Feed-through terminal block module
    32.
    发明授权

    公开(公告)号:US10594059B1

    公开(公告)日:2020-03-17

    申请号:US16245840

    申请日:2019-01-11

    Abstract: A feed-through terminal block module includes first and second electrical terminals, a first current bar, and a second current bar, the terminals and current bars in a terminal housing. The first current bar permanently electrically connects the first and second terminals. The first current bar includes a first contact portion of the module. The second current bar includes a second contact portion of the module and a third contact portion of the module. A removable contact plug is inserted into the housing to selectively electrically connect the first and second contact portions. Removable bridge pins or a bridging current bar electrically connects the third contact portions of adjacent modules when modules are placed side-by-side to form a terminal block.

    Enclosure with multiple heat dissipating surfaces

    公开(公告)号:US09678546B2

    公开(公告)日:2017-06-13

    申请号:US15091944

    申请日:2016-04-06

    Abstract: A fanless industrial computer enclosure dissipates heat generated by the hottest components on heat sinks dedicated to respective heat zones within the enclosure. Heat generated by the component that operates at the highest temperature in each heat zone is conducted to a heat sink on the exterior of the enclosure. Using a heat sink dedicated to each heat zone, heat generated by components such as an industrial computer, storage devices, power supply, or other electrical components, is dissipated on the outer surface of the enclosure to the surrounding ambient environment. Providing a low resistance heat conductive path from the hottest components to respective heat sinks to dissipate heat outside the enclosure from each heat zone creates an environment within the enclosure where disk drives do not exceed the specified upper operating temperature rating without regard to the operating temperature of other electrical components in the enclosure.

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