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    CROSSOVERS FOR VACUUM PACKAGING
    32.
    发明申请
    CROSSOVERS FOR VACUUM PACKAGING 有权

    公开(公告)号：US20220411261A1

    公开(公告)日：2022-12-29

    申请号：US17801230

    申请日：2021-02-19

    Applicant: Obsidian Sensors, Inc.

    Inventor： John HONG ,  Tallis CHANG ,  Sean ANDREWS ,  Jan BOS ,  Jia-Wei MA

    IPC: B81C1/00 ,  B81B7/00

    Abstract: In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.

    MEMS SENSORS AND SYSTEMS
    34.
    发明申请
    MEMS SENSORS AND SYSTEMS 有权

    公开(公告)号：US20210164839A1

    公开(公告)日：2021-06-03

    申请号：US17267789

    申请日：2019-08-09

    Applicant: Obsidian Sensors, Inc.

    Inventor： John HONG ,  Bing WEN ,  Edward CHAN ,  Tallis CHANG ,  Sean ANDREWS

    IPC: G01J5/02 ,  G01J5/20 ,  B81B3/00

    Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.

    READOUT CIRCUITS AND METHODS
    35.
    发明申请
    READOUT CIRCUITS AND METHODS 有权

    公开(公告)号：US20210102844A1

    公开(公告)日：2021-04-08

    申请号：US17048046

    申请日：2019-04-17

    Applicant: Obsidian Sensors, Inc.

    Inventor： Edward CHAN ,  Bing WEN ,  John HONG ,  Tallis CHANG ,  Seung-Tak RYU

    IPC: G01J5/24 ,  G01J5/02 ,  G01J1/42 ,  H04N5/33 ,  G01J1/46

    Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

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