Infrared-detecting element and infrared image sensor using the same
    21.
    发明授权
    Infrared-detecting element and infrared image sensor using the same 失效
    红外线检测元件和红外线图像传感器

    公开(公告)号:US07847252B2

    公开(公告)日:2010-12-07

    申请号:US12207744

    申请日:2008-09-10

    IPC分类号: H01L27/14

    摘要: An infrared-detecting element includes: a substrate; a laminated body; an anchor coupling a part of the laminated body with the substrate and supporting the laminated body with a gap above the substrate; and an amplifier provided on the substrate and connected to at least one of the lower electrode and the upper electrode. The laminated body has a lower electrode, an upper electrode, and a piezoelectric film made of aluminum nitride which is provided between the lower electrode and the upper electrode and in which a c-axis is oriented almost perpendicularly to a film plane. The amplifier has a circuit performing conversion into voltage according to a charge generated in the laminated body.

    摘要翻译: 红外线检测元件包括:基板; 层压体; 将所述层叠体的一部分与所述基板连接的支撑体,并且在所述基板的上方具有间隙地支撑所述层叠体; 以及设置在所述基板上并连接到所述下电极和所述上电极中的至少一个的放大器。 层叠体具有下电极,上电极和由氮化铝制成的压电膜,该氮化铝设置在下电极和上电极之间,并且其中c轴几乎垂直于膜平面取向。 放大器具有根据层叠体中产生的电荷而进行电压转换的电路。

    SOLID-STATE IMAGE SENSING DEVICE
    22.
    发明申请
    SOLID-STATE IMAGE SENSING DEVICE 有权
    固态图像传感装置

    公开(公告)号:US20100231770A1

    公开(公告)日:2010-09-16

    申请号:US12278347

    申请日:2008-06-05

    IPC分类号: H04N5/335

    CPC分类号: H04N9/045 G06T3/4015

    摘要: A solid-state image sensing device has a plurality of pixels, a read-out circuit for reading out electric signals obtained by the photoelectric conversion element, and a signal processing unit for performing signal processing for the electric signal read out from the read-out circuit. The plurality of pixels include a first pixel having a transparent film, a plurality of second pixels each having a first color filter, a plurality of third pixels each having a second color filter, and a plurality of fourth pixels each having a third color filter. The signal processing unit has a color acquisition unit for acquiring a white pixel value and first to third color pixel values, an edge judgment unit, a color separation unit and a single color pixel calculation unit.

    摘要翻译: 固体摄像装置具有多个像素,用于读出由光电转换元件获得的电信号的读出电路和用于对从读出的读出的电信号进行信号处理的信号处理单元 电路。 多个像素包括具有透明膜的第一像素,每个具有第一滤色器的多个第二像素,每个具有第二滤色器的多个第三像素和具有第三滤色器的多个第四像素。 信号处理单元具有用于获取白色像素值和第一至第三颜色像素值的颜色获取单元,边缘判断单元,分色单元和单色像素计算单元。

    INFRARED SOLID-STATE IMAGE SENSOR
    23.
    发明申请
    INFRARED SOLID-STATE IMAGE SENSOR 有权
    红外固态图像传感器

    公开(公告)号:US20100230594A1

    公开(公告)日:2010-09-16

    申请号:US12709759

    申请日:2010-02-22

    IPC分类号: H01L27/146

    摘要: An infrared solid-state image sensor comprises: a pixel area comprising a sensitive pixel area where infrared detection pixels are arranged in a matrix form to detect incident infrared rays on the semiconductor substrate and a reference pixel area where reference pixels are provided, each of the infrared detection pixels comprising a thermoelectric conversion part, the thermoelectric conversion part comprising an infrared absorption film to absorb the incident infrared rays and convert the incident infrared rays to heat and a first thermoelectric conversion element to convert the heat obtained by the conversion in the infrared absorption film to a electric signal, each of the reference pixels comprising a second thermoelectric conversion element. Each of first ends of the reference pixels are connected to a reference potential line, and a difference between the signal potential read out from a corresponding signal line and a reference potential supplied from the reference potential line is amplified and outputted.

    摘要翻译: 一种红外固态图像传感器包括:像素区域,包括敏感像素区域,其中红外检测像素以矩阵形式布置以检测半导体衬底上的入射红外线和参考像素的参考像素区域, 红外线检测像素包括热电转换部分,该热电转换部分包括用于吸收入射的红外线并将入射的红外线转换成热的红外线吸收膜和第一热电转换元件,以将通过红外吸收中的转换获得的热量转换 每个参考像素包括第二热电转换元件。 参考像素的每个第一端连接到参考电位线,并且从相应的信号线读出的信号电位与从参考电位线提供的参考电位之间的差放大并输出。

    SOLID-STATE IMAGE SENSOR
    24.
    发明申请
    SOLID-STATE IMAGE SENSOR 有权
    固态图像传感器

    公开(公告)号:US20100157091A1

    公开(公告)日:2010-06-24

    申请号:US11815903

    申请日:2007-06-14

    IPC分类号: H04N9/73

    摘要: A solid-state image sensor has a plurality of pixels, a read-out circuit and a signal processing section. The plurality of pixels includes a plurality of first pixels, a plurality of second pixels, a plurality of third pixels and a plurality of fourth pixels. The signal processing section includes a color acquisition section, a first judgment section configured to determine whether or not the white data value W in the target pixel block is smaller than a predetermined first set value, and a white color correction section configured to perform correction processing of the white color data value W in the target pixel block based on the following Expression (1) when the judgment result of the first judgment section is NO, and to output the white data value W by itself without performing the correction processing based on the Expression (1) when the judgment result of the first determination section is YES; W1=S1C1+S2C2+S3C3  (1) where each of S1, S2, and S3 is a coefficient that is determined based on a color balance.

    摘要翻译: 固态图像传感器具有多个像素,读出电路和信号处理部。 多个像素包括多个第一像素,多个第二像素,多个第三像素和多个第四像素。 信号处理部分包括颜色获取部分,第一判断部分,被配置为确定目标像素块中的白色数据值W是否小于预定的第一设定值;以及白色校正部分,被配置为执行校正处理 当第一判断部分的判断结果为“否”时,基于以下表达式(1),在目标像素块中的白色数据值W的输出,并且自身输出白色数据值W,而不执行基于 当第一确定部分的判断结果为是时,表达式(1) W1 = S1C1 + S2C2 + S3C3(1)其中S1,S2和S3中的每一个是基于颜色平衡确定的系数。

    IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
    25.
    发明申请
    IMAGE SENSOR AND MANUFACTURING METHOD THEREOF 有权
    图像传感器及其制造方法

    公开(公告)号:US20100025584A1

    公开(公告)日:2010-02-04

    申请号:US12508846

    申请日:2009-07-24

    IPC分类号: H01L31/02 H01L31/00

    摘要: An image sensor includes a semiconductor substrate; first pixels laid out above cavities provided within the semiconductor substrate, the first pixels converting thermal energy generated by incident light into an electric signal; supporting parts connected between the first pixels and the semiconductor substrate, the supporting parts supporting the first pixels above the cavities; and second pixels fixedly provided on the semiconductor substrate without via the cavities, wherein a plurality of the first pixels and a plurality of the second pixels are laid out two-dimensionally to form a pixel region, and each of the second pixels is adjacent to the first pixels.

    摘要翻译: 图像传感器包括半导体衬底; 第一像素被布置在设置在半导体衬底内的腔上方,第一像素将由入射光产生的热能转换为电信号; 连接在第一像素和半导体衬底之间的支撑部件,支撑部件支撑空腔上方的第一像素; 以及固定地设置在半导体衬底上的第二像素,而不经由空腔,其中多个第一像素和多个第二像素被二维布置以形成像素区域,并且每个第二像素与 第一个像素。

    INFRARED RAY SENSOR ELEMENT
    26.
    发明申请
    INFRARED RAY SENSOR ELEMENT 审中-公开
    红外辐射传感器元件

    公开(公告)号:US20090236526A1

    公开(公告)日:2009-09-24

    申请号:US12405497

    申请日:2009-03-17

    IPC分类号: H01L27/14

    摘要: An infrared ray sensor element includes: a first signal wiring part including a first signal wire and provided on a first region of a semiconductor substrate different from a region on which a concave part is provided; a second signal wiring part including a second signal wire and provided on the first region so as to intersect the first signal wiring part; a supporter including a support wiring part disposed over the concave part, and including a first wire electrically connected at a first end thereof to the first signal wire, and a second wire insulated from the first wire, disposed in parallel with the first wire, and electrically connected at a first end thereof to the second signal wire; a thermoelectric transducer electrically connected to second ends of the first and second wires; an infrared ray absorption layer provided over the thermoelectric transducer; and a detection cell provided over the concave part.

    摘要翻译: 一种红外线传感器元件包括:第一信号布线部,包括第一信号线,设置在与设置有凹部的区域不同的半导体基板的第一区域上; 第二信号布线部分,包括第二信号线,并设置在第一区域上,以与第一信号布线部分相交; 支撑件,其包括设置在所述凹部上方的支撑布线部,并且包括在其第一端处电连接到所述第一信号线的第一线和与所述第一线平行布置的与所述第一线绝缘的第二线,以及 在其第一端电连接到第二信号线; 电连接到第一和第二导线的第二端的热电换能器; 设置在所述热电换能器上的红外线吸收层; 以及设置在所述凹部上的检测单元。

    TWO-DIMENSIONAL DIGITAL DATA ACQUISITION ELEMENT AND HOLOGRAPHIC STORAGE APPARATUS
    27.
    发明申请
    TWO-DIMENSIONAL DIGITAL DATA ACQUISITION ELEMENT AND HOLOGRAPHIC STORAGE APPARATUS 有权
    二维数字采集元件和全息存储设备

    公开(公告)号:US20080267040A1

    公开(公告)日:2008-10-30

    申请号:US12109633

    申请日:2008-04-25

    IPC分类号: G11B7/00

    摘要: A two-dimensional digital data acquisition element includes: a pixel area having a plurality of pixels arranged in a matrix form, each of the pixels having a photoelectric conversion element to convert the reproduced light from the optical information recording medium to an electric signal; selection circuits which select the pixel; a readout circuit which reads out an electric signal of a pixel selected by the selection circuits; and a 1-bit AD converter which converts an output of the readout circuit to 1-bit digital data. A pitch ratio N between a pitch P1 of the unit data areas in the two-dimensional digital image information and a pitch P2 of the pixels in the pixel area defined as N=P1/P2 satisfies a relation A·n2/(An+1)

    摘要翻译: 二维数字数据采集元件包括:具有以矩阵形式布置的多个像素的像素区域,每个像素具有光电转换元件,用于将来自光信息记录介质的再现光转换为电信号; 选择像素的选择电路; 读出电路,读出由选择电路选择的像素的电信号; 以及将读出电路的输出转换为1位数字数据的1位AD转换器。 二维数字图像信息中的单位数据区域的间距P1与定义为N = P 1 / P 2的像素区域中的像素的间距P 2之间的间距比N满足< -formulae description =“In-line Formulas”end =“lead”?> An 2 /(An + 1) /(An-1) <?in-line-formula description =“在线公式”end =“tail”?>其中A是二维数字数据的一个字节的一维方向上的数字数据的数量,n是自然的 至少数2。

    SOLID-STATE IMAGE PICKUP DEVICE
    28.
    发明申请
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像拾取器件

    公开(公告)号:US20080211943A1

    公开(公告)日:2008-09-04

    申请号:US11967585

    申请日:2007-12-31

    IPC分类号: H04N5/335

    CPC分类号: H04N9/045 H04N5/35581

    摘要: In a pixel unit, cells are arranged in rows and columns two-dimensionally. Each of the cells accumulates signal charge obtained by photoelectrically converting light incident on photoelectric conversion section and outputs a voltage corresponding to the accumulated signal charge. On the cells, W, R, G, and B color filters are provided. Analog signals output from the W pixel, R pixel, G pixel, and B pixel are converted into digital signals by an analog/digital converter circuit, which outputs a W signal, an R signal, a G signal, and a B signal separately. A W signal saturated signal quantity is controlled by a saturated signal quantity control circuit. Then, a signal generator circuit corrects the R signal, the G signal, and the B signal using the W signal, the R signal, the G signal, and B signal output from the analog/digital converter circuit and outputs the corrected R, G, and B signals.

    摘要翻译: 在像素单元中,单元以二维排列成行和列。 每个单元累积通过光电转换入射在光电转换部分上的光而获得的信号电荷,并输出与累积信号电荷相对应的电压。 在单元格上提供了W,R,G和B滤色片。 通过模拟/数字转换器电路将从W像素,R像素,G像素和B像素输出的模拟信号转换为数字信号,该模拟/数字转换器电路分别输出W信号,R信号,G信号和B信号。 W信号饱和信号量由饱和信号量控制电路控制。 然后,信号发生电路使用从模拟/数字转换电路输出的W信号,R信号,G信号和B信号来校正R信号,G信号和B信号,并输出校正后的R,G ,和B信号。

    Solid-state imaging device and portable information terminal having a proportion of W pixels increases toward an outer periphery of each pixel block
    29.
    发明授权
    Solid-state imaging device and portable information terminal having a proportion of W pixels increases toward an outer periphery of each pixel block 有权
    具有W像素的比例的固态成像装置和便携式信息终端朝向每个像素块的外周增加

    公开(公告)号:US08937274B2

    公开(公告)日:2015-01-20

    申请号:US13713304

    申请日:2012-12-13

    IPC分类号: H01L27/00 H01L27/146

    摘要: A solid-state imaging device according to an embodiment includes: an imaging element including a semiconductor substrate and a plurality of pixel blocks, each of the pixel blocks including at least two of R pixels, G pixels, B pixels, and W pixels; a first optical system configured to form an image of an object on an imaging plane; and a second optical system including a microlens array having a plurality of microlenses provided for the respective pixels blocks, the second optical system being located between the imaging element and the first optical system, the second optical system being configured to reduce and re-image the image formed on the imaging plane onto each of the pixel blocks. A proportion of the W pixels to be provided increases in a direction from a center of each pixel block toward an outer periphery thereof.

    摘要翻译: 根据实施例的固态成像装置包括:成像元件,包括半导体衬底和多个像素块,每个像素块包括R像素,G像素,B像素和W像素中的至少两个; 第一光学系统,被配置为在成像平面上形成物体的图像; 以及第二光学系统,其包括具有为各个像素块设置的多个微透镜的微透镜阵列,所述第二光学系统位于所述成像元件和所述第一光学系统之间,所述第二光学系统被配置为减小并重新成像 在成像平面上形成的每个像素块上的图像。 要提供的W像素的比例在从每个像素块的中心朝向其外周的方向上增加。

    Solid-state image pickup device
    30.
    发明授权
    Solid-state image pickup device 失效
    固态图像拾取装置

    公开(公告)号:US08604581B2

    公开(公告)日:2013-12-10

    申请号:US12211427

    申请日:2008-09-16

    IPC分类号: H01L27/146

    摘要: A solid-state image pickup device has a photoelectric conversion element that converts light incident from a first surface of a substrate into a signal charge and accumulates the signal charge, a transistor that is formed on a second surface side opposite to the first surface of the substrate and reads out the signal charge accumulated by the photoelectric conversion element, a supporting substrate stuck to the second surface of the substrate, and an antireflection coating formed on the first surface of the substrate, wherein the first surface of the substrate includes a curved surface or an inclined surface forming a prescribed angle to the second surface.

    摘要翻译: 固体摄像装置具有将从基板的第一面入射的光转换成信号电荷并积累信号电荷的光电转换元件,形成在与第一表面相反的第二表面侧的晶体管 读取由光电转换元件积累的信号电荷,粘贴到基板的第二表面的支撑基板和形成在基板的第一表面上的抗反射涂层,其中基板的第一表面包括弯曲表面 或与第二表面形成规定角度的倾斜表面。