Abstract:
A process for reinforcing a glass-ceramic article, into which a maximum tension is introduced beneath the surface of the glass-ceramic, advantageously in proximity to said surface. The invention also relates to an enamel that can be used for this reinforcement, this enamel being formed from a glass frit having the following composition, the proportions being expressed as weight percentages: SiO250-66% MgO3-8% Na2O 7-15% K2O0-3% Li2O 0-12% CaO 0-10% BaO 0-15% Al2O30-3% ZrO20-3% ZnO0-5% B2O30-8% the sum of the alkaline-earth metal oxides CaO+BaO moreover being between 8 and 15%, and the sum of the alkali metal oxides Na2O+K2O+Li2O moreover being between 7 and 20%. The reinforced glass-ceramics obtained by the process.
Abstract:
This invention relates to lead free and cadmium free copper-containing glass frits that can be used as pigments to color other glass frits or to impart color to solid substrates such as glass, ceramic or metals, or to impart color to a thermoplastic mass. The compositions comprise silica, alkali metal oxides, alkaline earth metal oxides, tin oxide and copper oxide. The resulting compositions can be used to decorate and protect automotive, beverage, architectural, pharmaceutical and other glass substrates, generally imparting a red color.
Abstract:
Certain example embodiments of this invention relate to coated articles including substrates that support printed patterns and thin film layer stacks that can have the patterns and the layer stacks formed thereon and then be cut, heat treated, and optionally built into an insulated glass unit, laminated to another substrate, and/or used in another product. In certain example embodiments, this is made possible by bonding to the glass the frit material used in forming the pattern, re-annealing the glass following the bonding, disposing the thin film layer stack on the re-annealed substrate supporting the bonded pattern, and then cutting and heat treating. The frit advantageously does not re-melt during heat treatment because the melting temperature is higher than the temperature used in heat treatment. Associated methods also are provided.
Abstract:
A glass layer 3 is disposed between a glass member 4 and a thermal conductor 7 along a region to be fused. The glass layer 3 is formed by removing an organic solvent and a binder from the paste layer while using the thermal conductor 7 as a hotplate. Then, a laser beam L1 is emitted while using the thermal conductor 7 as a heatsink, so as to melt the glass layer 3, thereby burning and fixing the glass layer 3 onto the glass member 4. Thereafter, another glass member is overlaid on the glass member 4 having the glass layer 3 burned thereonto, such that the glass layer 3 is interposed therebetween. Then, the region to be fused is irradiated therealong with a laser beam, so as to fuse the glass members together.
Abstract:
A glass film has a first and a second surface which are both defined by like edges, wherein the surface of at least two edges which are located opposite one another have an average surface roughness of an maximum of 2 nanometers.
Abstract:
A low VOC medium is described. The medium comprises a low VOC solvent such as propylene carbonate, dimethyl carbonate, or combinations thereof. The low VOC medium also comprises one or more glycol ethers. In addition, the low VOC medium also includes one or more surfactants and/or dispersants. The low VOC medium may also optionally comprise one or more binders. The low VOC medium can be used in preparing coating compositions and pastes that are intended for use in applications that include a firing step.
Abstract:
A sealing material paste and a process for producing an electronic device are provided, which realize suppressing with good reproducibility generation of bubbles in a sealing layer when a rapid heating-rapid cooling process with a temperature-rising speed of at least 100° C./min is applied to seal two glass substrates together. The sealing material paste, wherein the amount of water is at most 2 volume %, is applied on a sealing region of a glass substrate 2, and such a coating film 8 is fired to form a sealing material layer 7. The glass substrate 2 is laminated with another glass substrate via a sealing material layer 7, and they are heated with a temperature-rising speed of at least 100° C./min to be sealed together.
Abstract:
When fixing a glass layer 3 to a glass member 4 by irradiation with laser light employing a one portion 31 of the glass layer 3 as start and end points, the glass layer 3 is cut at the one portion 31. In the glass layer 3, the one portion 31 is made thicker than a main portion 32, whereby end parts 3a, 3b rise fully. Melting the end parts 3a, 3b by irradiation with laser light L2 for a preliminary stage for final firing while pressing them toward the glass member 4 reliably buries a gap G and homogenizes the thickness of the glass layer 3. Thus constructed glass layer 3 is irradiated with the laser light L2 for final firing, so as to fuse the glass members 4, 5 to each other.
Abstract:
Certain example embodiments relate to substrates or assemblies having laser-fused frits, and/or methods of making the same. In certain example embodiments, a pattern is formed or written on a stock glass sheet by laser fusing frit material to the glass sheet. An optional thin film coating is disposed on and supported by the stock glass sheet. The stock glass sheet with the pattern and the optional thin film coating is cut prior to heat treatment (e.g., heat strengthening and/or thermal tempering). A YAG or other type of laser source may be used to directly or indirectly heat the frit material, which may be wet applied to the substrate. In certain instances, the laser firing of the frit raises the temperature of the glass substrate to no more than 100 degrees C. and, preferably, the temperature is kept even lower.