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36 条记录 (耗时 0.02 秒)

    Method of producing electronic circuit and electronic circuit
    31.
    发明授权
    Method of producing electronic circuit and electronic circuit 有权
    电子电路和电子电路的制造方法

    公开(公告)号：US07067398B2

    公开(公告)日：2006-06-27

    申请号：US11103464

    申请日：2005-04-12

    申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    IPC分类号： H01L21/283

    CPC分类号： H05K3/246 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/242 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10S438/951 ,  H01L2924/00

    摘要： According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.

    摘要翻译： 根据本发明的一个实施方案，电子电路的制造方法包括：将至少由热固性树脂和细金属颗粒构成的第一含金属树脂颗粒和由至少由热塑性塑料构成的第二含金属树脂颗粒 树脂和细金属颗粒，以形成由第一含金属的树脂颗粒和由基材上的第二含金属的树脂颗粒组成的第二基底图案的第一基底图案; 在所述第一和第二基底图案上形成第一金属导体层; 通过向第一金属导体层提供电流通过电解电镀在第一金属导体层上形成第二金属导体层; 以及去除形成在第二基底图案上的第二基底图案和第一和第二金属导体层。

    Method and apparatus for applying viscous material
    33.
    发明授权
    Method and apparatus for applying viscous material 失效
    用于粘贴材料的方法和装置

    公开(公告)号：US06772937B2

    公开(公告)日：2004-08-10

    申请号：US09840073

    申请日：2001-04-24

    申请人： Toshinori Mimura ,  Hiroaki Onishi ,  Hiroshi Yamauchi ,  Toshiaki Yamauchi ,  Jun Shirai ,  Yoshiyuki Nagai ,  Muneyoshi Fujiwara

    发明人： Toshinori Mimura ,  Hiroaki Onishi ,  Hiroshi Yamauchi ,  Toshiaki Yamauchi ,  Jun Shirai ,  Yoshiyuki Nagai ,  Muneyoshi Fujiwara

    IPC分类号： B23K3102

    CPC分类号： H05K3/1233 ,  B23K3/0607 ,  H05K2203/0126

    摘要： By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material feeding device with a pressure smaller than the discharge pressure imparted by the discharge-pressure adjusting device.

    摘要翻译： 通过使用具有：用于粘性材料的储存室的应用单元; 用于粘性材料的排出孔设置成与储存室连通，其中用于将粘性材料供给到储存室的粘性材料供给装置联接到施加单元; 以及用于对存储在存储室中的粘性材料施加排出压力的排出压力调节装置，具有与施加对象或应用对象本身对应的开口的屏幕掩模和施加单元的排出孔与 彼此之间，应用单元和屏幕掩模或应用单元和应用对象相对于彼此移动，同时将排出压力赋予存储室中的粘性材料，并且将粘性材料施加到施加物体上 同时通过粘性材料供给装置一直用粘性材料补充储存室，其压力小于由排出压力调节装置施加的排出压力。

    Component collective and component collective feeding apparatus
    36.
    发明授权
    Component collective and component collective feeding apparatus 失效
    组件集体和组件集体供料装置

    公开(公告)号：US5931282A

    公开(公告)日：1999-08-03

    申请号：US832156

    申请日：1997-04-02

    申请人： Yoshio Maruyama ,  Shinji Kadoriku ,  Toshiaki Yamauchi ,  Naomi Kuromoto ,  Hiroshi Yamauchi

    发明人： Yoshio Maruyama ,  Shinji Kadoriku ,  Toshiaki Yamauchi ,  Naomi Kuromoto ,  Hiroshi Yamauchi

    IPC分类号： B65D43/24 ,  B65B15/04 ,  B65D85/86 ,  H05K13/02 ,  H05K13/04 ,  B65G17/36 ,  B65G17/46 ,  B65H5/28

    CPC分类号： H05K13/0417

    摘要： A component carrier assembly includes component holders each for holding a component therein and connected to one another in a form of a tape carrier. Each holder is provided with a cavity to accommodate the component, a closure for shutting an opening of the cavity, and a device for securing the lid structure in a closed position. An apparatus for feeding the component carrier includes a device for transferring the component carrier, a device for forcibly opening a closure of a component holder transferred to a predetermined position, and a device for forcibly closing the closure of the component holder after a component is removed from the cavity.

    摘要翻译： 部件载体组件包括各自用于将部件保持在其中并且以带状载体的形式彼此连接的部件保持器。 每个保持器设置有腔以容纳部件，用于关闭空腔的开口的封闭件以及用于将盖结构固定在关闭位置的装置。 用于馈送部件载体的装置包括用于传送部件载体的装置，用于强制地打开传递到预定位置的部件保持器的封闭件的装置，以及用于在部件移除之后强制关闭部件保持器的封盖的装置 从腔。