摘要:
This application describes a method of testing for manufacturing faults and quality of unpopulated or inactive populated electronic printed circuit boards (PCB). This method can be used to develop a new contactless test system (CTS). An electromagnetic field is generated by an energizing plate connected to an AC signal. When a board under test (BUT) is placed within the electromagnetic field, perturbation of the original field by conducting elements on the BUT is solely a function of the geometrical layout of the conducting elements on the BUT. Therefore, measurement of the perturbed electromagnetic field produces a characteristic pattern for the BUT. Such a pattern can then be compared to a known pattern for the same type of board to determine whether the BUT is faulty (shorts or opens) or not faulty. The most distinctive feature of this method is that testing PCBs by this method requires no electrical contact with the BUT due to the use of the energizing plate.
摘要:
A burn-in apparatus used in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. Also, the burn-in apparatus includes measuring means for detecting electric characteristics of temperature sensors built in the respective semiconductor devices to individually measure junction temperatures of the semiconductor chips incorporated in the respective semiconductor devices, and laser beam irradiating means or electric heating members. The laser irradiating means or the heating members are controlled by control means, based on outputs of the measuring means. Thus, the junction temperatures are maintained in a set junction temperature range, and the screening accuracy can be improved.
摘要:
An optical inspection system is provided in which the background video component of an analog video source which limits imaging integrity is removed enhancing the system's ability to process a wider range of image sources with increase digitizing sensitivity. The overall effects of background and background variations are nulled stabilizing the effective signal to noise ratio, thereby increasing inspection capability of the system and improving the system's process window for effective and efficient inspection.
摘要:
A set of red light sources (111-113) are provided above a printed board (20). One (111) of the light sources located in the angular aperture of an imaging lens system (140). The red light is applied to the printed board and reflected on a wiring pattern (22) provided thereon. Another light source (120) is provided under the printed board, and emits infrared light to the back surface of the printed board. The infrared light passes through a through hole (25) formed in the printed board and then enters the imaging lens system together with the red light reflected. Compound light consisting of the red light and the infrared light passes through the imaging lens system and is then splitted into the red light and the infrared light at a cold mirror (150). The respective lights are detected by image sensors (161, 162), to thereby obtain respective images of the wiring pattern and the through hole.
摘要:
A printed circuit board inspecting apparatus, in which image data of a packaged circuit board under inspection obtained by picking up the image of the circuit board are processed through predetermined processing procedure for examining packaged states of parts mounted on the packaged cicuit board. The apparatus comprises an imaging unit for picking up the image of a packaged circuit board, a decision unit for deciding the state of the parts mounted on the packaged circuit board, and a visualizing unit for displaying visibly the result of the decision and position of the relevant part in correspondence with each other. The apparatus can further include a land extracting unit for extracting lands from the image obtained through the imaging of the packaged circuit board under inspection, an alarm condition setting unit for setting the condition for generating an alarm, and an alarm generating unit for generating the alarm when the alarm condition is met by the result of decision made by the decision unit.
摘要:
A printed circuit board inspection device includes a lighting system for use with the series of cameras associated with the printed circuit board inspection device which is essentially domed in configuration, and which incorporates a plurality of selectively controllable light emitting diodes for developing desired lighting patterns. The light emitting diodes are arranged within the domed fixture to form an array of defined latitudes and longitudes, and are capable of selective activation to develop the particular lighting patterns which are desired. This permits an acquisition of images useful in developing a "topographical display" of the acquired image, which is useful in enhancing the subsequent inspections which are to be performed.
摘要:
Presence, absence, and adequacy of length of component leads are detectable by engaging each lead with a corresponding interposer and monitoring the amount of displacement of each interposer or plunger in response to the lead. Each plunger is provided with an optic fiber for guiding and directing a light beam from a transmitter to a receiver of a sensor when a lead is missing or too short. The lead engaging portion of the plunger is interchangeable to accommodate different lengths of leads and heights of cut and clinch anvils. For DIP components, each half of the inventive device receives all of the leads on one side of the component, with an individual piston for each lead. Thus, mirror image devices may be used for oppositely spaced rows of leads of a DIP, with the spacing between the mirrored halves of the device being adjustable according to the center-to-center (CTC) spacing between leads on opposite sides of the component body. Each plunger of one of the mirror halves is simultaneously engaged by a fluid common to the remaining pistons thereof for extension, as well as retraction, of the lead engaging portions.
摘要:
An apparatus for automatic printed wiring board (PWB) defect detection comprises an array of optical sensors for optically inspecting a printed wire circuit. The array forms a binary image pattern of the PWB which is tested for compliance with logical rules of correctly printed PWB's regarding unterminated conductors; a set of minimum and maximum specified line widths; line spacing width; presence of insulators on conductors and vice versa; presence of pinholes, flecks of copper, and Vees and neck-downs.A method employs an inner enable pattern of pixel bits formed to determine if a feature being viewed is possibly on a conductor line or insulator space. A set of same-state patterns is formed around the center of the matrix with each pattern being progressively larger. The state of opposite pixel points on the same-state patterns is progressively examined to determine the first inner pattern in which opposite pixel points are ot in the same state. Measurement and verification patterns are selected based upon which same-state pattern meets the above test. The measurement pattern is used to determine if the feature is centered in the matrix and the dimensions of the measurement pattern are checked against stored dimensions of acceptable size. The verification pattern is used to ascertain feature characteristics by counting the number of opposite verification pattern pixels, both on conductor, both on insulator and in opposite states and the number of transitions.
摘要:
Method and apparatus for inspecting a printed circuit board wherein scanned image data are digitized and analyzed according to a feature extraction method and a mutual comparison method. The result of both of the analysis methods is combined with predetermined conditions to control output devices including a CRT display or a marking device. The two complementary methods compensate each others drawbacks so that the reliability of inspection can be improved.
摘要:
A method for detecting faults in digital and analog circuits including the steps of thermally stabilizing the circuit, applying electrical stimulus to the circuit for a predetermined time period, scanning the circuit to determine the infrared response, applying another desired electrical stimulus to the circuit for a predetermined time period, scanning the circuit to determine the infrared response, repeating the applying and scanning sequence as desired, and comparing the resulting infrared responses with normal infrared profiles to detect and isolate faults in the circuit.