Abstract:
A water treatment apparatus includes a plurality of meshed tubes made of synthetic yarn and provided with cilia; a plurality of tube stack cages containing the meshed tubes; and an aeration diffuser positioned between the tube stack cages and configured to provide air so that to-be-treated influent water moves to the tube stack cages. The hollow interior of the filter media, i.e. meshed tubes, enables water to move in any direction, and the high porosity maximizes the area for filtering of suspended solids and attachment of microorganisms. The resulting efficiency of removal of suspended solids and soluble organic material is far greater than conventional methods. Arrangement of diffusers in the middle of the reaction tank and between the tube stack cages and aeration by them result in perfect mixing in the reaction tank. The load of suspended solids and soluble organic materials is evenly distributed over the entire filer media.
Abstract:
A method for forming an isolation layer of a semiconductor device includes forming a trench in a substrate, forming a high-density plasma (HDP) oxide layer filling a portion of the trench, forming a spin-on-dielectric (SOD) oxide layer having a certain height over the HDP oxide layer, performing a thermal treatment, and forming an enhanced high-aspect-ratio process (eHARP) oxide layer filling another portion of the trench over the SOD oxide layer.
Abstract:
A resistance changing device includes a resistive layer of a hetero structure interposed between a lower electrode and an upper electrode, and including a plurality of resistive material layers, each having a different resistivity, stacked therein, wherein resistivities of the resistive material layers decrease from the lower electrode toward the upper electrode. Since the resistive layer has a hetero structure in which a plurality of resistive material layers, each having a different resistivity, are stacked in such a manner that the resistivity decreases as it goes from the lower electrode to the upper electrode, it is possible to improve the distributions of the set/reset voltage and the set/reset current, while reducing a reset current of a resistance changing device at the same time.
Abstract:
A resistive memory device includes a first conductive line on a substrate, a vertical selection diode comprising a nanowire or a nanotube and being arranged over the first conductive line, a resistive element including a resistive layer arranged over the vertical selection diode; and a second conductive line arranged over the resistive element.
Abstract:
A resistive memory device includes a lower electrode formed on a substrate, a resistive layer formed on the lower electrode, and an upper electrode on the resistive layer, wherein a lower portion of the upper electrode is narrower than an upper portion of the upper electrode.
Abstract:
A method for forming an isolation layer of a semiconductor device includes forming a trench in a substrate, forming a high-density plasma (HDP) oxide layer filling a portion of the trench, forming a spin-on-dielectric (SOD) oxide layer having a certain height over the HDP oxide layer, performing a thermal treatment, and forming an enhanced high-aspect-ratio process (eHARP) oxide layer filling another portion of the trench over the SOD oxide layer.
Abstract:
An apparatus and a method for managing a spam number in a mobile communication terminal are provided. The method includes determining a spam index for each of at least one phone number using a reception record by phone number, and determining spam number registration or non-registration for each phone number depending on the spam index.
Abstract:
A resistive memory device includes a first conductive line on a substrate, a vertical selection diode comprising a nanowire or a nanotube and being arranged over the first conductive line, a resistive element including a resistive layer arranged over the vertical selection diode; and a second conductive line arranged over the resistive element.
Abstract:
A method for fabricating a semiconductor device is provided. In the method, a bulb type recess is formed on a semiconductor substrate in an active region. A gate insulating film is formed over the semiconductor substrate and on a surface of the recess. A first polysilicon layer is formed over the gate insulating film. A silicon-on-dielectric (“SOD”) barrier film is formed on the first polysilicon layer at a lower part of the recess. A second polysilicon layer is formed over the semiconductor substrate and filling the recess. Impurity ions are injected into the second polysilicon layer. An annealing process is performed on the semiconductor substrate. A metal layer and a gate hard mask layer is formed and patterned over the second polysilicon layer to form a gate including the SOD barrier film.