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    Method of producing electronic circuit and electronic circuit
    3.
    发明申请
    Method of producing electronic circuit and electronic circuit 有权
    电子电路和电子电路的制造方法

    公开(公告)号：US20050224931A1

    公开(公告)日：2005-10-13

    申请号：US11103464

    申请日：2005-04-12

    申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    IPC分类号： H05K3/18 ,  H01L21/48 ,  H01L23/495 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24

    CPC分类号： H05K3/246 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/242 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10S438/951 ,  H01L2924/00

    摘要： According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.

    摘要翻译： 根据本发明的一个实施方案，电子电路的制造方法包括：将至少由热固性树脂和细金属颗粒组成的第一含金属树脂颗粒和第二含金属树脂颗粒打印，所述第二含金属树脂颗粒由至少热塑性塑料 树脂和细金属颗粒，以形成由第一含金属的树脂颗粒和由基材上的第二含金属的树脂颗粒组成的第二基底图案的第一基底图案; 在所述第一和第二基底图案上形成第一金属导体层; 通过向第一金属导体层提供电流通过电解电镀在第一金属导体层上形成第二金属导体层; 以及去除形成在第二基底图案上的第二基底图案和第一和第二金属导体层。

    Method of producing electronic circuit and electronic circuit
    6.
    发明授权
    Method of producing electronic circuit and electronic circuit 有权
    电子电路和电子电路的制造方法

    公开(公告)号：US07067398B2

    公开(公告)日：2006-06-27

    申请号：US11103464

    申请日：2005-04-12

    申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

    IPC分类号： H01L21/283

    CPC分类号： H05K3/246 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/242 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10S438/951 ,  H01L2924/00

    摘要： According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.

    摘要翻译： 根据本发明的一个实施方案，电子电路的制造方法包括：将至少由热固性树脂和细金属颗粒构成的第一含金属树脂颗粒和由至少由热塑性塑料构成的第二含金属树脂颗粒 树脂和细金属颗粒，以形成由第一含金属的树脂颗粒和由基材上的第二含金属的树脂颗粒组成的第二基底图案的第一基底图案; 在所述第一和第二基底图案上形成第一金属导体层; 通过向第一金属导体层提供电流通过电解电镀在第一金属导体层上形成第二金属导体层; 以及去除形成在第二基底图案上的第二基底图案和第一和第二金属导体层。

    Method of producing electronic circuit, and electronic circuit substrate
    9.
    发明授权
    Method of producing electronic circuit, and electronic circuit substrate 有权
    电子电路的制造方法和电子电路基板

    公开(公告)号：US07486921B2

    公开(公告)日：2009-02-03

    申请号：US11017922

    申请日：2004-12-22

    申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

    发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

    IPC分类号： G03G15/20

    CPC分类号： H05K3/207 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K3/1266 ,  H05K3/246 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2203/0517

    摘要： According to one mode of the present invention, a method of producing an electronic circuit, comprising forming an integrated resin layer having a prescribed thickness by repeating a resin layer forming process a number of times so that resin layers are layered to be integrated with all the resin layers on a substrate, wherein the resin forming process comprises charging the surface of a photoconductor; forming an electrostatic latent image having a prescribed pattern on the surface of the charged photoconductor; forming a visible image by electrostatically attaching charged particles composed of resin on the surface of the photoconductor on which the electrostatic latent image is formed; transferring the visible image formed on the surface of the photoconductor and composed of the charged particles onto the substrate; and fixing said visible image transferred onto said substrate on said substrate to form the resin layer on said substrate, is provided.

    摘要翻译： 根据本发明的一个方式，一种电子电路的制造方法，其特征在于，通过重复树脂层形成工序多次来形成具有规定厚度的一体化树脂层，使树脂层层叠成与所有的 树脂层，其中所述树脂形成工艺包括对光电导体的表面进行充电; 在带电的感光体的表面上形成具有规定图案的静电潜像; 通过在其上形成有静电潜像的感光体的表面上静电附着由树脂构成的带电粒子来形成可见图像; 将形成在感光体的表面上的由带电粒子构成的可见图像转印到基板上; 并且将所述转印到所述基板上的所述可见图像固定在所述基板上，以在所述基板上形成树脂层。