公开(公告)号：US20210048749A1

公开(公告)日：2021-02-18

申请号：US16993594

申请日：2020-08-14

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Seiji Nagahara ,  Congque Dinh ,  Mark Somervell

IPC: G03F7/20

Abstract: Substrate processing techniques to alleviate missing contact holes, scummed contact holes and scummed caused bridging are disclosed. In one embodiment, electromagnetic radiation (EMR) absorbing molecules are utilized in a process that uses an initial patterned exposure followed by a flood exposure. In one embodiment, a Photo-Sensitized Chemically-Amplified Resist (PSCAR) resist process is utilized to form contact holes in which an initial exposure and develop process is performed followed by a flood exposure and a second develop process. In another embodiment, a process is utilized in which precursors of EMR absorbing molecules are incorporated into a layer underlying the resist layer. Thus, enhanced formation of EMR absorbing molecules will result at the interface of the resist layer and the underlying layer.

公开(公告)号：US20210018839A1

公开(公告)日：2021-01-21

申请号：US16511211

申请日：2019-07-15

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Ryan Burns ,  Mark Somervell

IPC: G03F7/09 ,  G03F7/38 ,  G03F7/30 ,  G03F7/16 ,  G03F7/20

Abstract: Described herein are technologies to facilitate device fabrication, especially those that involve spin coatings of a substrate. More particularly, technologies described herein facilitate the planarization (i.e., flatness) of spin coatings during the device fabrication to form a uniformly planar film or layer on the substrate. This abstract itself is not intended to limit the scope of this patent. The scope of the present invention is pointed out in the appending claims.

公开(公告)号：US11998945B2

公开(公告)日：2024-06-04

申请号：US17037073

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Joshua Hooge ,  Michael Carcasi ,  Mark Somervell

IPC: B05C11/10 ,  B05C5/02 ,  B05C13/02 ,  B05D1/00 ,  B05D1/26 ,  G05D7/06 ,  H01L21/67

CPC classification number: B05D1/005 ,  B05C5/0225 ,  B05C11/1013 ,  B05C11/1023 ,  B05C13/02 ,  B05D1/26 ,  G05D7/0641 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67253

Abstract: Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.

公开(公告)号：US20210109015A1

公开(公告)日：2021-04-15

申请号：US17037050

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Mark Somervell ,  Joshua Hooge ,  Masahide Tadokoro

IPC: G01N21/31 ,  G01B11/06 ,  G01N21/95 ,  H01L21/67 ,  H01L21/687 ,  G03F7/16

Abstract: A substrate inspection system is provided to monitor characteristics of a substrate, while the substrate is disposed within (or being transferred into/out of) a processing unit of a liquid dispense substrate processing system. The inspection system is integrated within a liquid dispense substrate processing system and includes one or more optical sensors of a reflectometer (such as a spectrometer or laser-based transceiver) configured to obtain spectral data from a substrate. A controller is coupled to receive the spectral data from the optical sensors(s). The one or more optical sensors (or one or more optical fibers coupled to the rest of the optical sensor hardware) are coupled at locations within the substrate processing system. The controller analyzes the spectral data received from the optical sensors(s) to detect characteristic(s) of the substrate including, but not limited to, film thickness (FT), refractive index changes, and associated critical dimension (CD) changes.

公开(公告)号：US20180102265A1

公开(公告)日：2018-04-12

申请号：US15287877

申请日：2016-10-07

Applicant: Tokyo Electron Limited

Inventor： Mark Somervell ,  Josh Hooge ,  Michael Carcasi

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/67115 ,  H01L21/027 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/68742 ,  H01L21/68764

Abstract: Embodiments of systems and methods for substrate thermal processing using a hot plate with a programmable array of lift devices for multi-bake process optimization are presented. In an embodiment, an apparatus includes a base with an upper surface configured to receive the substrate. The base may include at least one heater for heating the substrate while on or in the vicinity of the base, and a plurality of lift devices configured to selectively extend from the upper surface of the base to support the substrate above the base when extended, and allow the substrate to rest on the upper surface of the base when retracted, each lift device being actuated independently of the other lift devices by an actuating mechanism. Additionally, the apparatus may include a controller for controlling the plurality of actuating mechanisms.

公开(公告)号：US20170242344A1

公开(公告)日：2017-08-24

申请号：US15048619

申请日：2016-02-19

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Mark Somervell ,  Carlos Fonseca

IPC: G03F7/20

CPC classification number: G03F7/70516 ,  G03F7/2004 ,  G03F7/2022 ,  G03F7/705 ,  G03F7/70616

Abstract: Methods and systems for PS-CAR photoresist simulation are described. In an embodiment, a method includes calibrating initial conditions for a simulation of at least one process parameter of a lithography process using a radiation-sensitive material. In such an embodiment, the radiation-sensitive material includes a first light wavelength activation threshold that controls the generation of acid to a first acid concentration in the radiation-sensitive material and controls generation of photosensitizer molecules in the radiation-sensitive material, and a second light wavelength activation threshold that can excite the photosensitizer molecules in the radiation-sensitive material that results in the acid comprising a second acid concentration that is greater than the first acid concentration, the second light wavelength being different from the first light wavelength. Further, the method may include performing a lithography process using the previously-determined at least one process parameter.

公开(公告)号：US11456185B2

公开(公告)日：2022-09-27

申请号：US16896655

申请日：2020-06-09

Applicant: Tokyo Electron Limited

Inventor： Ryan Burns ,  Mark Somervell ,  Corey Lemley

IPC: H01L21/321 ,  H01L21/467 ,  H01L21/02

Abstract: In certain embodiments, a method for processing a substrate includes applying a surface treatment to selected surfaces of the substrate. The substrate has a non-planar topography including structures defining recesses. The method further includes depositing a fill material on the substrate by spin-on deposition. The surface treatment directs the fill material to the recesses and away from the selected surfaces to fill the recesses with the fill material without adhering to the selected surfaces. The method further includes removing the surface treatment from the selected surfaces of the substrate and depositing a planarizing film on the substrate by spin-on deposition. The planarizing film is deposited on the selected surfaces and top surfaces of the fill material.

公开(公告)号：US20210303741A1

公开(公告)日：2021-09-30

申请号：US16829416

申请日：2020-03-25

Applicant: Tokyo Electron Limited

Inventor： Ryan Burns ,  Mark Somervell

IPC: G06F30/10

Abstract: Methods used to more accurately predict spin on layer planarization over a patterned topography are provided. Methods are provided for generating a layer critical dimension model. In one embodiment, the critical dimension model is a layer thickness model that more accurately simulates patterned topography trends, as a function of feature dimensions, surrounding pattern density and radial position across the patterned topography. Additional methods are provided for calibrating the layer thickness model over one or more spatial areas to account for radial variations in the patterned topography. Further methods are provided for using one or more calibrated layer thickness models to predict a thickness of a layer (e.g., a spin on coating) as it is being deposited onto a patterned substrate. The methods disclosed herein may facilitate the planarization (i.e., flatness) of spin-on coatings during the device fabrication to form a uniformly planar layer or layer on the substrate.

公开(公告)号：US20210132637A1

公开(公告)日：2021-05-06

申请号：US17037087

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Joshua Hooge ,  Michael Carcasi ,  Mark Somervell

IPC: G05D7/06 ,  H01L21/67

Abstract: Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.

公开(公告)号：US20210071607A1

公开(公告)日：2021-03-11

申请号：US16562844

申请日：2019-09-06

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Mark Somervell

IPC: F02D41/02 ,  F01N11/00

Abstract: Various embodiments of monitoring systems and methods are disclosed herein to monitor particulate accumulation within a bake chamber configured to thermally treat substrates, and determine when the bake chamber requires cleaning. Embodiments of the disclosed monitoring system may generally include one or more sensors to monitor particulate accumulation on one or more inside surfaces of a bake chamber and/or a bake chamber lid assembly, and a controller, which is coupled to receive a sensor output from the one or more sensors and configured to use the sensor output to determine when cleaning is needed. Various types of sensors including, but not limited to, optical sensors, and surface acoustic wave-based sensors may be used in the present disclosure to monitor particulate accumulation inside the bake chamber.