公开(公告)号：US09171718B2

公开(公告)日：2015-10-27

申请号：US14175527

申请日：2014-02-07

Applicant: Applied Materials, Inc.

Inventor： Errol Antonio C. Sanchez ,  Yi-Chiau Huang

IPC: H01L21/02 ,  H01L21/3065

CPC classification number: H01L21/02661 ,  H01L21/0245 ,  H01L21/02452 ,  H01L21/02532 ,  H01L21/02535 ,  H01L21/02576 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/3065

Abstract: Methods of preparing a clean surface of germanium tin or silicon germanium tin layers for subsequent deposition are provided. An overlayer of Ge, doped Ge, another GeSn or SiGeSn layer, a doped GeSn or SiGeSn layer, an insulator, or a metal can be deposited on a prepared GeSn or SiGeSn layer by positioning a substrate with an exposed germanium tin or silicon germanium tin layer in a processing chamber, heating the processing chamber and flowing a halide gas into the processing chamber to etch the surface of the substrate using either thermal or plasma assisted etching followed by depositing an overlayer on the substantially oxide free and contaminant free surface. Methods can also include the placement and etching of a sacrificial layer, a thermal clean using rapid thermal annealing, or a process in a plasma of nitrogen trifluoride and ammonia gas.

Abstract translation: 提供了制备用于后续沉积的锗锡或硅锗锡层的洁净表面的方法。 通过用暴露的锗锡或硅锗锡定位衬底，可以在制备的GeSn或SiGeSn层上沉积Ge，掺杂Ge，另一GeSn或SiGeSn层，掺杂GeSn或SiGeSn层，绝缘体或金属的覆盖层 层，加热处理室并使卤化物气体流入处理室，以使用热或等离子体辅助蚀刻来蚀刻衬底的表面，随后在基本上无氧化物和无污染物的表面上沉积覆盖层。 方法还可以包括牺牲层的放置和蚀刻，使用快速热退火的热清洁，或三氟化氮和氨气的等离子体中的工艺。

公开(公告)号：US20150050800A1

公开(公告)日：2015-02-19

申请号：US14269417

申请日：2014-05-05

Applicant: Applied Materials, Inc.

Inventor： Adam Brand ,  Bingxi Wood ,  Errol Sanchez ,  Yihwan Kim ,  Yi-Chiau Huang ,  John Boland

IPC: H01L21/02 ,  H01L29/66

CPC classification number: H01L21/0262 ,  H01L29/66795

Abstract: Methods of forming a fin structure for a field effect transistor are described. The methods may include the operations of patterning a mandrel on a surface of a substrate, and depositing an epitaxial layer of high-mobility channel material over exposed surfaces of the patterned mandrel. The epitaxial layer leaves a gap between adjacent columns of the patterned mandrel, and a dielectric material may be deposited in the gap between the adjacent columns of the patterned mandrel. The methods may also include planarizing the epitaxial layer to form a planarized epitaxial layer and exposing the columns of the patterned mandrel, and etching at least a portion of the exposed columns of the patterned mandrel and the dielectric material to expose at least a portion of the planarized epitaxial layer that forms the fin structure.

Abstract translation: 描述形成场效应晶体管的鳍结构的方法。 所述方法可以包括将芯棒图案化在衬底的表面上，以及在图案化心轴的暴露表面上沉积高迁移率沟道材料外延层的操作。 外延层在图案化心轴的相邻列之间留下间隙，并且介电材料可以沉积在图案化心轴的相邻列之间的间隙中。 所述方法还可以包括平坦化外延层以形成平坦化的外延层并暴露图案化心轴的列，以及蚀刻图案化心轴和电介质材料的暴露的柱的至少一部分，以暴露出至少一部分 形成翅片结构的平坦化外延层。