Abstract:
A compliant marking tool for attachment to a fiber placement machine that is capable of marking detail locations on a work piece positioned on the fiber placement machine. The marking tool has a flexible member that is configured and adapted to bow and twist in response to the marking tool contacting the work piece. A holder is pivotably connected to the flexible member. A marking member is positioned in the holder and is capable of moving within the holder. The flexing of the flexible member along with the pivoting of the holder and the movement of the marking member allow the marking tool to follow the contours of the work piece and mark detail locations without damaging or at least minimizing the potential of damaging the work piece.
Abstract:
A fluid ejection cartridge for dispensing a bioactive fluid including a first reservoir containing the bioactive fluid and a first fluid ejector fluidically coupled to the first reservoir. The first fluid ejector ejects at least a drop of the bioactive fluid onto the ingestible sheet.
Abstract:
A disc painting or treating machine includes one or more holder devices, and a device for moving non-circular discs onto the holder devices. The holder devices each includes a non-circular opening for receiving and for correctly positioning the non-circular disc on the holder device, and for allowing the non-circular disc to be correctly printed or painted or treated by a treating device. A positioning device is disposed beside the holder devices and includes a non-circular surface for engaging with and for correctly positioning the non-circular discs.
Abstract:
Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
Abstract:
A particle measurement configuration measures the particle concentration in a liquid or gaseous medium by way of a particle measuring instrument. In order to avoid erroneous measurements or damage to the particle measuring instrument, a measuring cell is provided which measures temperature or pressure or pH of the medium. A system controller shuts off a valve if threshold values are exceeded and it prevents the particle measuring instrument from being operated outside a predefined specification.
Abstract:
There is described a medical image recording apparatus, which records a medical image on a recording medium based on image data. The apparatus includes an ink-jetting head to emit ink particles onto the recording medium and a controlling section to control the ink-jetting head, so that a total amount of the ink particles per unit area, emitted by the ink-jetting head and adhered onto the recording medium, is maintained at substantially a constant value even if density of a solid-tone image area varies within density range D. With respect to at least one of combinations of values k1, k2 selected under conditions of 0nullk1
Abstract:
An apparatus and method for manufacturing an optical fiber preform by MCVD is disclosed. In the preform manufacturing apparatus, a cylindrical deposition tube receives a source gas through one end and discharges the source gas through the other end. A first heat source is mounted to a guide and forms a first high temperature area inside the deposition tube by heating the outer circumferential surface of the deposition tube. A second heat source is mounted to the guide, apart from the first heat source by a predetermined distance along the length direction of the deposition tube, and forms a second high temperature area inside the deposition tube by heating the outer circumferential surface of the deposition tube. A beat source mover moves the first and second heat sources, maintaining the distance between the first and second heat sources.
Abstract:
A method of forming a thin polycrystalline silicon film and a thin film forming apparatus allowing inexpensive formation of a thin polycrystalline silicon film at a relatively low temperature with high productivity. More specifically, a method of forming a thin polycrystalline silicon film and a thin film forming apparatus in which a state of plasma is controlled to achieve an emission intensity ratio of hydrogen atom radicals (Hnull) of one or more to the emission intensity of SiH* radicals in the plasma. The thin film forming apparatus of a plasma CVD type includes a deposition chamber accommodating a deposition target substrate, a discharging electrode for plasma formation connected to a discharging power source, a gas supply device for supplying a gas and an exhaust device, and further includes an emission-spectrometer and a probe measuring device as well as a control portion for controlling at least one of the power supply, the gas supply and gas exhausting, for maintaining a desired state of plasma based on information detected by them.
Abstract:
A system is disclosed for speeding workpiece thoughput in low pressure, high temperature semiconductor processing reactor. The system includes apparatus for loading a workpiece into a chamber at atmospheric pressure, bringing the chamber down to an intermediate pressure, and heating the wafer while under the intermediate pressure. The chamber is then pumped down to the operating pressure. The preferred embodiments involve single wafer plasma ashers, where a wafer is loaded onto lift pins at a position above a wafer chuck, the pressure is rapidly pumped down to about 40 Torr by rapidly opening and closing an isolation valve, and the wafer is simultaneously lowered to the heated chuck. Alternatively, the wafer can be pre-processed to remove an implanted photoresist crust at a first temperature and the chamber then backfilled to about 40 Torr for further heating to close to the chuck temperature. At 40 Torr, the heat transfer from the chuck to the wafer is relatively fast, but still slow enough to avoid thermal shock. In the interim, the pump line is further pumped down to operating pressure (about 1 Torr) behind the isolation valve. The chamber pressure is then again reduced by opening the isolation valve, and the wafer is processed.
Abstract:
An air unit for the removal of excess particulate coating material that is present on products which are in a coating machine comprises, for blowing surplus particulate material off the products, at least one suction member for drawing off air, with particulate material present therein, from the coating machine, separating means for removing particulate material from the air drawn off, and circulating means for feeding at least a portion of the air drawn off to the blowing member.