公开(公告)号：US10397682B2

公开(公告)日：2019-08-27

申请号：US15273683

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H02J7/02 ,  H01R13/52 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20170094390A1

公开(公告)日：2017-03-30

申请号：US15273683

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  H04R1/28

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C11/24 ,  A45C13/005 ,  A45C13/02 ,  A45C13/1069 ,  A45C2011/001 ,  A45C2013/026 ,  B65D25/02 ,  B65D43/16 ,  F16B2001/0035 ,  H01R13/521 ,  H02J7/0044 ,  H02J7/0047 ,  H02J7/025 ,  H02J7/027 ,  H02J2007/0096 ,  H04B1/385 ,  H04B1/3888 ,  H04B5/0037 ,  H04M1/6033 ,  H04R1/02 ,  H04R1/1025 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2826 ,  H04R1/2857 ,  H04R1/345 ,  H04R5/033 ,  H04R9/025 ,  H04R9/06 ,  H04R2201/105 ,  H04R2420/07 ,  H04R2460/03 ,  H04R2460/09 ,  H04R2460/17

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.