programmable array of lift devices for multi-bake process optimization are presented. In an embodiment, an apparatus includes a base with an upper surface configured to receive the substrate. The base may include at least one heater for heating the substrate while on or in the vicinity of the base, and a plurality of lift devices configured to selectively extend from the upper surface of the base to support the substrate above the base when extended, and allow the substrate to rest on the upper surface of the base when retracted, each lift device being actuated independently of the other lift devices by an actuating mechanism. Additionally, the apparatus may include a controller for controlling the plurality of actuating mechanisms.
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