公开(公告)号：US11450999B2

公开(公告)日：2022-09-20

申请号：US17023013

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Eric T. SooHoo ,  Mahmoud R. Amini ,  Daniel R. Bloom ,  Sean T. McIntosh ,  Tian Shi Li ,  Jared M. Kole ,  Jason Joseph LeBlanc ,  Colin M. Ely ,  Peter J. Cameron ,  Michael A. Kinney ,  Eric S. Jol ,  Edward Siahaan ,  Robert D. Zupke ,  Rohan Gupta ,  Jordan J. Francis

IPC: H01R39/12 ,  H01R12/61 ,  H01R12/77 ,  H01R13/422

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

公开(公告)号：US20220086551A1

公开(公告)日：2022-03-17

申请号：US17023246

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC: H04R1/10

Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

公开(公告)号：US20220085560A1

公开(公告)日：2022-03-17

申请号：US17023013

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Eric T. SooHoo ,  Mahmoud R. Amini ,  Daniel R. Bloom ,  Sean T. McIntosh ,  Tian Shi Li ,  Jared M. Kole ,  Jason Joseph LeBlanc ,  Colin M. Ely ,  Peter J. Cameron ,  Michael A. Kinney ,  Eric S. Jol ,  Edward Siahaan ,  Robert D. Zupke ,  Rohan Gupta ,  Jordan J. Francis

IPC: H01R39/12 ,  H01R12/77 ,  H01R12/61 ,  H01R13/422

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

公开(公告)号：US11102567B2

公开(公告)日：2021-08-24

申请号：US16362399

申请日：2019-03-22

Applicant: Apple Inc.

Inventor： Michael E. Leclerc ,  Brett W. Degner ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniel R. Bloom ,  Daniele de Iuliis ,  Christopher J. Stringer ,  Sung-Ho Tan ,  Markus Diebel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20210029436A1

公开(公告)日：2021-01-28

申请号：US17071819

申请日：2020-10-15

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Christopher J. Stringer ,  Daniel R. Bloom ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniele de luliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R1/10 ,  H04R5/033 ,  H04R3/04 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280794A1

公开(公告)日：2020-09-03

申请号：US16878561

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Mike B. Minerbi ,  Edward Siahaan ,  Benjamin A. Shaffer ,  Eugene A. Whang ,  Miikka O. Tikander ,  Derek W. Wright ,  Jared M. Kole ,  Esge B. Andersen ,  Daniel R. Bloom ,  Edwin J. Corona Aparicio

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280785A1

公开(公告)日：2020-09-03

申请号：US16878547

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang

IPC: H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280784A1

公开(公告)日：2020-09-03

申请号：US16878536

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jason J. LeBlanc ,  Daniel R. Bloom ,  Edward Siahaan ,  Phillip Qian ,  Lee M. Panecki ,  Eugene Antony Whang ,  Jared M. Kole ,  Audrey L. Sheng ,  Tian Shi Li

IPC: H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20240348960A1

公开(公告)日：2024-10-17

申请号：US18629801

申请日：2024-04-08

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1008 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11985462B2

公开(公告)日：2024-05-14

申请号：US17878767

申请日：2022-08-01

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1008 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.