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公开(公告)号：US20200178418A1
公开(公告)日：2020-06-04
申请号：US16785564
申请日：2020-02-08
Applicant: DHK Storage, LLC
Inventor： David Klein
Abstract: The present invention includes a server system that uses an airflow source that can be external to the computer that the airflow source cools. The computer may be sealed such that the conduits are the primary source of fluid ingress and egress. The airflow source can be positioned in a case of the computer, support members affixing the computer to a rack stand, the rack stand, or beyond conduit that conducts fluid to the rack stand.
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公开(公告)号：US10605469B2
公开(公告)日：2020-03-31
申请号：US15648328
申请日：2017-07-12
Applicant: Johnson Controls Technology Company
Inventor： Tyler P. McCune , Shawn A. Hem , Brian D. Rigg , Jedidiah O. Bentz , Aneek M. Noor , Theresa N. Gillette , Tom R. Tasker , Shaun B. Atchison
Abstract: In one embodiment of the present disclosure, a heating, ventilating, and air conditioning (HVAC) system includes a refrigerant circuit configured to flow a refrigerant. The refrigerant circuit includes a compressor configured to compress the refrigerant, a condenser configured to receive the refrigerant from the compressor and to condense the refrigerant, a valve configured to receive a first portion of the refrigerant from the condenser and to decrease a pressure of the first portion of the refrigerant, and an evaporator configured to receive the first portion of the refrigerant from the condenser and configured to evaporate the first portion of the refrigerant. The refrigerant circuit also includes a refrigerant sub-circuit configured to receive a second portion of the refrigerant from the condenser and to convert thermal energy of the second portion of the refrigerant to electrical energy.
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公开(公告)号：US20200028051A1
公开(公告)日：2020-01-23
申请号：US16243196
申请日：2019-01-09
Applicant: FUJIFILM CORPORATION
Inventor： Hiroki SUGIURA , Yoshinori KANAZAWA , Kimiatsu NOMURA
IPC: H01L35/24 , C01B32/159 , C01B32/174 , H01L35/28 , H01L51/00
Abstract: An object of the present invention is to provide a semiconductor layer (n-type semiconductor layer) which demonstrate an excellent thermoelectric conversion performance and exhibits n-type characteristics. Another object of the present invention is to provide a thermoelectric conversion layer formed of the n-type semiconductor layer and a composition for forming an n-type semiconductor layer. Still another object of the present invention is to provide a thermoelectric conversion element, which has the thermoelectric conversion layer as an n-type thermoelectric conversion layer, and a thermoelectric conversion module.The n-type semiconductor layer of the embodiment of the present invention contains a nanocarbon material and an onium salt represented by a specific structure.
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公开(公告)号：US20200022288A1
公开(公告)日：2020-01-16
申请号：US16577886
申请日：2019-09-20
Applicant: DHK Storage, LLC
Inventor： David Klein
Abstract: The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The present invention can be operated to shunt organized airflow into multiple computer cases and/or organized airflow from multiple computer cases to a dedicated heat reservoir.
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公开(公告)号：US20200022287A1
公开(公告)日：2020-01-16
申请号：US16577843
申请日：2019-09-20
Applicant: DHK Storage, LLC
Inventor： David Klein
Abstract: The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The lateral support member permits a new rack stand, facility, and complex of computer/member, and features the ability to sealingly accept itself to build a sidewall of the rack and sealingly accept server components (e.g., computers).
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Patent Agency Ranking
26.发明申请公开(公告)号：US20200002168A1
公开(公告)日：2020-01-02
申请号：US16484945
申请日：2018-09-28
Applicant: LG CHEM, LTD.
Inventor： Min Kyoung Kim , Yu Ho Min , Cheol Hee Park , Kyung Moon Ko , Chee Sung Park , Myung Jin Jung
Abstract: A chalcogen-containing compound of the following chemical formula which exhibits an excellent thermoelectric performance index (ZT) through an increase in power factor and a decrease in thermal conductivity, a method for preparing the same, and a thermoelectric element including the same: MyV1-ySnxSb2Tex+3, wherein V is vacancy, M is at least one alkali metal, x≥6, and 0
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公开(公告)号：US20190383529A1
公开(公告)日：2019-12-19
申请号：US16440970
申请日：2019-06-13
Applicant: Mahle International GmbH
Inventor： Juergen Gruenwald , Peter Hinderer , Julien Mercier , Thomas Pfadler
Abstract: A method for operating a thermoelectric module may include creating a pulse width modulated control signal for controlling the thermoelectric module, converting the control signal into an operating signal having a direct voltage portion and an alternating voltage portion, and supplying the operating signal for operating the thermoelectric module to the thermoelectric module. The method may also include tapping the operating signal on the thermoelectric module and determining an electrical resistance of the thermoelectric module therefrom.
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公开(公告)号：US10475979B2
公开(公告)日：2019-11-12
申请号：US15461546
申请日：2017-03-17
Applicant: SAMSUNG ELECTRONICS CO., LTD
Inventor： Jong-soo Rhyee , Sang-mock Lee
IPC: H01L35/28 , C01B19/00 , C01G3/00 , C01G15/00 , C01G17/00 , C01G19/00 , C01G28/00 , C01G29/00 , H01L35/16 , H01L35/26
Abstract: A thermoelectric material containing a dichalcogenide compound represented by Formula 1 and having low thermoelectric conductivity and high Seebeck coefficient: RaTbX2-nYn (1) wherein R is a rare earth element, T includes at least one element selected from the group consisting of Group 1 elements, Group 2 elements, and a transition metal, X includes at least one element selected from the group consisting of S, Se, and Te, Y is different from X and includes at least one element selected from the group consisting of S, Se, Te, P, As, Sb, Bi, C, Si, Ge, Sn, B, Al, Ga and In, a is greater than 0 and less than or equal to 1, b is greater than or equal to 0 and less than 1, and n is greater than or equal to 0 and less than 2.
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公开(公告)号：US10454012B2
公开(公告)日：2019-10-22
申请号：US14402828
申请日：2012-05-22
Applicant: Akinori Nishide , Yosuke Kurosaki , Jun Hayakawa , Shin Yabuuchi , Hiroyuki Yamamoto
Inventor： Akinori Nishide , Yosuke Kurosaki , Jun Hayakawa , Shin Yabuuchi , Hiroyuki Yamamoto
Abstract: The present invention aims at providing a thermoelectric conversion module with low toxicity, which exhibits conversion efficiency equivalent to that of BiTe.The thermoelectric conversion module of the present invention employs a full Heusler alloy as the material for forming the P-type thermoelectric conversion unit and the N-type thermoelectric conversion unit. The material for forming the N-type thermoelectric conversion unit contains at least any one of Fe, Ti, and Si and Sn.
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公开(公告)号：US10427785B2
公开(公告)日：2019-10-01
申请号：US15476558
申请日：2017-03-31
Applicant: Intel Corporation
Inventor： Bradford H. Needham , Douglas Paul Bogia
Abstract: Various systems and methods for providing and deploying a power harvesting drone are described herein. A power harvesting drone includes a motor assembly; an energy replenishment coupler; a processor communicatively coupled to the energy replenishment coupler; and a memory storing instructions, which when executed by the processor cause the processor to: operate the power harvesting drone to navigate a predetermined path; determine that a power supply used to operate the power harvesting drone is below a threshold of remaining power; identify an opportunistic energy source; and deviate from the predetermined path to replenish at least a portion of the power supply from the opportunistic energy source using the energy replenishment coupler onboard the power harvesting drone.
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