公开(公告)号：US09757944B2

公开(公告)日：2017-09-12

申请号：US15305723

申请日：2015-05-19

申请人： Daisuke Takagi ,  Hisashi Habashi ,  Tomoyuki Aratani ,  Tatsuya Sameshima ,  Ryo Ogawa ,  Takuya Matsuda

发明人： Daisuke Takagi ,  Hisashi Habashi ,  Tomoyuki Aratani ,  Tatsuya Sameshima ,  Ryo Ogawa ,  Takuya Matsuda

IPC分类号： B41J2/14

CPC分类号： B41J2/1433 ,  B41J2/14274 ,  B41J2/1606 ,  B41J2202/03 ,  C08G59/245 ,  C08G59/5073 ,  C08G59/66

摘要： Provided is a liquid jet head, including a flow path including a first member, a resin layer, and a second member, wherein the resin layer contains a cured product of a resin composition containing an epoxy compound represented by General Formula (1), a polythiol compound having 2 or more thiol groups in a molecule thereof, and a specific imidazole compound, where in General Formula (1), L is an integer of 0 or greater but less than 3, m is a positive number of 0.1 or greater but less than 50, R1 represents any one of a hydrogen atom, and an alkyl group having 1 to 4 carbon atoms, and R2 represents a substituent represented by a formula below where R3 and R4 each represent any one of hydrogen atom, and a non-substituted or fluorine-substituted methyl group, and n is an integer of 4 to 12.

公开(公告)号：US08240737B2

公开(公告)日：2012-08-14

申请号：US12646041

申请日：2009-12-23

申请人： Satoshi Takaya ,  Masafumi Inoue ,  Shinichi Tanba ,  Daisuke Takagi ,  Masahiro Koga ,  Yoshitaka Nishikawa ,  Takao Kawabata ,  Dave Reinke

发明人： Satoshi Takaya ,  Masafumi Inoue ,  Shinichi Tanba ,  Daisuke Takagi ,  Masahiro Koga ,  Yoshitaka Nishikawa ,  Takao Kawabata ,  Dave Reinke

IPC分类号： B62D25/00

CPC分类号： B60N2/36 ,  B60N2/3011 ,  B60N2/3065 ,  B60N2002/363

摘要： A pick-up style utility vehicle with an expandable cargo bed, including a front seat, a rear seat, a stationary bottom plate serving as a bottom face of the cargo bed, an expansion bottom plate for expanding the bottom face of the cargo bed, and a shared linkage mechanism for holding the rear seat at a use position where the rear seat is positioned on the upper side of the stationary bottom plate and a shunting position where the rear seat is shunted into a rear leg room provided in front of and below the stationary bottom plate. The shared linkage mechanism also holds the expansion bottom plate at a storage position where the expansion bottom plate is above the stationary bottom plate and an expansion position where the expansion bottom plate is positioned over the leg room.

摘要翻译： 一种具有可膨胀货床的拾取式多用途车，包括前排座椅，后座椅，用作货物底面的底面的固定底板，用于扩大货物底面的膨胀底板， 以及共享连杆机构，用于将后座椅保持在后座椅位于固定底板上侧的使用位置和后座椅分流到设在前后的后腿房间中的分流位置 固定底板。 共享连接机构还将膨胀底板保持在膨胀底板位于固定底板上方的储存位置和膨胀底板位于腿部空间上方的膨胀位置。

公开(公告)号：US07819965B2

公开(公告)日：2010-10-26

申请号：US11866107

申请日：2007-10-02

申请人： Atsuya Yoshinaka ,  Daisuke Takagi

发明人： Atsuya Yoshinaka ,  Daisuke Takagi

IPC分类号： C09D5/25

CPC分类号： C23C18/1208 ,  C09D1/00 ,  C23C18/127 ,  C23C18/1283 ,  H01G4/1218 ,  H01G9/2031 ,  H01L21/31691 ,  H01L28/40 ,  Y02E10/542 ,  Y02P70/521

摘要： A coating formulation contains the following components (A), (B) and (C): (A) an organic acid-titanium compound having at least one titanium atom and at least one C2-12 aliphatic organic acid residual group as essential constituents and having no constituent other than the essential constituents, (B) fine particles of a titanate-based compound, said fine particles having an average particle size of from 10 to 100 nm, and (C) an organic solvent. A content of the components (A) is from 0.1 to 1.5 mol/kg in terms of titanium atoms, and a content of the component (B) is from 0.1 to 1.5 mol/kg in terms of titanium atoms. A production process for a titanate-based ceramic film, which makes use of the coating formulation, is also disclosed.

摘要翻译： 涂料配方含有以下组分（A），（B）和（C）：（A）具有至少一个钛原子和至少一个C 2-12脂族有机酸残基作为必要组分的有机酸 - 钛化合物，以及 不含有必要成分的成分，（B）钛酸酯系化合物的微粒，所述微粒的平均粒径为10〜100nm，（C）有机溶剂。 组分（A）的含量以钛原子计为0.1至1.5mol / kg，组分（B）的含量以钛原子计为0.1至1.5mol / kg。 还公开了利用涂料配方的钛酸酯系陶瓷膜的制造方法。

公开(公告)号：US20080090006A1

公开(公告)日：2008-04-17

申请号：US11866107

申请日：2007-10-02

申请人： Atsuya YOSHINAKA ,  Daisuke Takagi

发明人： Atsuya YOSHINAKA ,  Daisuke Takagi

IPC分类号： B05D3/02

CPC分类号： C23C18/1208 ,  C09D1/00 ,  C23C18/127 ,  C23C18/1283 ,  H01G4/1218 ,  H01G9/2031 ,  H01L21/31691 ,  H01L28/40 ,  Y02E10/542 ,  Y02P70/521

摘要： A coating formulation contains the following components (A), (B) and (C): (A) an organic acid-titanium compound having at least one titanium atom and at least one C2-12 aliphatic organic acid residual group as essential constituents and having no constituent other than the essential constituents, (B) fine particles of a titanate-based compound, said fine particles having an average particle size of from 10 to 100 nm, and (C) an organic solvent. A content of the components (A) is from 0.1 to 1.5 mol/kg in terms of titanium atoms, and a content of the component (B) is from 0.1 to 1.5 mol/kg in terms of titanium atoms. A production process for a titanate-based ceramic film, which makes use of the coating formulation, is also disclosed.

摘要翻译： 涂料制剂含有下列组分（A），（B）和（C）：（A）具有至少一个钛原子和至少一个C 2-12脂族基团的有机酸 - 钛化合物 有机酸残基作为必要成分，不含有必要成分的成分，（B）钛酸酯系化合物的微粒，所述微粒的平均粒径为10〜100nm，（C）有机酸残基 溶剂。 组分（A）的含量以钛原子计为0.1至1.5mol / kg，组分（B）的含量以钛原子计为0.1至1.5mol / kg。 还公开了利用涂料配方的钛酸酯系陶瓷膜的制造方法。

公开(公告)号：US20080067679A1

公开(公告)日：2008-03-20

申请号：US11663351

申请日：2005-09-22

申请人： Daisuke Takagi ,  Xinming Wang ,  Akira Owatari ,  Akira Fukunaga ,  Akihiko Tashiro

发明人： Daisuke Takagi ,  Xinming Wang ,  Akira Owatari ,  Akira Fukunaga ,  Akihiko Tashiro

IPC分类号： H01L23/52 ,  H01B1/02 ,  H01L21/4763

CPC分类号： H01L23/53238 ,  C23C18/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has interconnects protected with an alloy film having a minimum thickness necessary for producing the effect of preventing diffusion of oxygen, copper, etc., formed more uniformly over an entire surface of a substrate with less dependency to the interconnect pattern of the substrate. The semiconductor device includes, embedded interconnects, formed by filling an interconnect material into interconnect recesses formed in an electric insulator on a substrate, and an alloy film, containing 1 to 9 atomic % of tungsten or molybdenum and 3 to 12 atomic % of phosphorus or boron, formed by electroless plating on at least part of the embedded interconnects.

摘要翻译： 半导体器件具有被合金膜保护的互连，所述合金膜具有为了产生防止在衬底的整个表面上更均匀地形成的氧，铜等的扩散所必需的最小厚度，而对衬底的互连图案的依赖性较小 。 半导体器件包括通过将互连材料填充到形成在基板上的电绝缘体中的互连凹槽中形成的嵌入式互连，以及包含1至9原子％的钨或钼和3至12原子％的磷的合金膜， 硼，通过在至少部分嵌入式互连件上的无电镀形成。

公开(公告)号：US20070228569A1

公开(公告)日：2007-10-04

申请号：US11783186

申请日：2007-04-06

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

IPC分类号： H01R43/00 ,  H01L23/48

CPC分类号： H01L21/76849 ,  H01L21/76819 ,  H01L21/7685 ,  Y10S438/976 ,  Y10T29/41

摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production of multi-level interconnects, improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and enhance the reliability of the device. The interconnects-forming method, includes providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.

公开(公告)号：US20070171035A1

公开(公告)日：2007-07-26

申请号：US10590218

申请日：2005-11-07

申请人： Takanobu Ikari ,  Yoshinori Ohwada ,  Yoshinori Furuno ,  Shinji Akino ,  Daisuke Takagi

发明人： Takanobu Ikari ,  Yoshinori Ohwada ,  Yoshinori Furuno ,  Shinji Akino ,  Daisuke Takagi

IPC分类号： B60Q1/00 ,  G01L3/26

CPC分类号： F02D41/1446 ,  E02F9/226 ,  E02F9/24 ,  E02F9/26 ,  F02D41/008 ,  F02D41/221 ,  Y02T10/40

摘要： An engine protection system for a construction machine can individually diagnose the exhaust temperature specific to each cylinder of an engine corresponding to an engine revolution speed in order to find an abnormal condition of each engine cylinder in advance. A revolution speed sensor 14 detects revolution speed of an engine mounted in the construction machine and a plurality, e.g., 16, cylinder temperature sensors 20a-20p detect exhaust temperatures of respective cylinders of the engine. A data recording unit 26 and a display controller 24 store the detected engine revolution speed and the detected exhaust temperatures of the respective cylinders. Trend data, which is produced based on the stored data, is sent to an office via a portable terminal and the display controller 24 outputs a signal for playing back and displaying snapshots based on the stored data to a display unit 23 disposed in the cab 5.

摘要翻译： 用于施工机械的发动机保护系统可以单独地诊断与发动机转速相对应的发动机的每个气缸的排气温度，以便事先找到每个发动机气缸的异常状况。 转速传感器14检测安装在建筑机械中的发动机的转速，并且多个例如16个气缸温度传感器20a- 20p检测发动机的各个气缸的排气温度。 数据记录单元26和显示控制器24存储检测到的发动机转速和检测到的气缸的排气温度。 基于所存储的数据产生的趋势数据经由便携式终端被发送到办公室，并且显示控制器24根据所存储的数据将显示快照的信号输出到设置在驾驶室5中的显示单元23 。

公开(公告)号：US07217653B2

公开(公告)日：2007-05-15

申请号：US10896014

申请日：2004-07-22

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

IPC分类号： H01L21/4763

CPC分类号： H01L21/76849 ,  H01L21/76819 ,  H01L21/7685 ,  Y10S438/976 ,  Y10T29/41

摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production of multi-level interconnects, improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and enhance the reliability of the device. The interconnects-forming method, includes providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.

摘要翻译： 本发明提供一种互连形成方法和互连形成装置，其能够最小化蚀刻中的处理精度的降低，使在多层互连的制造中形成互连凹槽的光曝光处理最小化，提高电镀迁移电阻 互连，而不损害互连的电性能，并且增强器件的可靠性。 互连形成方法包括在形成在基板的表面中的绝缘膜中提供互连凹槽; 在互连凹槽中嵌入互连材料，同时在绝缘膜的表面上形成互连材料的金属膜; 除去互连凹部中的金属材料以外的多余的金属材料，使基板表面变平，从而形成互连件; 在互连的暴露表面上选择性地形成导电材料的第一保护膜; 在具有如此形成的第一保护膜的基板的表面上形成第二保护膜; 在具有如此形成的第二保护膜的基板的表面上形成层间绝缘膜; 并平坦化层间绝缘膜的表面。

公开(公告)号：US20060057839A1

公开(公告)日：2006-03-16

申请号：US11219777

申请日：2005-09-07

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga ,  Akira Owatari

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga ,  Akira Owatari

IPC分类号： H01L21/4763 ,  H01L21/20

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1669 ,  C23C18/32 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76874

摘要： A metal film-forming method of the present invention can form a metal film having different film qualities in the thickness direction, in a continuous manner using a single processing solution. The metal film-forming method including: providing a substrate having embedded interconnects formed in interconnect recesses provided in a surface of the substrate; and forming a metal film, having different film qualities in the thickness direction, on surfaces of the interconnects in a continuous manner by changing the flow state of a processing solution relative to the surface of the substrate while keeping the surface of the substrate in contact with the processing solution.

公开(公告)号：US20050064702A1

公开(公告)日：2005-03-24

申请号：US10896014

申请日：2004-07-22

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L21/4763

CPC分类号： H01L21/76849 ,  H01L21/76819 ,  H01L21/7685 ,  Y10S438/976 ,  Y10T29/41

摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, light exposure or the like processing for the formation of interconnect recesses in the production of multi-level interconnects, can improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and can enhance the reliabilityof the device. The interconnects-formingmethod, including: providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.

摘要翻译： 本发明提供一种互连形成方法和互连形成装置，其可以最小化在制造多层互连中形成互连凹槽的蚀刻，曝光等处理中的处理精度的降低， 互连的电迁移电阻，而不损害互连的电性能，并且可以提高器件的可靠性。 所述互连形成方法包括：在形成在基板的表面中的绝缘膜中提供互连凹槽; 在互连凹槽中嵌入互连材料，同时在绝缘膜的表面上形成互连材料的金属膜; 除去互连凹部中的金属材料以外的多余的金属材料，使基板表面变平，从而形成互连件; 在互连的暴露表面上选择性地形成导电材料的第一保护膜; 在具有如此形成的第一保护膜的基板的表面上形成第二保护膜; 在具有如此形成的第二保护膜的基板的表面上形成层间绝缘膜; 并平坦化层间绝缘膜的表面。