Abstract:
A light docking station applied to at least one portable electronic device, including: a bottom board module, a casing module, a circuit module, a first input/output module, a second input/output module, and a retaining module. The casing module has a casing mating with the bottom board module. The circuit module is disposed inside the casing of the casing module. The first input/output module is disposed on the casing of the casing module and electrically connected between the circuit module and a plurality of different peripherals. The second input/output module is disposed on the casing of the casing module and electrically connected between the circuit module and an external connector of the portable electronic device. The retaining module is disposed on a top side of the casing in order to mate with two retaining grooves that are disposed on a bottom side of the portable electronic device.
Abstract:
A dimmer device enables wireless control of intensity of light output of an electric light source and includes a light dimmer for coupling electrically with the light source. The light dimmer includes a power supply module for outputting a supply power, a dimmer module operable to vary the supply power to result in drive power that is supplied to the light source, a feedback module for generating a feedback signal in accordance with the drive power, the feedback signal corresponding to a current intensity of the light output of the light source, a wireless receiver unit for receiving a control signal from a remote controller and providing the control signal to the dimmer module for controlling the dimmer module to vary the supply power in accordance with the control signal, and a wireless transmitter unit for transmitting the feedback signal from the feedback module.
Abstract:
A custom assembly light-emitting module using plugs and jacks for obtaining vertical electrical connections, includes a light-emitting unit, a lens unit, a plug unit and a jack unit. The lens unit is detachably combined with the light-emitting unit. The plug unit is disposed beside one side of the lens unit and electrically connected with the light-emitting unit. The jack unit is disposed on a bottom side of the plug unit and electrically connected with the plug unit. In addition, the light-emitting unit has two first retaining structures being formed on two opposite lateral sides thereof, the lens unit has a hollow transparent structure and a lens integratedly with the hollow transparent structure, two second retaining structures are disposed in the hollow transparent structure, and the light-emitting unit is detachably disposed in the hollow transparent structure.
Abstract:
The present invention relates to a light-emitting diode (LED) tube structure, which comprises a lamp cover and a light-emitting assembly. The light-emitting assembly is disposed under the lamp cover; and a condenser film or a diffuser film is disposed above the light-emitting assembly. By using the condenser film or the diffuser film, the light emitted by LEDs can be condensed or diffused for using.
Abstract:
Disclosed are data communication techniques which facilitate data communication between multiple processes operable within a computing environment or environments and which may be implemented upon any of a plurality of operating systems without substantial modification or adaptation. The data communication techniques preferably provide communication between and among three or more processes simultaneously and processes may join and leave data communication conversations dynamically. A shared memory area is preferably defined into which data communicated between various processes is copied, thereby allowing a short pipe message to be communicated between processes while facilitating the transfer of large amounts of data without suspending operation of a transmitting and receiving processes for relatively long periods of time. Data communication is preferably arbitrated by an external arbitrator which may provide additional functionality such as process management such that when a process is unexpectedly terminated the process is automatically re-invoked and the communication channels re-established.
Abstract:
A computer includes a computer case, a motherboard, a cable box, a power supply and a peripheral component. The computer case has a first disk drive slot and a second disk drive slot within the inner portion thereof. The cable box is installed in the first disk drive slot. The power supply is connected with the cable box through a power cord. The peripheral component is installed in the second disk drive slot, wherein electricity is transmitted from the power supply to the peripheral component through the cable box.
Abstract:
A switch power supply includes an AC/DC converter, a DC/DC converter, a battery charge-discharge switching circuit, and a detecting and controlling circuit. The AC/DC converter receives an input AC voltage and converts the input AC voltage into a DC voltage. The DC/DC converter converts the DC voltage into several working voltages required for operating the electronic device. The battery charge-discharge switching circuit is selectively connected to the AC/DC converter or the DC/DC converter and connected to the battery. The detecting and controlling circuit detects the input AC voltage. If the input AC voltage is abnormal, the detecting and controlling circuit issues a control signal to the battery charge-discharge switching circuit. In response to the control signal, the battery issues a discharge voltage to the DC/DC converter and the discharge voltage is converted into the working voltages by the DC/DC converter.
Abstract:
A wafer level packaging structure with inductors and manufacture method thereof. The method comprises providing a substrate, having several inductors, forming conductive lines and holes to connect the inductors and the wafer, and bonding the substrate and the wafer via bonding pads. Therefore, there are air gaps between the inductors and the wafer, thereby reducing the inductor's dispassion loss and increasing the inductor's quality factor. In addition, the inductors having a high quality factor can be integrated in the wafer containing active/passive components.
Abstract:
A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the PCB will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.
Abstract:
A three-dimensionally vibration-preventing buffering mechanism is proposed, which is designed for use in conjunction with a dynamic module for the purpose of buffering the three dimensional vibrations of the dynamic module during operation, and which is characterized by the use of a group of specially-designed chained elastic members, each being composed of at least three integrally-linked flexure hinges whose axes of concavity are oriented respectively in parallel with the three axes of a three-dimensional rectangular coordinate system, so that the vibrations of the dynamic module in all three dimensional directions can be respectively buffered by these flexure hinges to provide a three-dimensional vibration-preventing buffering effect.