公开(公告)号：US20050094083A1

公开(公告)日：2005-05-05

申请号：US10875292

申请日：2004-06-25

Applicant: Keuk Kwon ,  Myung You ,  In Kang ,  Young Kim

Inventor： Keuk Kwon ,  Myung You ,  In Kang ,  Young Kim

IPC: G02F1/1345 ,  G02F1/133 ,  G02F1/1362 ,  H01L21/00 ,  H05K3/00

CPC classification number: G02F1/133382 ,  G02F1/136286

Abstract: A thin and compact liquid crystal display device includes a liquid crystal display panel with first and second substrates, each having a display area and a non-display area, which are bonded to each other and separated from each other by liquid crystal material. A thermally conductive layer is formed on any one of the first and second substrates to prevent the liquid crystal material from becoming too cool, thereby preventing temperature-dependent formation of bubbles within the liquid crystal material. Such a liquid crystal display device may be simply fabricated.

Abstract translation: 薄型紧凑型液晶显示装置包括具有第一和第二基板的液晶显示面板，每个具有显示区域和非显示区域，它们彼此结合并通过液晶材料彼此分离。 在第一基板和第二基板中的任一个上形成导热层，以防止液晶材料变得太冷，从而防止液晶材料内气泡的温度依赖性的形成。 这样的液晶显示装置可以简单地制造。

公开(公告)号：US09287551B2

公开(公告)日：2016-03-15

申请号：US13984486

申请日：2012-02-24

Applicant: Tae In Kang ,  Young Su Kim ,  Doo Sun Choi

Inventor： Tae In Kang ,  Young Su Kim ,  Doo Sun Choi

IPC: H01R43/16 ,  H01M2/30 ,  H01M10/0525

CPC classification number: H01M2/30 ,  H01M2/305 ,  H01M10/0525 ,  H01M2220/20 ,  Y02E60/122 ,  Y02P70/54 ,  Y02T10/7011 ,  Y10T29/49204

Abstract: The present invention relates to an apparatus and method for manufacturing a battery terminal plate, and more particularly relates to an apparatus and method for manufacturing a battery terminal plate, in which a terminal plate for a secondary battery, such as a middle or large sized Lithium ion battery, which is applied to electric vehicles, hybrid vehicles, plug-in hybrid vehicles, solar cells, electric tools and so on, is processed by not pressing but forging, a shifting and supplying apparatus for shifting a material to be processed in each forming and processing step may be moved by the shortest distance through a shift-return method (one step shift-return), the material is previously processed by punching so as not to satisfy a standard of a design, and the firstly processed material is secondly processed to satisfy the standard.

Abstract translation: 电池端子板的制造方法及其制造方法技术领域本发明涉及一种电池端子板的制造装置及其制造方法，更具体地说，涉及一种电池端子板的制造方法及其制造方法，其中， 用于电动车辆，混合动力车辆，插电式混合动力车辆，太阳能电池，电动工具等的离子电池通过不按压锻造而被加工，用于将每个 成形加工步骤可以通过移位返回法移动最短距离（一步换档返回），该材料预先通过冲压加工而不满足设计标准，并且首先处理的材料是二次 加工满足标准。

公开(公告)号：US20140366366A1

公开(公告)日：2014-12-18

申请号：US14360575

申请日：2013-01-09

Applicant: Tae In Kang ,  Young Su Kim

Inventor： Tae In Kang ,  Young Su Kim

IPC: H01M2/30

CPC classification number: H01M2/30 ,  H01M2/342 ,  H01M2220/20 ,  Y10T29/49108

Abstract: A method of manufacturing a battery terminal plate includes primarily pressing a single processing material corresponding to a volume body into a semi-product having an asymmetric shape through a press cutting unit; gripping the semi-product and feeding the semi-product to a first processing unit by a pickup unit; asymmetrically pressing the semi-product by a first punch to primarily forge the semi-product into a volume body part and a plate part; pressing the semi-product located in the first processing unit by a second punch to secondarily forge the semi-product while forming a detailed structure at the volume body part and the plate part; pressing the semi-product with a pressure stronger than that in the second forging step by a third punch to tertiary forge the semi-product; and punching the semi-product by a cutting/trimming unit to removing the pickup gripping member and cutting an outer peripheral portion into a final product.

Abstract translation: 制造电池端子板的方法主要包括通过压力切割单元将对应于体积体的单个加工材料压制成具有不对称形状的半成品; 夹住半成品并通过拾取单元将半成品送入第一处理单元; 通过第一冲头对半成品进行不对称挤压，以将半成品主要锻造成体积体部分和板部分; 通过第二冲头挤压位于第一处理单元中的半成品，以二次锻造半成品，同时在体积体部分和板部分形成详细结构; 通过第三次冲压将第二锻造步骤中的压力比第二冲压强的半成品加工成三级锻造半成品; 并且通过切割/修剪单元冲压半成品以去除拾取夹持构件并将外围部分切割成最终产品。

公开(公告)号：US20140110745A1

公开(公告)日：2014-04-24

申请号：US14124974

申请日：2012-02-02

Applicant: Jae Jin Lee ,  Sung Ho Choi ,  Duk In Kang

Inventor： Jae Jin Lee ,  Sung Ho Choi ,  Duk In Kang

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L27/32 ,  H01L33/642 ,  H01L33/647 ,  H01L51/50 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An LED package includes a lead frame, a housing part, and a lead heat dissipating part. The lead frame includes a first lead mounting an LED chip and a second lead spaced apart from the first lead. The housing part covers a portion of the lead frame and includes an opening part for exposing the LED chip, a first side corresponding to a support side contacting the first lead and the second lead, and a second side opposite to the first side. The lead heat dissipating part is extended from the first lead and exposed partially to the first side of the housing part. Herein, the first side of the housing part is thicker than the second side.

Abstract translation: LED封装包括引线框架，壳体部分和引线散热部件。 引线框架包括安装LED芯片的第一引线和与第一引线间隔开的第二引线。 壳体部分覆盖引线框架的一部分并且包括用于暴露LED芯片的开口部分，对应于接触第一引线和第二引线的支撑侧的第一侧和与第一侧相对的第二侧。 引线散热部分从第一引线延伸并部分暴露于壳体部分的第一侧。 这里，壳体部分的第一侧比第二侧厚。

公开(公告)号：US20130135360A1

公开(公告)日：2013-05-30

申请号：US13409951

申请日：2012-03-01

Applicant: Jun-Ho HWANG ,  Sung-In Kang ,  Yong-Jin Shin ,  Seung-Woon Shin

Inventor： Jun-Ho HWANG ,  Sung-In Kang ,  Yong-Jin Shin ,  Seung-Woon Shin

IPC: G09G5/10 ,  G09G5/00

CPC classification number: G09G3/3607 ,  G09G3/3614 ,  G09G3/3648 ,  G09G2310/0205 ,  G09G2310/0251 ,  G09G2310/067 ,  G09G2320/0209 ,  G09G2320/0242

Abstract: A display device includes first, second, and third gate lines. The display device further includes a first data line and a second data line neighboring the first data line. The display device further includes first, second, and third pixel electrodes connected to the first, second, and third gate lines, respectively, and further includes a fourth pixel electrode connected to the second gate line. The fourth pixel electrode is disposed between the first and third electrodes and neighbors each of the first, second, and third pixel electrodes. The first, second, and third pixel electrodes are connected to the first data line. The display device further comprises a gate driver for applying copies of a gate-on voltage to the gate lines, the gate-on voltage including a first voltage in a first horizontal period, a second voltage in a second horizontal period, and a third voltage in a third horizontal period.

Abstract translation: 显示装置包括第一，第二和第三栅极线。 显示装置还包括与第一数据线相邻的第一数据线和第二数据线。 显示装置还包括分别连接到第一，第二和第三栅极线的第一，第二和第三像素电极，并且还包括连接到第二栅极线的第四像素电极。 第四像素电极设置在第一和第三电极之间并且邻近第一，第二和第三像素电极中的每一个。 第一，第二和第三像素电极连接到第一数据线。 显示装置还包括栅极驱动器，用于向栅极线施加栅极导通电压的拷贝，栅极导通电压包括第一水平周期中的第一电压，第二水平周期中的第二电压和第三电压 在第三个水平的时期。

公开(公告)号：US07776136B2

公开(公告)日：2010-08-17

申请号：US10539743

申请日：2003-12-19

Applicant: Hoo-Geun Lee ,  Sung-Kee Shin ,  Tae-In Kang ,  Chang-Oh Kang ,  Kwang-Hee Lee ,  Sang-Hoon Joo ,  Sung-Gon Kim ,  Deuk-Chae Kim

Inventor： Hoo-Geun Lee ,  Sung-Kee Shin ,  Tae-In Kang ,  Chang-Oh Kang ,  Kwang-Hee Lee ,  Sang-Hoon Joo ,  Sung-Gon Kim ,  Deuk-Chae Kim

IPC: C22B1/14 ,  B30B9/28

CPC classification number: F27B19/04 ,  B30B11/16 ,  C21B13/002 ,  C21B13/0086 ,  C21B13/023 ,  C21B13/14 ,  C21B13/143 ,  C22B1/24 ,  C22B1/248 ,  C22B5/10 ,  C22B5/14 ,  F27B3/18 ,  F27B15/003 ,  F27D3/0024 ,  F27D3/0025 ,  F27D3/0033 ,  F27D3/10

Abstract: A method for manufacturing molten iron including the steps of producing reducing material of mixed hot fine direct reduced iron and calcined additives, the reducing material being produced from multiple fluidized beds; charging the reducing material to at least one pair of roller presses; roll pressing the reducing material through the one pair of roller presses to produce continuous compacted material having protrusions formed on pressed surfaces; crushing the compacted material; charging the crushed compacted material to a coal packed bed; and supplying oxygen to the coal packed bed to manufacture molten iron, wherein in the producing compacted material, the compacted material is formed such that acute and obtuse angles are formed between a center line formed along a length of a cross section that is cut along a lengthwise direction perpendicular to an axial direction of the roller presses and connecting lines that connect grooves closest to each other across the cross sectional area. An apparatus for manufacturing molten iron performs the inventive method for manufacturing molten iron. The processes involved in manufacturing molten iron using the invention are convenient, efficient, improve productivity, and allow for more flexibility with respect to equipment operation during the manufacture of compacted material.

Abstract translation: 一种制造铁水的方法，包括以下步骤：制备混合的热精细直馏还原铁和煅烧添加剂的还原材料，所述还原材料由多个流化床制成; 将还原材料装入至少一对辊压机中; 通过一对辊压机辊压压缩还原材料以产生具有形成在压制表面上的突起的连续压实材料; 压碎压实材料; 将粉碎的压实材料装入煤包装床; 并向煤填充床供氧以制造铁水，其中，在生产压实材料中，形成压实材料，使得沿沿着沿着切割的横截面长度形成的中心线形成锐角和钝角 垂直于辊的轴向的纵向方向挤压和连接在横截面上彼此最接近的槽的连接线。 用于制造铁水的设备执行本发明的用于制造铁水的方法。 使用本发明制造铁水所涉及的方法方便，有效，提高生产率，并且在制造压实材料期间允许相对于设备操作具有更大的灵活性。

公开(公告)号：US07670548B2

公开(公告)日：2010-03-02

申请号：US12019687

申请日：2008-01-25

Applicant: Young Woo Lee ,  Kyung In Kang ,  Byung Wook Jeong ,  Jai Pil Jung ,  Ki Ju Lee ,  Hee Yul Lee

Inventor： Young Woo Lee ,  Kyung In Kang ,  Byung Wook Jeong ,  Jai Pil Jung ,  Ki Ju Lee ,  Hee Yul Lee

IPC: C22C13/02

CPC classification number: B23K35/262 ,  B23K35/0222

Abstract: A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.

Abstract translation: 提供无铅焊料。 无铅焊料包括约1.5重量％至约2.5重量％的银（Ag），约3重量％至约6重量％的铋（Bi），约0.005重量％至约0.1重量％的脱氧剂，余量 的锡（Sn）。 无铅焊料具有改进的润湿性，降低的熔点，在焊料槽中几乎或基本上不形成氧化层，抑制脆性，改善的耐热冲击性和耐滴落性。

公开(公告)号：US07665621B2

公开(公告)日：2010-02-23

申请号：US12033774

申请日：2008-02-19

Applicant: Nak Ju Doh ,  Gwi Tae Park ,  Kyung In Kang ,  Ung Kyun Lee ,  Tae Hoon Kim ,  Sung Hoon An ,  Tae Koo Kang ,  Jeong Eom Lee ,  Seoung Kyou Lee

Inventor： Nak Ju Doh ,  Gwi Tae Park ,  Kyung In Kang ,  Ung Kyun Lee ,  Tae Hoon Kim ,  Sung Hoon An ,  Tae Koo Kang ,  Jeong Eom Lee ,  Seoung Kyou Lee

IPC: B66C23/18

CPC classification number: B66C23/32 ,  B66C23/24 ,  B66C23/62

Abstract: A self movable boom system is provided. The self movable boom system include: a boom disposed on a plane perpendicular to a building clamp structure; and a moving unit apparatus including a circumferential moving unit which is disposed between the boom and the building clamp structure to move the boom on a plane perpendicular to the building clamp structure, a lifting-up unit of which one end is disposed toward the circumferential moving unit and of which other end is disposed toward the building clamp structure to move the boom along a longitudinal direction of the building clamp structure, and a boom moving unit which moves an object along the longitudinal direction of the building clamp structure and along a longitudinal direction of the boom.

Abstract translation: 提供了一种自动动臂系统。 自动起重臂系统包括：设置在垂直于建筑物夹具结构的平面上的起重臂; 以及移动单元装置，包括周边移动单元，其设置在所述起重臂和所述建筑夹具结构之间，以使所述悬臂在垂直于所述建筑夹具结构的平面上移动;升降单元，其一端朝向所述周向移动 单元，并且其另一端被设置成朝向建筑物夹具结构沿着构建夹具结构的纵向移动动臂;以及起重臂移动单元，其沿着建筑物夹具结构的纵向移动物体并且沿着纵向方向 的繁荣。

公开(公告)号：US20090108461A1

公开(公告)日：2009-04-30

申请号：US11967267

申请日：2007-12-31

Applicant: Dae In KANG

Inventor： Dae In KANG

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76804 ,  H01L27/10814 ,  H01L27/10855 ,  H01L28/90

Abstract: A method of fabricating a semiconductor device includes providing a semiconductor substrate including a first landing plug and a second landing plug. A bit line is formed over the semiconductor substrate. The bit line is electrically coupled to the first landing plug. A stacked structure of an etch stop film and an interlayer insulating film is deposited over the semiconductor substrate including the bit line. The stacked structure is selectively etched using a contact mask to form a contact hole having an upper part that is wider than a lower part of the contact hole. The contact hole exposes the second landing plug. A contact plug is formed over the contact hole. The contact plug is electrically coupled to the second landing plug.

Abstract translation: 一种制造半导体器件的方法包括提供包括第一着陆插头和第二着陆插头的半导体衬底。 在半导体衬底上形成位线。 位线电耦合到第一着陆插头。 在包括位线的半导体衬底上沉积蚀刻停止膜和层间绝缘膜的层叠结构。 使用接触掩模选择性地蚀刻层叠结构，以形成具有比接触孔的下部更宽的上部的接触孔。 接触孔露出第二个着陆塞。 在接触孔上形成接触塞。 接触塞电耦合到第二着陆栓。

公开(公告)号：US20090039043A1

公开(公告)日：2009-02-12

申请号：US12033774

申请日：2008-02-19

Applicant: Nak Ju DOH ,  Gwi Tae Park ,  Kyung In Kang ,  Ung Kyun Lee ,  Tae Hoon Kim ,  Sung Hoon An ,  Tae Koo Kang ,  Jeong Eom Lee ,  Seoung Kyou Lee

Inventor： Nak Ju DOH ,  Gwi Tae Park ,  Kyung In Kang ,  Ung Kyun Lee ,  Tae Hoon Kim ,  Sung Hoon An ,  Tae Koo Kang ,  Jeong Eom Lee ,  Seoung Kyou Lee

IPC: B66C23/42

CPC classification number: B66C23/32 ,  B66C23/24 ,  B66C23/62

Abstract: A self movable boom system is provided. The self movable boom system include: a boom disposed on a plane perpendicular to a building clamp structure; and a moving unit apparatus including a circumferential moving unit which is disposed between the boom and the building clamp structure to move the boom on a plane perpendicular to the building clamp structure, a lifting-up unit of which one end is disposed toward the circumferential moving unit and of which other end is disposed toward the building clamp structure to move the boom along a longitudinal direction of the building clamp structure, and a boom moving unit which moves an object along the longitudinal direction of the building clamp structure and along a longitudinal direction of the boom.

Abstract translation: 提供了一种自动动臂系统。 自动起重臂系统包括：设置在垂直于建筑物夹具结构的平面上的起重臂; 以及移动单元装置，包括周边移动单元，其设置在所述起重臂和所述建筑夹具结构之间，以使所述悬臂在垂直于所述建筑夹具结构的平面上移动;升降单元，其一端朝向所述周向移动 单元，并且其另一端被设置成朝向建筑物夹具结构沿着构建夹具结构的纵向移动动臂;以及起重臂移动单元，其沿着建筑物夹具结构的纵向移动物体并且沿着纵向方向 的繁荣。