TFT-LCD ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
    35.
    发明申请
    TFT-LCD ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    TFT-LCD阵列基板及其制造方法

    公开(公告)号:US20140220747A1

    公开(公告)日:2014-08-07

    申请号:US14251987

    申请日:2014-04-14

    Abstract: An embodiment of the invention relates to a TFT-LCD array substrate comprising a substrate, a gate line and a data line formed on the substrate, a pixel electrode and a thin film transistor formed in a pixel region defined by the gate line and the data line, wherein the thin film transistor comprises a gate electrode, a source electrode, and a transparent drain electrode, and the transparent drain electrode is electrically connected with the pixel electrode.

    Abstract translation: 本发明的实施例涉及一种TFT-LCD阵列基板,包括基板,栅极线和形成在基板上的数据线,形成在由栅极线和数据所限定的像素区域中的像素电极和薄膜晶体管 线,其中所述薄膜晶体管包括栅电极,源电极和透明漏电极,并且所述透明漏电极与所述像素电极电连接。

    CHIP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS

    公开(公告)号:US20250143033A1

    公开(公告)日:2025-05-01

    申请号:US18712703

    申请日:2023-03-29

    Abstract: A chip structure and a method for manufacturing the same, and a display apparatus. The chip structure includes a chip wafer unit and a color conversion unit disposed on a light exit side of the chip wafer unit. The color conversion unit includes a base substrate; the base substrate includes a body portion and an edge portion surrounding the body portion; the edge portion includes original layers and modified layers alternately arranged along a first direction; and in the edge portion, layers located on outermost two sides in the first direction are both original layers, the first direction being perpendicular to a surface of the base substrate away from the chip wafer unit. A light reflectivity of the original layers and a light reflectivity of the modified layers are different.

    CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME, DISPLAY SUBSTRATE, AND DISPLAY APPARATUS

    公开(公告)号:US20250120240A1

    公开(公告)日:2025-04-10

    申请号:US18729170

    申请日:2023-01-03

    Abstract: A chip structure includes a chip wafer unit and a color conversion substrate unit disposed on a light-exit side of the chip wafer unit. The chip wafer unit includes a light-emitting layer and an electrode layer sequentially stacked in a first direction. The light-emitting layer includes light-emitting portions. Each light-emitting portion includes at least two light-emitting sub-portions. The electrode layer includes a cathode, connection electrodes, and anodes in one-to-one correspondence with the light-emitting portions. The at least two light-emitting sub-portions are sequentially connected through at least one connection electrode. Among the at least two light-emitting sub-portions sequentially connected, a first one light-emitting sub-portion is a first selected light-emitting sub-portion, and a last one light-emitting sub-portion is a second selected light-emitting sub-portion. The first selected light-emitting sub-portion is connected to the cathode, and the second selected light-emitting sub-portion is connected to an anode.

    SYNCHRONIZATION METHOD AND APPARATUS

    公开(公告)号:US20250007661A1

    公开(公告)日:2025-01-02

    申请号:US18546435

    申请日:2022-11-16

    Abstract: A synchronization method includes: acquiring radio frame data from a sending node; performing a search of a synchronization signal in the radio frame data in the radio frame to determine location information of the synchronization signal in the radio frame data; determining a time calibration parameter of the receiving node according to the location information of the synchronization signal and a frame structure of the radio frame; and calibrating a local clock of the receiving node according to the time calibration parameter and the local clock of the receiving node, so that the receiving node is synchronized with the sending node.

    DISPLAY PANEL AND DISPLAY APPARATUS

    公开(公告)号:US20240423014A1

    公开(公告)日:2024-12-19

    申请号:US18818213

    申请日:2024-08-28

    Abstract: A display panel includes a light-emitting substrate, an opposite substrate, and an intermediate layer assembly between the light-emitting substrate and the opposite substrate. The light-emitting substrate has a light-emitting surface configured to allow light to be emitted from, and the light emitted from the light-emitting surface is directed to the opposite substrate. The intermediate layer assembly includes a thin film encapsulation layer, a filler layer, and an overcoat that are sequentially stacked in a pointing direction vertically pointing from the light-emitting substrate to the opposite substrate. The thin film encapsulation layer includes at least two encapsulation sub-layers that are stacked in the pointing direction. In the pointing direction, refractive indexes of the encapsulation sub-layers gradually increase. A refractive index of the overcoat is higher than a refractive index of the filler layer.

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