-
公开(公告)号：US10431739B2
公开(公告)日：2019-10-01
申请号：US15858728
申请日：2017-12-29
Applicant: Micron Technology, Inc.
Inventor： Antonino Rigano , Fabio Pellizzer
Abstract: Clamp elements, memories, apparatuses, and methods for forming the same are disclosed herein. An example memory may include an array of memory cells and a plurality of clamp elements. A clamp element of the plurality of clamp elements may include a cell structure formed non-orthogonally relative to at least one of a bit line or a word line of the array of memory cells and may be configured to control a voltage of a respective bit line.
-
公开(公告)号：US20190295636A1
公开(公告)日：2019-09-26
申请号：US16436734
申请日：2019-06-10
Applicant: Micron Technology, Inc.
Inventor： Innocenzo Tortorelli , Russell L. Meyer , Agostino Pirovano , Andrea Redaelli , Lorenzo Fratin , Fabio Pellizzer
Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.
-
公开(公告)号：US10424728B2
公开(公告)日：2019-09-24
申请号：US15687038
申请日：2017-08-25
Applicant: Micron Technology, Inc.
Inventor： Lorenzo Fratin , Fabio Pellizzer
Abstract: A self-selecting memory cell may be composed of a memory material that changes threshold voltages based on the polarity of the voltage applied across it. Such a memory cell may be formed at the intersection of a conductive pillar and electrode plane in a memory array. A dielectric material may be formed between the memory material of the memory cell and the corresponding electrode plane. The dielectric material may form a barrier that prevents harmful interactions between the memory material and the material that makes up the electrode plane. In some cases, the dielectric material may also be positioned between the memory material and the conductive pillar to form a second dielectric barrier. The second dielectric barrier may increase the symmetry of the memory array or prevent harmful interactions between the memory material and an electrode cylinder or between the memory material and the conductive pillar.
-
公开(公告)号：US10424374B2
公开(公告)日：2019-09-24
申请号：US15582329
申请日：2017-04-28
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Agostino Pirovano , Innocenzo Tortorelli , Fabio Pellizzer
Abstract: Methods, systems, and devices for programming enhancement in memory cells are described. An asymmetrically shaped memory cell may enhance ion crowding at or near a particular electrode, which may be leveraged for accurately reading a stored value of the memory cell. Programming the memory cell may cause elements within the cell to separate, resulting in ion migration towards a particular electrode. The migration may depend on the polarity of the cell and may create a high resistivity region and low resistivity region within the cell. The memory cell may be sensed by applying a voltage across the cell. The resulting current may then encounter the high resistivity region and low resistivity region, and the orientation of the regions may be representative of a first or a second logic state of the cell.
-
公开(公告)号：US20190252606A1
公开(公告)日：2019-08-15
申请号：US15893108
申请日：2018-02-09
Applicant: Micron Technology, Inc.
Inventor： Agostino Pirovano , Kolya Yastrebenetsky , Anna Maria Conti , Fabio Pellizzer
Abstract: Methods, systems, and devices for memory cells with asymmetrical electrode interfaces are described. A memory cell with asymmetrical electrode interfaces may mitigate shorts in adjacent word lines, which may be leveraged for accurately reading a stored value of the memory cell. The memory device may include a self-selecting memory component with a top surface area in contact with a top electrode and a bottom surface area in contact with a bottom electrode, where the top surface area in contact with the top electrode is a different size than the bottom surface area in contact with the bottom electrode.
-
Patent Agency Ranking
公开(公告)号：US20190189206A1
公开(公告)日：2019-06-20
申请号：US15842504
申请日：2017-12-14
Applicant: Micron Technology, Inc.
Inventor： Innocenzo Tortorelli , Andrea Redaelli , Agostino Pirovano , Fabio Pellizzer , Mario Allegra , Paolo Fantini
CPC classification number: G11C13/0069 , G11C11/5678 , G11C13/0004 , G11C13/0026 , G11C13/0028 , G11C13/0038 , G11C13/004 , G11C13/0061 , G11C2013/0052 , G11C2013/0092 , G11C2213/30 , G11C2213/71 , H01L27/2463 , H01L45/1253 , H01L45/141
Abstract: Methods, systems, and devices related to techniques to access a self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more time durations during which a fixed level of voltage or current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.
-
公开(公告)号：US20190156885A1
公开(公告)日：2019-05-23
申请号：US16185154
申请日：2018-11-09
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer
CPC classification number: G11C13/0004 , G11C11/005 , G11C11/5678 , G11C13/0023 , G11C13/0026 , G11C13/0028 , G11C13/003 , G11C13/004 , G11C13/0069 , G11C2213/71 , G11C2213/73 , G11C2213/77
Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.
-
公开(公告)号：US20190156884A1
公开(公告)日：2019-05-23
申请号：US16185146
申请日：2018-11-09
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer
CPC classification number: G11C13/0004 , G11C11/005 , G11C11/5678 , G11C13/0023 , G11C13/0026 , G11C13/0028 , G11C13/003 , G11C13/004 , G11C13/0069 , G11C2213/71 , G11C2213/73 , G11C2213/77
Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.
-
公开(公告)号：US10283703B2
公开(公告)日：2019-05-07
申请号：US15689256
申请日：2017-08-29
Applicant: Micron Technology, Inc.
Inventor： Fabio Pellizzer , Innocenzo Tortorelli , Andrea Ghetti
Abstract: The disclosed technology generally relates to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same. Line stacks are formed, including a storage material line disposed over lower a conductive line. Upper conductive lines are formed over and crossing the line stacks, exposing portions of the line stacks between adjacent upper conductive lines. After forming the upper conductive lines, storage elements are formed at intersections between the lower conductive lines and the upper conductive lines by removing storage materials from exposed portions of the line stacks, such that each storage element is laterally surrounded by spaces. A continuous sealing material laterally surrounds each of the storage elements.
-
公开(公告)号：US10263039B2
公开(公告)日：2019-04-16
申请号：US15632536
申请日：2017-06-26
Applicant: Micron Technology, Inc.
Inventor： Fabio Pellizzer , Andrea Redaelli , Agostino Pirovano , Innocenzo Tortorelli
Abstract: The present disclosure includes memory cells having resistors, and methods of forming the same. An example method includes forming a first conductive line, forming a second conductive line, and forming a memory element between the first conductive line and the second conductive line. Forming the memory element can include forming one or more memory materials, and forming a resistor in series with the one or more memory materials. The resistor can be configured to reduce a capacitive discharge through the memory element during a state transition of the memory element.
-
-
-
-
-
-
-
-
-
Search Results
410
records
(took 0.032 seconds)
