公开(公告)号：US11703459B2

公开(公告)日：2023-07-18

申请号：US17037007

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Hiroyuki Iwaki ,  Toyohisa Tsuruda ,  Masahide Tadokoro

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/17 ,  G01N21/3563

CPC classification number: G01N21/9501 ,  H01L22/12 ,  H01L22/24 ,  G01N21/3563 ,  G01N2021/1776 ,  G01N2021/3568

Abstract: Various embodiments of systems and methods for calibrating wafer inspection system modules are disclosed herein. More specifically, the present disclosure provides various embodiments of systems and methods to calibrate the multiple spectral band values obtained from a substrate by a camera system included within a WIS module. In one embodiment, multiple spectral band values are red, green, and blue (RGB) values. As described in more detail below, the calibration methods disclosed herein may use a test wafer having a predetermined pattern of thickness changes or color changes to generate multiple spectral band offset values. The multiple spectral band offset values can be applied to the multiple spectral band values obtained from the substrate to generate calibrated RGB values, which compensate for spectral responsivity differences between camera systems included within a plurality of WIS modules.

公开(公告)号：US11637031B2

公开(公告)日：2023-04-25

申请号：US17037131

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Joshua Hooge ,  Mark Somervell ,  Hiroyuki Iwaki ,  Masahide Tadokoro ,  Masashi Enomoto ,  Joel Estrella ,  Yuichiro Kunugimoto

IPC: H01L21/68 ,  B05D1/00 ,  G06T7/13 ,  G06T7/00 ,  G06T7/73 ,  B05B12/08 ,  G01N21/95 ,  H01L21/67 ,  H01L21/66 ,  G01N21/84

Abstract: Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

公开(公告)号：US20210134637A1

公开(公告)日：2021-05-06

申请号：US17037131

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Joshua Hooge ,  Mark Somervell ,  Hiroyuki Iwaki ,  Masahide Tadokoro ,  Masashi Enomoto ,  Joel Estrella ,  Yuichiro Kunugimoto

IPC: H01L21/68 ,  B05D1/00 ,  G06T7/73 ,  G06T7/13 ,  G06T7/00

Abstract: Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

公开(公告)号：US20210131977A1

公开(公告)日：2021-05-06

申请号：US17037007

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Hiroyuki Iwaki ,  Toyohisa Tsuruda ,  Masahide Tadokoro

IPC: G01N21/95 ,  H01L21/66

Abstract: Various embodiments of systems and methods for calibrating wafer inspection system modules are disclosed herein. More specifically, the present disclosure provides various embodiments of systems and methods to calibrate the multiple spectral band values obtained from a substrate by a camera system included within a WIS module. In one embodiment, multiple spectral band values are red, green, and blue (RGB) values. As described in more detail below, the calibration methods disclosed herein may use a test wafer having a predetermined pattern of thickness changes or color changes to generate multiple spectral band offset values. The multiple spectral band offset values can be applied to the multiple spectral band values obtained from the substrate to generate calibrated RGB values, which compensate for spectral responsivity differences between camera systems included within a plurality of WIS modules.

公开(公告)号：US20210129166A1

公开(公告)日：2021-05-06

申请号：US17037142

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Joshua Hooge ,  Mark Somervell ,  Hiroyuki Iwaki ,  Masahide Tadokoro ,  Masashi Enomoto ,  Joel Estrella ,  Yuichiro Kunugimoto

IPC: B05B12/08 ,  G01N21/95 ,  H01L21/67 ,  H01L21/66

Abstract: In a liquid dispense system, camera images may be utilized to identify puddle edges of a liquid dispensed on a substrate. The camera image may be used to determine the percentage of puddle coverage and puddling non-idealities. The camera within a fluid dispense system may also be utilized to monitor the intensity of wavelengths reflected from a substrate during a spin coating step. The reflected intensity as a function of time as a substrate is spin coated may be used to monitor and characterize a spin coating process. The reflected intensity as a function of time may be compared to other substrates to identify substrate to substrate film thickness variations. The analysis may be based upon peaks and/or troughs of the reflected intensity as a function of time.