Wearable devices using shape memory polymers

    公开(公告)号:US11812244B2

    公开(公告)日:2023-11-07

    申请号:US17271525

    申请日:2019-08-30

    Abstract: A wearable device including a body having one or more embedded electronic components, the body further including a thermoset material having a polymeric backbone with at least one urethane linkage and a glass transition temperature. At a first temperature that is lower than the glass transition temperature, the body has an original shape. When the body is heated to a second temperature that is higher than the glass transition temperature, the body is deformable from the original shape to a first shape and when the body is cooled to a third temperature that is lower than the glass transition temperature, the first shape is maintained. The body is further configured to transition from the first shape to the original shape when the body is heated from the third temperature to a fourth temperature that is higher than the glass transition temperature.

    Systems, Device Assemblies, and Methods for Achieving Acoustic Seal and Ingress Protection

    公开(公告)号:US20230319452A1

    公开(公告)日:2023-10-05

    申请号:US18041263

    申请日:2020-08-10

    Applicant: Google LLC

    CPC classification number: H04R1/1016 H04R1/1058 H04R2201/105

    Abstract: An acoustically-sealed electronic device assembly comprising a first housing component, a second component, and a sealing element. The first housing component may have a locking element. The second component may have a threaded channel extending at least partially along a perimeter of the second component. The threaded channel may be sized to receive the locking element. The sealing element may be positioned at an interface between the first housing component and the second component. The locking element of the first housing component may be moved from a first non-engaged position to a second engaged position within the threaded channel of the second component. The sealing element may be compressed by the first housing component and the second component to form an acoustic seal at the interface.

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