摘要:
A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.
摘要:
A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.
摘要:
A back light module including a frame, a light-guide plate and a light source is provided. The frame has a opening and a first surface and a second surface opposite to the first surface. The opening is extended from the first surface to the second surface of the frame, so that an inner surface of the opening is connected to the first surface and the second surface. At least a portion of the inner surface is slanted toward the inner of the opening. The light-guide plate is integrated with the frame and at least a portion of the opening is filled with the light-guide plate. The light-guide plate is tightly attached to the inner surface of the frame. The light source is adjacent to the light-guide plate.
摘要:
A backlight module including a frame, a light guide plate, a light source and a flexible printed circuit board is provided. The flexible printed circuit board includes a body, a light source carrying portion and a connecting portion. The body is bent, so a top edge and a bottom edge of the body are respectively disposed at a top side and a bottom side of the frame. The light source carrying portion carries the light source. The connecting portion has a first end and a second end. The first end is connected to a middle region of a bottom side of the light source carrying portion. The second end is connected to the bottom edge. The connecting portion is bent, such that the light source carrying portion is disposed on the top side of the frame and the light source is positioned at a side of the light guide plate.
摘要:
A backlight module including a frame, a light guide plate, a light source and a flexible printed circuit board is provided. The flexible printed circuit board includes a body, a light source carrying portion and a connecting portion. The body is bent, so a top edge and a bottom edge of the body are respectively disposed at a top side and a bottom side of the frame. The light source carrying portion carries the light source. The connecting portion has a first end and a second end. The first end is connected to a middle region of a bottom side of the light source carrying portion. The second end is connected to the bottom edge. The connecting portion is bent, such that the light source carrying portion is disposed on the top side of the frame and the light source is positioned at a side of the light guide plate.
摘要:
A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.
摘要:
A rotatable lighting apparatus includes a terminal, a base which includes a protruding part at a junction portion thereof, a rotatable lamp holder pivoted at the base and including a heat dissipation part and a lighting source, a passing-through device passing through the base and the rotatable lamp holder, and a bellow device connected to the base and the rotatable lamp holder. The heat dissipation part has a plurality of restricting trenches for fastening to the protruding part. When a tensile force is applied to the rotatable lamp holder, the rotatable lamp holder is capable of moving relative to the base along a moving-axis, so that the rotatable lamp holder is capable of rotating relative to the base. When the tensile force is removed, the rotatable lamp holder is fastened to one of the restricting trenches, so that the rotatable lamp holder is fixed to the base.
摘要:
A light emitting device including a light guide pillar, a reflective layer, and a point light source is provided. The light guide pillar has a light incident terminal surface and includes a first portion and a second portion located between the first portion and the light incident terminal surface. The reflective layer is disposed on the first portion and exposes a portion of the first portion. The reflective layer is not disposed on the second portion. The point light source emits light toward the light incident terminal surface.
摘要:
A composite cover sheet includes a first protective film, a first adhesive layer, a second protective film and a second adhesive layer. The first protective film has a first sticking part and a first movable part. The first protective film is attached to a base sheet through the first adhesive layer, and the first protective film is removed from the base sheet through the first movable part. The second protective film has a second sticking part and a second movable part, and the second protective film and the first protective film are separately formed. The second protective film is attached to the first protective film through the second adhesive layer, and the second protective film is removed from the first protective film through the second movable part.