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公开(公告)号：US11703459B2
公开(公告)日：2023-07-18
申请号：US17037007
申请日：2020-09-29
IPC分类号： G01N21/95 , H01L21/66 , G01N21/17 , G01N21/3563
CPC分类号： G01N21/9501 , H01L22/12 , H01L22/24 , G01N21/3563 , G01N2021/1776 , G01N2021/3568
摘要： Various embodiments of systems and methods for calibrating wafer inspection system modules are disclosed herein. More specifically, the present disclosure provides various embodiments of systems and methods to calibrate the multiple spectral band values obtained from a substrate by a camera system included within a WIS module. In one embodiment, multiple spectral band values are red, green, and blue (RGB) values. As described in more detail below, the calibration methods disclosed herein may use a test wafer having a predetermined pattern of thickness changes or color changes to generate multiple spectral band offset values. The multiple spectral band offset values can be applied to the multiple spectral band values obtained from the substrate to generate calibrated RGB values, which compensate for spectral responsivity differences between camera systems included within a plurality of WIS modules.
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公开(公告)号：US11624607B2
公开(公告)日：2023-04-11
申请号：US17037117
申请日：2020-09-29
发明人： Michael Carcasi , Joshua Hooge
摘要： Embodiments of systems and methods for monitoring one or more characteristics of a substrate are disclosed. Various embodiments of utilizing optical sensors (in one embodiment a camera) to provide data regarding characteristics of a fluid dispensed upon the substrate are described. A variety of hardware improvements and methods are provided to improve the collection and analysis of the sensor data. More specifically, a wide variety of hardware related techniques may be utilized, either in combination or singularly, to improve the collection of data using the optical sensor. These hardware techniques may include improvements to the light source, improvements to the optical sensors, the relationship of the physical orientation of the light source to the optical sensor, the selection of certain pixels of the image for analysis, and the relationship of the optical sensor frame rate with the rotational speed of the substrate.
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公开(公告)号：US20210048749A1
公开(公告)日：2021-02-18
申请号：US16993594
申请日：2020-08-14
发明人： Michael Carcasi , Seiji Nagahara , Congque Dinh , Mark Somervell
IPC分类号： G03F7/20
摘要： Substrate processing techniques to alleviate missing contact holes, scummed contact holes and scummed caused bridging are disclosed. In one embodiment, electromagnetic radiation (EMR) absorbing molecules are utilized in a process that uses an initial patterned exposure followed by a flood exposure. In one embodiment, a Photo-Sensitized Chemically-Amplified Resist (PSCAR) resist process is utilized to form contact holes in which an initial exposure and develop process is performed followed by a flood exposure and a second develop process. In another embodiment, a process is utilized in which precursors of EMR absorbing molecules are incorporated into a layer underlying the resist layer. Thus, enhanced formation of EMR absorbing molecules will result at the interface of the resist layer and the underlying layer.
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公开(公告)号：US20210018839A1
公开(公告)日：2021-01-21
申请号：US16511211
申请日：2019-07-15
发明人： Michael Carcasi , Ryan Burns , Mark Somervell
摘要： Described herein are technologies to facilitate device fabrication, especially those that involve spin coatings of a substrate. More particularly, technologies described herein facilitate the planarization (i.e., flatness) of spin coatings during the device fabrication to form a uniformly planar film or layer on the substrate. This abstract itself is not intended to limit the scope of this patent. The scope of the present invention is pointed out in the appending claims.
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公开(公告)号：US11738363B2
公开(公告)日：2023-08-29
申请号：US17341105
申请日：2021-06-07
发明人： Michael Carcasi , Ihsan Simms , Joel Estrella , Antonio Luis Pacheco Rotondaro , Joshua Hooge , Hiroshi Marumoto
CPC分类号： B05C3/04 , B05C11/1002 , B08B3/106 , H01L21/0206 , H01L21/31111 , B05D1/18
摘要： A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.
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公开(公告)号：US20220269177A1
公开(公告)日：2022-08-25
申请号：US17183138
申请日：2021-02-23
IPC分类号： G03F7/16
摘要： A method of processing a plurality of substrates includes loading a substrate onto a coating track, moving the substrate into a module of the coating track, performing a process to modify a film formed over the substrate, and obtaining, at a controller, optical sensor data from an optical sensor. The optical sensor data includes a measurement of a property of the film. The method includes determining a drying metric based on the property of the film, and adjusting a process parameter of the process based on the determined drying metric.
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公开(公告)号：US11168978B2
公开(公告)日：2021-11-09
申请号：US17037111
申请日：2020-09-29
发明人： Michael Carcasi , Joshua Hooge
摘要： Embodiments of systems and methods for monitoring one or more characteristics of a substrate are disclosed. Various embodiments of utilizing optical sensors (in one embodiment a camera) to provide data regarding characteristics of a fluid dispensed upon the substrate are described. A variety of hardware improvements and methods are provided to improve the collection and analysis of the sensor data. More specifically, a wide variety of hardware related techniques may be utilized, either in combination or singularly, to improve the collection of data using the optical sensor. These hardware techniques may include improvements to the light source, improvements to the optical sensors, the relationship of the physical orientation of the light source to the optical sensor, the selection of certain pixels of the image for analysis, and the relationship of the optical sensor frame rate with the rotational speed of the substrate.
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公开(公告)号：US20210285822A1
公开(公告)日：2021-09-16
申请号：US17192520
申请日：2021-03-04
摘要： Various embodiments of systems and methods for monitoring thermal characteristics of substrates, substrate processes and/or substrate processing module components are disclosed herein. More specifically, the present disclosure provides various embodiments of a thermal imaging sensor within various substrate processing modules (e.g., a liquid dispense module, a baking module or combined bake module, an interface block, a wafer inspection system (WIS) module, a plating dispense module or another processing module) of a substrate processing system. By positioning the thermal imaging sensor at various locations within the substrate processing system, the present disclosure enables thermal data to be remotely collected from the substrate surface, a liquid dispensed onto the substrate surface, a processing space surrounding the substrate, or a component included within a substrate processing module (e.g., a liquid dispense nozzle, a spin chuck, a spin coat cup, a cooling arm, a WIS component, a heating component, etc.).
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公开(公告)号：US20210210392A1
公开(公告)日：2021-07-08
申请号：US17037117
申请日：2020-09-29
发明人： Michael Carcasi , Joshua Hooge
摘要： Embodiments of systems and methods for monitoring one or more characteristics of a substrate are disclosed. Various embodiments of utilizing optical sensors (in one embodiment a camera) to provide data regarding characteristics of a fluid dispensed upon the substrate are described. A variety of hardware improvements and methods are provided to improve the collection and analysis of the sensor data. More specifically, a wide variety of hardware related techniques may be utilized, either in combination or singularly, to improve the collection of data using the optical sensor. These hardware techniques may include improvements to the light source, improvements to the optical sensors, the relationship of the physical orientation of the light source to the optical sensor, the selection of certain pixels of the image for analysis, and the relationship of the optical sensor frame rate with the rotational speed of the substrate.
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公开(公告)号：US20210132637A1
公开(公告)日：2021-05-06
申请号：US17037087
申请日：2020-09-29
发明人： Joshua Hooge , Michael Carcasi , Mark Somervell
摘要： Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.
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