SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20210202362A1

    公开(公告)日:2021-07-01

    申请号:US16732149

    申请日:2019-12-31

    Abstract: A semiconductor package includes a core layer, a conductive interconnect and a semiconductor chip. The core layer has a top surface and a bottom surface opposite to the top surface. The conductive interconnect penetrates through the core layer. The conductive interconnect has a top surface and a bottom surface respectively exposed from the top surface and the bottom surface of the core layer. The semiconductor chip is disposed on the top surface of the core layer. The semiconductor chip includes a conductive pad, and the top surface of the conductive interconnect directly contacts the conductive pad.

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190279924A1

    公开(公告)日:2019-09-12

    申请号:US15917509

    申请日:2018-03-09

    Abstract: A semiconductor package structure includes a first patterned conductive layer including a first conductive pad, a second conductive pad and a first conductive trace disposed between the first conductive pad and the second first conductive pad. The first conductive pad defines a recess. The semiconductor package structure further includes a second patterned conductive layer including a third conductive pad. The semiconductor package structure further includes a first stud bump electrically connecting the first conductive pad of the first patterned conductive layer to the third conductive pad of the second patterned conductive layer. The semiconductor package structure further includes a first encapsulation layer disposed between the first patterned conductive layer and the second patterned conductive layer.

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