公开(公告)号：US20250114899A1

公开(公告)日：2025-04-10

申请号：US18481576

申请日：2023-10-05

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Jeonghoon Oh ,  Ekaterina A. Mikhaylichenko ,  Andrew J. Nagengast ,  Takashi Fujikawa ,  Kuen-Hsiang Chen ,  Jay Gurusamy ,  Steven M. Zuniga ,  Huanbo Zhang

IPC: B24B37/10 ,  B24B37/34

Abstract: A chemical mechanical polishing apparatus includes an inner platen to support an inner polishing pad, aan annular outer platen to support an outer polishing pad, a carrier head to hold a substrate, a first motor to rotate the inner platen about a vertical axis at a first rotation rate, and a second motor to rotate the outer platen about the vertical axis at a second rotation rate. The outer polishing pad coaxially surrounds the inner platen, and an outer edge of the inner platen and an inner edge of the outer platen are separated by a gap.

公开(公告)号：US11945073B2

公开(公告)日：2024-04-02

申请号：US16711369

申请日：2019-12-11

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

IPC: B24B37/32 ,  B24B37/005

CPC classification number: B24B37/32 ,  B24B37/005

Abstract: A carrier head for chemical mechanical polishing includes a base assembly and a membrane assembly connected to the base assembly. The membrane assembly includes a membrane support, an inner membrane secured to the membrane support, wherein the inner membrane forms a plurality of individually pressurizable inner chambers between an upper surface of the membrane and the membrane support, and an outer membrane secured to the membrane support and extending below the inner membrane, the outer membrane having an inner surface and an outer surface, wherein the outer membrane defines a lower pressurizable chamber between the inner surface of the outer membrane and a lower surface of the inner membrane, wherein the inner surface is positioned for contact by a lower surface of the inner membrane upon pressurization of one or more of the plurality of chambers, and wherein the outer surface is configured to contact a substrate.

公开(公告)号：US20240042574A1

公开(公告)日：2024-02-08

申请号：US18492025

申请日：2023-10-23

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

IPC: B24B37/32 ,  B24B37/005

CPC classification number: B24B37/32 ,  B24B37/005

Abstract: A carrier head for chemical mechanical polishing includes a base assembly and a membrane assembly connected to the base assembly. The membrane assembly includes a membrane support, an inner membrane secured to the membrane support, wherein the inner membrane forms a plurality of individually pressurizable inner chambers between an upper surface of the membrane and the membrane support, and an outer membrane secured to the membrane support and extending below the inner membrane, the outer membrane having an inner surface and an outer surface, wherein the outer membrane defines a lower pressurizable chamber between the inner surface of the outer membrane and a lower surface of the inner membrane, wherein the inner surface is positioned for contact by a lower surface of the inner membrane upon pressurization of one or more of the plurality of chambers, and wherein the outer surface is configured to contact a substrate.

公开(公告)号：US11673226B2

公开(公告)日：2023-06-13

申请号：US16435302

申请日：2019-06-07

Applicant: Applied Materials, Inc.

Inventor： Andrew J. Nagengast ,  Christopher Heung-Gyun Lee ,  Thomas Li ,  Anand N. Iyer ,  Jie Diao ,  Huanbo Zhang ,  Erik S. Rondum ,  Wei-Cheng Lee ,  Jeonghoon Oh

IPC: B24B37/32 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687

CPC classification number: B24B37/32 ,  H01L21/30625 ,  H01L21/67063 ,  H01L21/67092 ,  H01L21/68735

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.

公开(公告)号：US11344991B2

公开(公告)日：2022-05-31

申请号：US16799688

申请日：2020-02-24

Applicant: Applied Materials, Inc.

Inventor： Andrew J. Nagengast ,  Steven M. Zuniga

IPC: B24B37/32

Abstract: A carrier head for chemical mechanical polishing includes a base, an actuator, a substrate mounting surface, and a retainer. The retainer includes an inner section and an outer section connected by a flexure. A bottom of the inner section of the retainer provides an inner portion of a lower surface configured to contact a polishing pad. An inner surface of the inner section extends upwardly from an inner edge of the lower surface to circumferentially surround the substrate mounting surface. The inner section of the retainer is positioned to receive a controllable load from the actuator and is vertically movable relative to the base. A bottom of the outer section of the retainer provides an outer portion of the lower surface. The outer section of the retainer is vertically fixed to the base. The inner section of the retainer is vertically movable relative to the outer section of the retainer.

公开(公告)号：US20210402546A1

公开(公告)日：2021-12-30

申请号：US17355024

申请日：2021-06-22

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Andrew J. Nagengast ,  Justin Ho Kuen Wong

IPC: B24B37/005 ,  B24B37/10 ,  B24B49/10 ,  B24B29/00

Abstract: A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carrier plate. The first flexible membrane has an upper surface and having a lower surface that provides a substrate mounting surface. The piezoelectric actuators are positioned above the first flexible membrane so as to independently adjust compressive pressure on the upper surface of the first flexible membrane.

公开(公告)号：US10322492B2

公开(公告)日：2019-06-18

申请号：US15658294

申请日：2017-07-24

Applicant: Applied Materials, Inc.

Inventor： Andrew J. Nagengast ,  Christopher Heung-Gyun Lee ,  Thomas Li ,  Anand N. Iyer ,  Jie Diao ,  Huanbo Zhang ,  Erik S. Rondum ,  Wei-Cheng Lee ,  Jeonghoon Oh

IPC: B24B37/32 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.

公开(公告)号：US20160151879A1

公开(公告)日：2016-06-02

申请号：US15018443

申请日：2016-02-08

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Steven M. Zuniga ,  Andrew J. Nagengast ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

IPC: B24B37/32

CPC classification number: H01L21/3212 ,  B24B37/04 ,  B24B37/10 ,  B24B37/32 ,  B24B41/06 ,  H01L21/304 ,  H01L21/30625

Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.

Abstract translation: 保持环包括大致环形体。 主体包括顶表面，底表面，外表面和外表面，外表面在外顶部周边处连接到顶表面，底表面连接到外底边周边，内表面在内顶部周边连接到顶表面， 底部表面处于内底部周边。 内表面包括七个或更多个平面。 相邻的平面小平面连接在角落处。 内底部周边包括连接在拐角处的平面的平直边缘。

公开(公告)号：US20250114896A1

公开(公告)日：2025-04-10

申请号：US18481513

申请日：2023-10-05

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Jeonghoon Oh ,  Ekaterina A. Mikhaylichenko ,  Andrew J. Nagengast ,  Takashi Fujikawa ,  Kuen-Hsiang Chen ,  Jay Gurusamy ,  Steven M. Zuniga ,  Huanbo Zhang

IPC: B24B37/005 ,  B24B37/10 ,  B24B37/20

Abstract: A chemical mechanical polishing apparatus includes: an inner platen to support an inner polishing pad; an annular outer platen to support an outer polishing pad; a carrier head to hold a substrate; one or more motors to rotate the inner platen about a vertical axis at a first rotation rate and to rotate the outer platen about the vertical axis at a second rotation rate; and a controller configured to select values for multiple control parameters to minimize a difference between a target removal profile and an expected removal profile, the multiple control parameters including a first parameter representing a difference in rotational speeds between the inner and outer platens. The outer polishing pad can coaxially surround the inner platen, and an outer edge of the inner platen and an inner edge of the outer platen can be separated by a gap.

公开(公告)号：US20250108473A1

公开(公告)日：2025-04-03

申请号：US18376282

申请日：2023-10-03

Applicant: Applied Materials, Inc.

Inventor： Andrew J. Nagengast ,  Jeonghoon Oh ,  Kuen-Hsiang Chen ,  Steven M. Zuniga ,  Takashi Fujikawa ,  Jay Gurusamy ,  Ekaterina A. Mikhaylichenko ,  Eric Lau ,  Huanbo Zhang ,  Welarumage Ravin Fernando

IPC: B24B37/005 ,  B24B37/04 ,  B24B37/24 ,  B24B49/16

Abstract: Chemical mechanical polishing system and method include a substrate is loaded into a carrier head having a housing having an upper carrier body and a lower carrier body, and a membrane assembly beneath the lower carrier body. A space between the lower carrier body and the membrane assembly defines a pressurizable chamber, a distance from a sensor in the lower carrier body to the membrane assembly is measured, and pressure in the pressurizable chamber is controlled based on the measured distances to maintain a consistent total downforce on the membrane assembly as the distance between the sensor and the membrane assembly changes.