摘要:
An optical microcantilever capable of reducing loss when propagating light. An optical microcantilever 10 comprises a support 1, an optical waveguide 2, a light-blocking film 3, a reflecting film 4, a pointed tip 5, a microscopic aperture 6 formed at the end of the tip 5, and a mirror 7 for reflecting propagating light H propagated from a light input/output end 8 of the optical waveguide 2 towards the microscopic aperture 6.
摘要:
A near-field optical probe has a cantilever formed of a transparent material and having a first main surface and a second main surface opposite the first main surface. A base supports the cantilever at the first main surface. A tip extends from the second main surface of the cantilever and has a microscopic aperture at an end thereof. The tip is formed of a transparent material having a higher refractive index than that of the transparent material of the cantilever to increase an amount of near-field light generated or detected by the microscopic aperture. A shade film is formed on the second main surface of the cantilever and on a surface of the tip except for the microscopic aperture.
摘要:
There is disclosed a near-field optical head having an microscopic aperture whose size can be varied. The optical head comprises a substrate of silicon. A hole in the form of an inverted cone is formed in the substrate. The top portion of this hole forms the microscopic aperture. A support portion for supporting an actuator is formed on the substrate. The actuator holds a light-blocking film in such a way that the light-blocking film stays in the hole and that the bottom surface of the light-blocking film is flush with the bottom surface of the microscopic aperture. The light-blocking film is moved by the actuator to change the aperture to desired size.
摘要:
There is disclosed an optical switch consisting of a support substrate, a movable raw optical fiber, a fixed raw optical fiber, a magnetic member for the movable raw optical fiber, and a leaf spring. The fibers are disposed in a V-shaped groove formed in the substrate. The magnetic member is actuated by an electromagnet disposed above the substrate. The leaf spring pushes the movable raw optical fiber into the V-shaped groove. The structure of the switch is relatively simple. Since the movable raw optical fiber is pushed using the leaf spring, the switch is less affected by the assembly accuracy than conventional. It is easy to make adjustments during assembly. Consequently, high-performance, low-cost, optical switch that can be mass-produced can be offered.
摘要:
The present invention has an object to obtain an optical waveguide probe which is formed in a hook form to illuminate and detect light by a manufacture using a silicon process. This optical waveguide probe is formed in a hook form and structured by an optical waveguide 1 sharpened at a probe needle portion 5 and formed of dielectric and a substrate 2 supporting this optical waveguide 1. This optical waveguide 1 is formed overlying the substrate 2. The optical waveguide 1 is structured by a core 8 to transmit light and a cladding 9 smaller in refractive index than the core 8.
摘要:
A battery pack has a secondary battery connected to a plus side terminal. A protective circuit protects the secondary battery from overcharge and over-discharge. A calculation circuit operates with a minus side terminal as a reference for calculating a remaining capacity of the secondary battery. An N-channel MOS transistor is connected between the secondary battery and the minus terminal for controlling charge and discharge of the secondary battery in accordance with a signal from the protective circuit. A level shifter circuit is connected between the calculation circuit and a communication terminal.
摘要:
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.
摘要:
An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.
摘要:
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.
摘要:
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.