Abstract:
A micro-electro-mechanical system (MEMS) actuator assembly includes a mirror and four actuators. Each actuator includes a lever pivotable about a fulcrum axis. The inner end of each lever is coupled to one side of the mirror. Force is applied to one outer end of the levers to move one side of the mirror, which positions the mirror in one of four positions. Force is applied to two outer ends of the levers to move two sides of the mirror, which positions the mirror in one of four additional positions.
Abstract:
A micro-electro-mechanical system (MEMS) pressure sensor includes a silicon spacer defining an opening, a silicon membrane layer mounted above the spacer, a silicon sensor layer mounted above the silicon membrane layer, and a capacitance sensing circuit. The silicon membrane layer forms a diaphragm opposite of the spacer opening, and a stationary perimeter around the diaphragm and opposite the spacer. The silicon sensor layer includes an electrode located above the diaphragm of the silicon membrane layer. The capacitance sensing circuit is coupled to the electrode and the silicon membrane layer. The electrode and the silicon membrane layer move in response to a pressure applied to the diaphragm. The movement of the silicon membrane layer causes it to deform, thereby changing the capacitance between the electrode and the silicon membrane layer by an amount proportional to the change in the pressure.
Abstract:
A mirror device includes a mirror, an anchor, and a spring coupling the mirror to the anchor. The anchor and/or mirror can define one or more rows of holes adjacent to the coupling location of the spring. The natural frequency of the device can be adjusted by removing material between the perimeter of the mirror/anchor and the outermost holes, and between adjacent holes in the same row. Another mirror device includes a mirror, anchors, and springs coupling the mirror to the anchors. The natural frequency of the device can be adjusted by decoupling one or more springs coupling the mirror to the anchors. The mirror of both devices can includes one or more sacrificial portions. The natural frequencies of the both devices can also be adjusted by trimming the sacrificial portions.
Abstract:
An actuator for a disk drive is disclosed. The actuator includes a plurality of arms including an upper outer arm, a lower outer arm, and at least one inner arm. The outer arms each include a region of reduced width and also include a region of increased thickness, both such regions being located closer to a proximal supported end of the outer arm than to its distal end. Each region of increased thickness has a minimum thickness that is more than the thickness of the inner arm at an equal distance from the axis. Each region of reduced width has a minimum width that is less than the minimum width of the inner arm at an equal distance from the axis.
Abstract:
A micro-electro-mechanical system (MEMS) device includes an oscillating body and a beam connected to the oscillating body. The beam has a proximal end connected to the oscillating body, a distal end spaced from the oscillating body, and rotational comb teeth extending from the beam. Springs couple the beam to stationary pads to allow the oscillating body to rotate about a rotational axis. The springs are arranged along the rotation axis so at least one spring is located between another spring and the oscillating body. Stationary comb teeth extend from a stationary pad to be interdigitated with the rotational comb teeth extending from the beam. A voltage difference is applied between the stationary and rotational comb teeth to rotate the oscillating body about the rotation axis. A bottom layer includes mounting pads for supporting the stationary pads. An electrode is formed on a surface of the bottom layer. A voltage or ground is applied to the electrode to assert a physical influence on the rotation of the oscillating body.
Abstract:
A mirror device includes a mirror, an anchor, and a spring coupling the mirror to the anchor. The anchor and/or mirror can define one or more rows of holes adjacent to the coupling location of the spring. The natural frequency of the device can be adjusted by removing material between the perimeter of the mirror/anchor and the outermost holes, and between adjacent holes in the same row. Another mirror device includes a mirror, anchors, and springs coupling the mirror to the anchors. The natural frequency of the device can be adjusted by decoupling one or more springs coupling the mirror to the anchors. The mirror of both devices can includes one or more sacrificial portions. The natural frequencies of the both devices can also be adjusted by trimming the sacrificial portions.
Abstract:
A micro-electro-mechanical system (MEMS) device includes a mirror having a top surface with trenches, a beam connected to the mirror, rotational comb teeth connected to the beam, and one or more springs connecting the beam to a bonding pad. The mirror can have a bottom surface for reflecting light. Stationary comb teeth can be interdigitated with the rotational comb teeth either in-plane or out-of-plane. Steady or oscillating voltage difference between the rotational and the stationary comb teeth can be used to oscillate or tune the mirror. The comb teeth can have a tapered shape.
Abstract:
A micro-electro-mechanical system (MEMS) mirror device includes an mirror, bonding pads, springs, and beams connected to the mirror. The mirror has a width greater than 1000 and less than 1200 microns, a length greater than 4000 and less than 5500 microns, and a thickness greater than 240 microns. Each beam includes a plurality of rotational comb teeth and is connected by multiple springs to the bonding pads.
Abstract:
A method for forming semiconductor devices with wafer-level packaging (WLP) includes providing a silicon-on-insulator (SOI) substrate, forming a mask on a silicon layer of the SOI substrate, etching the silicon layer through openings in the mask to form elements initially bonded to but later released from an insulator layer of the SOI substrate, bonding a support substrate to the silicon layer, depositing metal over through holes in the support substrate to contact the silicon layer, and singulating the semiconductor devices from the bonded SOI substrate and the support substrate. The support substrate defines depressions opposite the elements so the elements are not bonded to the support substrate. Each semiconductor device includes a hermetically sealed package having a portion of the SOI substrate and a portion of the support substrate.
Abstract:
A battery has a battery case with a hole, and a micro-electro-mechanical system (MEMS) safety valve mounted to the battery case over the hole. The MEMS safety valve includes a silicon diaphragm and a silicon electrode layer with a movable electrode mounted above the diaphragm, a stationary electrode around the movable electrode, and one or more links electrically connecting the movable and the stationary electrodes. The stationary electrode, the links, and the movable electrode form part of an electrical path between one or more battery cells and a battery terminal. The links break to open the electrical path when the pressure in the battery case pushes the diaphragm and the links past a first limit. The diaphragm breaks to release fluid from the battery case when the pressure pushes the diaphragm past a second limit. The first limit may be smaller, larger, or the same as the second limit.