公开(公告)号：US11507654B2

公开(公告)日：2022-11-22

申请号：US16994484

申请日：2020-08-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Maurizio Gentili ,  Massimo Panzica

IPC: G06F21/53 ,  G06F21/56 ,  G06F13/28 ,  G06F13/24 ,  H04L29/06 ,  G06F21/57 ,  H04L9/40 ,  G06F21/74 ,  G06F21/79

Abstract: A secure engine method includes providing an embedded microcontroller in an embedded device, the embedded microcontroller having internal memory. The method also includes providing a secure environment in the internal memory. The secure environment method recognizes a boot sequence and restricts user-level access to the secure environment by taking control over the secure environment memory. Taking such control may include disabling DMA controllers, configuring at least one memory controller for access to the secure environment, preventing the execution of instructions fetched from outside the secure environment, and only permitting execution of instructions fetched from within the secure environment. Secure engine program instructions are then executed to disable interrupts, perform at least one secure operation, and re-enable interrupts after performing the at least one secure operation. Control over the secure environment memory is released, which can include clearing memory, re-enabling DMA controllers, and restoring memory controller parameters.

公开(公告)号：US20220320014A1

公开(公告)日：2022-10-06

申请号：US17845867

申请日：2022-06-21

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey ARELLANO

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48

Abstract: In various embodiments, the present disclosure provides semiconductor devices, packages, and methods. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and an encapsulant on the die pad and the lead. A plurality of cavities extends into at least one of the die pad or the lead to a depth from a surface of the at least one of the die pad or the lead. The depth is within a range from 0.5 μm to 5 μm. The encapsulant extends into the plurality of cavities. The cavities facilitate improved adhesion between the die pad or lead and the encapsulant, as the cavities increase a surface area of contact with the encapsulant, and further increase a mechanical interlock with the encapsulant, as the cavities may have a rounded or semi-spherical shape.

公开(公告)号：US20220293498A1

公开(公告)日：2022-09-15

申请号：US17688013

申请日：2022-03-07

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Fulvio Vittorio FONTANA ,  Davide Maria BENELLI ,  Jefferson Sismundo TALLEDO

IPC: H01L23/495 ,  H01L23/16 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor device, such as a Quad-Flat No-lead (QFN) package, includes a semiconductor chip arranged on a die pad of a leadframe. The leadframe has an array of electrically-conductive leads around the die pad. The leads in the array have distal ends facing away from the die pad as well as recessed portions at an upper surface of the leads. Resilient material, such as low elasticity modulus material, is present at the upper surface of the leads and filling the recessed portions. An insulating encapsulation is molded onto the semiconductor chip. The resilient material is sandwiched between the insulating encapsulation and the distal ends of the leads. This resilient material facilitates flexibility of the leads, making them suited for reliable soldering to an insulated metal substrate.

公开(公告)号：US11407098B2

公开(公告)日：2022-08-09

申请号：US16696772

申请日：2019-11-26

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC.

Inventor： Marco Bianco ,  Lorenzo Bracco ,  Mahesh Chowdhary ,  Roberto Mura ,  Stefano Paolo Rivolta ,  Federico Rizzardini

IPC: B25F5/00 ,  B23B45/00 ,  G01C19/00

Abstract: A device for generating a control signal based on the linear movement of a linear member is provided. The device includes a linear member, a rotatable member, a first inertial measurement unit (IMU) coupled to the rotatable member and a second IMU having a fixed position. The device also includes a processing circuit which uses sensing signals from the IMUS to determine an attitude of the first IMU referenced to the second IMU and generate a control signal based on the attitude.

公开(公告)号：US11348863B2

公开(公告)日：2022-05-31

申请号：US16706414

申请日：2019-12-06

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: In various embodiments, the present disclosure provides semiconductor packages, devices, and methods. In one embodiment, a device includes a die pad, leads that are spaced apart from the die pad, and a semiconductor die on the die pad. The semiconductor die has a first surface and a second surface opposite the first surface. The second surface faces the die pad. An encapsulant is provided on the semiconductor die, the die pad and the leads, and the encapsulant has a first surface opposite the die pad and the leads, and a second surface opposite the first surface. The second surface of the encapsulant extends between the die pad and an adjacent lead. The second surface of the encapsulant is spaced apart from the first surface of the encapsulant by a first distance, and an exposed surface of the die pad is spaced apart from the first surface of the encapsulant by a second distance that is greater than the first distance.

公开(公告)号：US20220128360A1

公开(公告)日：2022-04-28

申请号：US17571973

申请日：2022-01-10

Applicant: STMicroelectronics, Inc.

Inventor： Yamu HU ,  Deyou FANG ,  David MCCLURE ,  Huantong ZHANG ,  Naren K. SAHOO

IPC: G01C19/5719 ,  H04L27/38

Abstract: A microelectromechanical system (MEMS) gyroscope sensor has a sensing mass and a quadrature error compensation control loop for applying a force to the sensing mass to cancel quadrature error. To detect fault, the quadrature error compensation control loop is opened and an additional force is applied to produce a physical displacement of the sensing mass. A quadrature error resulting from the physical displacement of the sensing mass in response to the applied additional force is sensed. The sensed quadrature error is compared to an expected value corresponding to the applied additional force and a fault alert is generated if the comparison is not satisfied.

公开(公告)号：US11270894B2

公开(公告)日：2022-03-08

申请号：US15876046

申请日：2018-01-19

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Godfrey Dimayuga

IPC: H01L21/48 ,  H05K3/32 ,  H01L23/498 ,  H05K3/28 ,  G01P15/08 ,  H05K3/34 ,  H01L23/31

Abstract: One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

公开(公告)号：US11250224B2

公开(公告)日：2022-02-15

申请号：US17108646

申请日：2020-12-01

Applicant: STMicroelectronics, Inc.

Inventor： John N. Tran

IPC: G06K7/10 ,  G06K19/07

Abstract: A method includes providing a power supply package (PSP) that includes a power supply, an RFID tag, and a power switch, where a control terminal of the power switch is coupled to an output terminal of the RFID tag, and load path terminals of the power switch are coupled between an output terminal of the PSP and a first terminal of the power supply, where a control register of the RFID tag is pre-programmed with a first value such that the RFID tag is configured to generate a first control signal that turns off the power switch; receiving, by the RFID tag, a second value for the control register of the RFID tag; and writing, by the RFID tag, the second value to the control register of the RFID tag such that the RFID tag is configured to generate a second control signal that turns on the power switch.

公开(公告)号：US20210409914A1

公开(公告)日：2021-12-30

申请号：US17356180

申请日：2021-06-23

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS S.r.l.

Inventor： Karimuddin SAYED ,  Chandandeep Singh PABLA ,  Lorenzo BRACCO ,  Federico RIZZARDINI

IPC: H04W4/38 ,  H04W4/70 ,  G01D9/00 ,  G01D5/244

Abstract: In an embodiment, a device comprises a memory, which, in operation, stores data samples associated with a plurality of data sensors, and circuitry, coupled to the memory, wherein the circuitry, in operation, generates synchronized output data sets associated with the plurality of data sensors. Generating a synchronized output data set includes: determining a reference sample associated with a sensor of the plurality of sensors; verifying a timing validity of a data sample associated with another sensor of the plurality of sensors; identifying a closest-in-time data sample associated with the another sensor of the plurality of sensors with respect to the reference sample; and generating the synchronized output data set based on interpolation.

公开(公告)号：US20210313255A1

公开(公告)日：2021-10-07

申请号：US17353684

申请日：2021-06-21

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey ARELLANO ,  Aaron CADAG ,  Ela Mia CADAG

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.