公开(公告)号：USD609828S1

公开(公告)日：2010-02-09

申请号：US29338365

申请日：2009-06-10

Applicant: Ping-Yu Chen ,  Ying-Chieh Lu ,  Zheng-Jay Huang ,  Chien-Ting Lu ,  Hsin-Fei Huang ,  Yu-Shu Chen ,  Shan-Ju Lin

Designer： Ping-Yu Chen ,  Ying-Chieh Lu ,  Zheng-Jay Huang ,  Chien-Ting Lu ,  Hsin-Fei Huang ,  Yu-Shu Chen ,  Shan-Ju Lin

公开(公告)号：US20100014016A1

公开(公告)日：2010-01-21

申请号：US12504730

申请日：2009-07-17

Applicant: Ming-Da Chen ,  Ping-Yu Liang ,  Chin-Liang Chen

Inventor： Ming-Da Chen ,  Ping-Yu Liang ,  Chin-Liang Chen

IPC: G02F1/1333 ,  G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2202/22 ,  H05K1/0215 ,  H05K1/0393 ,  H05K2201/09063 ,  H05K2201/091

Abstract: A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.

Abstract translation: 提供了用于设置在液晶模块的框架和导电壳体之间的柔性印刷电路。 框架包括主板和连接到主板一侧的侧板。 柔性印刷电路包括主体和接地部分。 主体用于设置在框架的主板上。 接地部分从主体延伸。 接地部分相对于本体弯曲到预定角度，使得接地部分设置在框架的侧板上。 接地部分具有与导电壳体的侧板的内壁接触的金属层。 柔性印刷电路具有位于接地部与主体连接的位置的孔。

公开(公告)号：US20090269952A1

公开(公告)日：2009-10-29

申请号：US12241052

申请日：2008-09-30

Applicant: JIAN-PING YU ,  CUI-JUN LU

Inventor： JIAN-PING YU ,  CUI-JUN LU

IPC: H05K1/00

CPC classification number: H01L23/467 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T24/42 ,  H01L2924/00

Abstract: A fastening assembly used for securing a heat dissipation device to a printed circuit board, comprises a sleeve, an inserting device extending through the sleeve, a spring encircling the inserting device and received in the sleeve, and a supporting device inserted in the sleeve. The inserting device engages with a back plate below the printed circuit board. The sleeve is integrally formed of plastic and comprises a hollow body, a resilient portion extending from an outer surface of the body and pressing a bottom of the heat dissipation device upwardly, and four supporting portions extending from the outer surface of the body and pressing a top of the heat dissipation device downwardly. The supporting device is inserted between the body and the resilient portion, and abuts against the resilient portion, to thereby reliably keep the resilient portion at its locked position.

Abstract translation: 用于将散热装置固定到印刷电路板上的紧固组件包括套筒，穿过套筒延伸的插入装置，围绕插入装置的弹簧并被套在套筒中，以及插入套筒中的支撑装置。 插入装置与印刷电路板下面的背板接合。 套筒由塑料一体形成，包括中空体，弹性部分从主体的外表面延伸并向上按压散热装置的底部;以及四个支撑部分，从主体的外表面延伸并按压 散热装置的顶部向下。 支撑装置插入在主体和弹性部分之间，并抵靠弹性部分，从而可靠地将弹性部分保持在其锁定位置。

公开(公告)号：US20090132737A1

公开(公告)日：2009-05-21

申请号：US12178322

申请日：2008-07-23

Applicant: YUNG SHUN HUANG ,  JIN NENG WU ,  PING YU CHEN ,  NIEN CHIN WU

Inventor： YUNG SHUN HUANG ,  JIN NENG WU ,  PING YU CHEN ,  NIEN CHIN WU

IPC: G06F13/12

CPC classification number: H04L12/2838 ,  G06F13/102 ,  G06F2213/0038 ,  G06F2213/0058 ,  H04L12/2818 ,  H04L61/2015 ,  H04L69/32

Abstract: A remote interface apparatus comprises a network interface, a peripheral device interface, an interface-providing mechanism and a network address setting mechanism. The network interface is configured to communicate with a remote host. The peripheral device interface is configured to connect to a peripheral device. The interface-providing mechanism cooperates with the network interface to transfer the peripheral device interface into a remote peripheral device connection port of the host. The network address setting mechanism is configured to automatically obtain a network address upon a connection to the network, and to broadcast information of the peripheral device interface.

Abstract translation: 远程接口设备包括网络接口，外围设备接口，接口提供机制和网络地址设置机制。 网络接口被配置为与远程主机进行通信。 外围设备接口被配置为连接到外围设备。 接口提供机制与网络接口协作，将外围设备接口传输到主机的远程外围设备连接端口。 网络地址设置机制被配置为在连接到网络时自动获得网络地址，并且广播外围设备接口的信息。

公开(公告)号：US20090080205A1

公开(公告)日：2009-03-26

申请号：US11959296

申请日：2007-12-18

Applicant: SU-CHI CHANG ,  YING-CHIEH LU ,  PING-YU CHEN ,  SHIAO-WEN LU ,  WEN-JANG JIANG ,  HUNG-KUANG HSU

Inventor： SU-CHI CHANG ,  YING-CHIEH LU ,  PING-YU CHEN ,  SHIAO-WEN LU ,  WEN-JANG JIANG ,  HUNG-KUANG HSU

IPC: F21V21/00 ,  F21V29/00

CPC classification number: F21V29/74 ,  F21K9/232 ,  F21V23/001 ,  F21V29/75 ,  F21V29/767 ,  F21V29/773 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a centre thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.

Abstract translation: 用于照明的LED灯包括灯座，散热器，多个LED模块和鼓风机。 灯座包围内部空间并在其中限定多个通风口。 通风口将内部空间与周围的气氛进行沟通。 散热器包括在其中心处的气缸。 气缸在其中具有通孔，其与灯座的内部空间和通风孔连通并与其配合以形成空气通道。 LED模块连接到散热器的周边。 鼓风机产生通过空气通道循环的气流，从而散发由LED模块产生的热量。

公开(公告)号：US20090059532A1

公开(公告)日：2009-03-05

申请号：US11849128

申请日：2007-08-31

Applicant: DONG-YUN LI ,  WEI WU ,  JIAN-PING YU

Inventor： DONG-YUN LI ,  WEI WU ,  JIAN-PING YU

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.

Abstract translation: 电子系统包括外壳，外壳中的印刷电路板和包括保持构件的散热器组件。 所述外壳包括第一面板和与所述第一面板垂直连接的第二面板。 印刷电路板安装在外壳的第一个面板上。 散热器组件具有安装在印刷电路板上的第一端，用于接触印刷电路板上的发热电子器件和与第一端相对的第二端。 保持构件将外壳的第二面板与散热器组件的第二端连接。

公开(公告)号：US20090034199A1

公开(公告)日：2009-02-05

申请号：US11831932

申请日：2007-07-31

Applicant: JIAN-PING YU ,  DONG-YUN LI ,  WEI WU

Inventor： JIAN-PING YU ,  DONG-YUN LI ,  WEI WU

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  Y10T24/44034 ,  Y10T24/44556 ,  H01L2924/00

Abstract: A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.

Abstract translation: 散热器组件包括散热器和用于将散热器安装到印刷电路板的电子部件的夹子。 散热器包括基部和从基部延伸的多个翅片。 该夹子包括一个按压件和一对形成在按压件相对两端上的细长臂。 按压构件具有朝向散热器的基部突出的下部。 翅片的中间一个以使得按压构件的下部弹性地抵靠散热器的方式向上延伸穿过按压构件。 两个臂位于散热器的相对侧面上并向下弯曲以与印刷电路板接合，使得按压构件朝向电子部件施加力。

公开(公告)号：USD580429S1

公开(公告)日：2008-11-11

申请号：US29278203

申请日：2007-03-21

Applicant: Ping-Yu Cheng ,  Chien-Chu Lu

Designer： Ping-Yu Cheng ,  Chien-Chu Lu

公开(公告)号：US20080258611A1

公开(公告)日：2008-10-23

申请号：US11953088

申请日：2007-12-10

Applicant: Ying-Ju Su ,  Chen-Ping Yu

Inventor： Ying-Ju Su ,  Chen-Ping Yu

IPC: H01L27/32 ,  B05D5/06

CPC classification number: H01L27/3211 ,  H01L2251/552

Abstract: An organic electroluminescent structure has a first electrode, a first primary color luminescent patterned layer disposed on the first electrode, a second primary color luminescent patterned layer disposed on the first electrode, a third primary color luminescent and electron transport layer disposed on the first electrode, the first primary color luminescent patterned layer and the second primary color luminescent patterned layer, and a second electrode disposed on the third primary color luminescent and electron transport layer.

Abstract translation: 有机电致发光结构具有第一电极，设置在第一电极上的第一原色发光图案层，设置在第一电极上的第二原色发光图案层，设置在第一电极上的第三原色发光和电子传输层， 第一原色发光图案层和第二原色发光图案层，以及设置在第三原色发光和电子传输层上的第二电极。

公开(公告)号：US20080247166A1

公开(公告)日：2008-10-09

申请号：US11878232

申请日：2007-07-23

Applicant: Wen-Ping Yu

Inventor： Wen-Ping Yu

IPC: G02B27/00

CPC classification number: G02B6/4204 ,  H01L33/483 ,  H01S5/02208 ,  H01S5/02284 ,  H01S5/02288

Abstract: A package structure for optical-electric element includes a first case and a second case. The first case is fixed on a substrate and the second case is assembled with the first case. The first case has an inner space for arranging a light emitting element and a driving element. The second case has a connecting ring for receiving an external component and a lens which is arranged in the bottom of the connecting ring for delivering the light emitting from the light emitting element to the external component.

Abstract translation: 用于光电元件的封装结构包括第一壳体和第二壳体。 第一种情况固定在基材上，第二种情况与第一种情况相组合。 第一壳体具有用于布置发光元件和驱动元件的内部空间。 第二壳体具有用于接收外部部件的连接环和布置在连接环的底部的透镜，用于将从发光元件发射的光发送到外部部件。