摘要:
A piezoelectric device includes a piezoelectric resonator including a piezoelectric resonator element, a package for accommodating the piezoelectric resonator in a cavity thereinside, a lid for airtightly sealing the cavity inside the package, a package base included in the package, and an external terminal formed on a bottom surface of the package base; a circuit element stacked together with the piezoelectric resonator to be electrically connected thereto; a wiring substrate having the circuit element mounted on a first surface thereof and a mounting external terminal provided on a second surface thereof, a connecting member arranged in a periphery of the circuit element mounted on the first surface of the wiring substrate to electrically and mechanically connect the wiring substrate to the external terminal of the piezoelectric resonator; and a molded portion made of a molding member that is formed from the first surface of the wiring substrate up to at least a position higher than an upper end surface of the package base of the piezoelectric resonator, the molded portion covering the first surface of the wiring substrate, the package base of the piezoelectric resonator, the external terminal formed on the bottom surface of the package base, the circuit element, and the connecting member, whereas at least a part of a marking region on the lid being exposed from the molded portion.
摘要:
A piezoelectric device includes: a package including a first recessed part provided on a first surface of the package, a second recessed part provided on a second surface of the package, and a penetrating part passing partially from the first recessed part through the second recessed part; a piezoelectric element housed in the first recessed part; a lid disposed on the upper side of the first recessed part; an IC chip disposed and fixed in the second recessed part of the package so as to block a part of the penetrating part; and a sealing part provided to the second recessed part. The IC chip and the sealing part close up the penetrating part and the lid seals the first recessed part air-tightly. A piezoelectric device is provided. The piezoelectric device realizes thickness reduction thereof without undergoing warpage and breakage of an IC chip or a package thereof.
摘要:
A surface acoustic wave element includes a piezoelectric substrate, an IDT composed of a pair of first and second comb-like electrodes, formed around a center of the piezoelectric substrate, and formed on a surface of the surface acoustic wave element, and a pair of first and second terminals electrically connected to the IDT, formed at central and peripheral areas of the piezoelectric substrate, respectively, in which a package is bonded with an adhesive to a surface of the surface acoustic wave element, opposite to the surface formed with the IDT.
摘要:
A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.
摘要:
A piezoelectric device includes a piezoelectric element, a circuit board on which the piezoelectric element is mounted, an IC component having at least a function of oscillating the piezoelectric element and connected to a bottom face of the circuit board, an insulating section covering at least a part of the IC component, a circuit connection terminal formed on a main surface of the IC component, an internal connection bump formed on the circuit connection terminal and connected to the circuit connection terminal and the bottom face of the circuit board, a functional terminal formed on a main surface of the IC component, a back surface electrode formed on a back surface of the IC component, a penetrating electrode penetrating the IC component from the main surface to the back surface and connecting the functional electrode and the back surface electrode to each other, an external connection bump connected to the back surface electrode, and a mounting terminal formed on a surface of the insulating section, and a part of the external connection bump is exposed from the surface of the insulating section and is connected to the mounting terminal.
摘要:
A pressure sensor includes: a diaphragm having a pressure-receiving portion receiving a pressure and a thick portion adjacent to the pressure-receiving portion; and a pressure sensitive element having a first and a second ends facing each other. The pressure sensitive element extends in a direction intersecting the thick portion and the first end of the pressure sensitive element is bonded to a pressure-receiving surface of the pressure-receiving portion, and a central portion of a portion at which the pressure-receiving portion and the first end are bonded is positioned at a side closer to the second end of the pressure sensitive element than a center of the pressure-receiving portion.
摘要:
A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
摘要:
There is provided a high-stability piezoelectric oscillator. The high-stability piezoelectric oscillator includes an oscillating circuit unit that has a piezoelectric vibrator and oscillating circuit components, an inner oven that accommodates the oscillating circuit unit, an outer oven that accommodates the inner oven, and an outer metallic case that covers the outer oven. Further, airtightness is ensured inside and outside the outer metallic case. Furthermore, at least one of the outer oven and the inner oven is airtightly sealed.
摘要:
A gyro-module includes: a first gyro element component having a first detection axis and a second detection axis, and outputting at least a signal that is based on angular velocity around the first detection axis and the second detection axis; a second gyro element component having a first detection axis and a second detection axis, and outputting at least a signal that is based on angular velocity around the first detection axis and the second detection axis; a third gyro element component having a first detection axis; a first operation circuit conducting an operation of an output signal from the first gyro element component and an output signal from the third gyro element component; and a second operation circuit conducting an operation of an output signal from the second gyro element component and an output signal from the third gyro element component.The first gyro element component, the second gyro element component and the third gyro element component are arranged in such a way that the first detection axis of the first gyro element component, the first detection axis of the second gyro element component and the first detection axis of the third gyro element component extend in a same direction and a direction in which the second detection axis of the first gyro element component is extended crosses with a direction in which the second detection axis of the second gyro element component is extended.